KR20200124700A - 적층형 전자 부품용 수지 조성물, 드라이 필름, 경화물, 적층형 전자 부품 및 프린트 배선판 - Google Patents
적층형 전자 부품용 수지 조성물, 드라이 필름, 경화물, 적층형 전자 부품 및 프린트 배선판 Download PDFInfo
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- KR20200124700A KR20200124700A KR1020207026871A KR20207026871A KR20200124700A KR 20200124700 A KR20200124700 A KR 20200124700A KR 1020207026871 A KR1020207026871 A KR 1020207026871A KR 20207026871 A KR20207026871 A KR 20207026871A KR 20200124700 A KR20200124700 A KR 20200124700A
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/24—Distinguishing marks, e.g. colour coding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Materials For Photolithography (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018030196 | 2018-02-22 | ||
| JPJP-P-2018-030196 | 2018-02-22 | ||
| PCT/JP2018/048327 WO2019163292A1 (ja) | 2018-02-22 | 2018-12-27 | 積層型電子部品用樹脂組成物、ドライフィルム、硬化物、積層型電子部品、および、プリント配線板 |
Publications (1)
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| JPWO2019163292A1 (ja) * | 2018-02-22 | 2020-04-09 | 太陽インキ製造株式会社 | 積層型電子部品用樹脂組成物、ドライフィルム、硬化物、積層型電子部品、および、プリント配線板 |
| JP2021014545A (ja) * | 2019-07-12 | 2021-02-12 | 味の素株式会社 | 樹脂組成物 |
| JP7211323B2 (ja) * | 2019-10-08 | 2023-01-24 | 株式会社村田製作所 | インダクタ部品、及びインダクタ部品の製造方法 |
| JP7211322B2 (ja) * | 2019-10-08 | 2023-01-24 | 株式会社村田製作所 | インダクタ部品 |
| JP7379066B2 (ja) * | 2019-10-09 | 2023-11-14 | 株式会社村田製作所 | インダクタ部品 |
| JP7322838B2 (ja) | 2020-09-03 | 2023-08-08 | 株式会社村田製作所 | 電子部品および電子部品モジュール |
| JP7510888B2 (ja) * | 2021-01-22 | 2024-07-04 | Tdk株式会社 | 積層コイル部品およびその製造方法 |
| CN117120551A (zh) * | 2021-03-24 | 2023-11-24 | 太阳控股株式会社 | 热固化性树脂组合物、干膜、固化物、印刷布线板以及电气电子部件 |
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| US4918570A (en) * | 1988-12-20 | 1990-04-17 | Murata Manufacturing Co., Ltd. | Electronic component and its production method |
| JP3039538B1 (ja) * | 1998-11-02 | 2000-05-08 | 株式会社村田製作所 | 積層型インダクタ |
| JP3878663B2 (ja) * | 1999-06-18 | 2007-02-07 | 日本特殊陶業株式会社 | 配線基板の製造方法及び配線基板 |
| JP2006335807A (ja) * | 2005-05-31 | 2006-12-14 | Taiyo Ink Mfg Ltd | 絶縁性硬化性樹脂組成物及びその硬化物 |
| JP2008235762A (ja) * | 2007-03-23 | 2008-10-02 | Matsushita Electric Ind Co Ltd | インダクタンス部品およびその製造方法 |
| JP2008251590A (ja) * | 2007-03-29 | 2008-10-16 | Matsushita Electric Ind Co Ltd | インダクタンス部品の製造方法 |
| JP2012089750A (ja) * | 2010-10-21 | 2012-05-10 | Hitachi Chem Co Ltd | 半導体封止充てん用熱硬化性樹脂組成物及び半導体装置 |
| KR101771729B1 (ko) * | 2012-07-25 | 2017-08-25 | 삼성전기주식회사 | 적층형 인덕터 및 적층형 인덕터의 보호층 조성물 |
| JP5576545B1 (ja) * | 2013-03-11 | 2014-08-20 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化皮膜を有するプリント配線板 |
| JP5722418B1 (ja) * | 2013-12-02 | 2015-05-20 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| KR102004787B1 (ko) * | 2014-04-02 | 2019-07-29 | 삼성전기주식회사 | 적층형 전자부품 및 그 제조방법 |
| JP7007792B2 (ja) * | 2015-09-30 | 2022-01-25 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| TWI726971B (zh) * | 2016-01-12 | 2021-05-11 | 日商昭和電工材料股份有限公司 | 感光性樹脂組成物、使用該感光性樹脂組成物之乾膜、印刷線路板、及印刷線路板的製造方法 |
| JP6434544B2 (ja) * | 2016-05-26 | 2018-12-05 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| JP6609221B2 (ja) * | 2016-06-01 | 2019-11-20 | 太陽誘電株式会社 | 電子部品 |
| JP2018018868A (ja) * | 2016-07-26 | 2018-02-01 | イビデン株式会社 | コイル基板及びその製造方法 |
| KR102404323B1 (ko) * | 2017-04-25 | 2022-06-07 | 삼성전기주식회사 | 차광성 수지 조성물 및 이를 포함하는 성형품 |
| JPWO2019163292A1 (ja) * | 2018-02-22 | 2020-04-09 | 太陽インキ製造株式会社 | 積層型電子部品用樹脂組成物、ドライフィルム、硬化物、積層型電子部品、および、プリント配線板 |
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| WO2019163292A1 (ja) | 2019-08-29 |
| CN111742014A (zh) | 2020-10-02 |
| TW201936774A (zh) | 2019-09-16 |
| JPWO2019163292A1 (ja) | 2020-04-09 |
| JP2020170172A (ja) | 2020-10-15 |
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