KR20190054058A - 난연성 수지 조성물 및 수지 부착 동박 - Google Patents

난연성 수지 조성물 및 수지 부착 동박 Download PDF

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Publication number
KR20190054058A
KR20190054058A KR1020197004704A KR20197004704A KR20190054058A KR 20190054058 A KR20190054058 A KR 20190054058A KR 1020197004704 A KR1020197004704 A KR 1020197004704A KR 20197004704 A KR20197004704 A KR 20197004704A KR 20190054058 A KR20190054058 A KR 20190054058A
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KR
South Korea
Prior art keywords
flame retardant
resin
parts
mass
general formula
Prior art date
Application number
KR1020197004704A
Other languages
English (en)
Korean (ko)
Inventor
히로아키 우메다
마사노리 미야모토
가즈히로 마쓰다
겐 유카와
Original Assignee
타츠타 전선 주식회사
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Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20190054058A publication Critical patent/KR20190054058A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
    • C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1020197004704A 2016-09-14 2017-08-17 난연성 수지 조성물 및 수지 부착 동박 KR20190054058A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-179611 2016-09-14
JP2016179611A JP2018044065A (ja) 2016-09-14 2016-09-14 難燃性樹脂組成物及び樹脂付き銅箔
PCT/JP2017/029544 WO2018051715A1 (ja) 2016-09-14 2017-08-17 難燃性樹脂組成物及び樹脂付き銅箔

Publications (1)

Publication Number Publication Date
KR20190054058A true KR20190054058A (ko) 2019-05-21

Family

ID=61619478

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197004704A KR20190054058A (ko) 2016-09-14 2017-08-17 난연성 수지 조성물 및 수지 부착 동박

Country Status (5)

Country Link
JP (1) JP2018044065A (ja)
KR (1) KR20190054058A (ja)
CN (1) CN109689778A (ja)
TW (1) TW201819536A (ja)
WO (1) WO2018051715A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102376072B1 (ko) * 2021-08-23 2022-03-18 주식회사 퍼시픽인터켐코포레이션 질소계 난연보조제
KR102376073B1 (ko) * 2021-08-23 2022-03-18 주식회사 퍼시픽인터켐코포레이션 복합 난연보조제

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JP2019183118A (ja) * 2018-03-30 2019-10-24 Ａｇｃ株式会社 成形体、積層体、パウダー分散液、及びパウダー分散液の製造方法
JP7087810B2 (ja) * 2018-08-09 2022-06-21 信越化学工業株式会社 半導体封止用熱硬化性樹脂組成物及び半導体装置
JPWO2020031732A1 (ja) * 2018-08-10 2021-09-24 日本ゼオン株式会社 フッ素系溶剤含有物の精製方法およびフッ素系溶剤含有精製物
JP7434727B2 (ja) * 2019-05-31 2024-02-21 株式会社レゾナック 接着剤組成物、積層体及び接着シート
US20220389130A1 (en) * 2019-06-28 2022-12-08 Mitsubishi Gas Chemical Company, Inc. Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
JP2021042325A (ja) * 2019-09-12 2021-03-18 信越化学工業株式会社 マレイミド樹脂組成物及びマレイミド樹脂フィルム
JPWO2021131267A1 (ja) * 2019-12-23 2021-07-01
CN112680172B (zh) * 2020-11-11 2022-11-29 杭州福斯特电子材料有限公司 耐燃的覆盖膜组合物、覆盖膜产品及多层叠置软硬组合板
JP7417345B2 (ja) 2020-12-23 2024-01-18 信越化学工業株式会社 環状イミド樹脂組成物、プリプレグ、銅張積層板およびプリント配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243836A (ja) 2002-02-14 2003-08-29 Hitachi Chem Co Ltd 多層配線板の製造方法及び絶縁樹脂組成物

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JP2003160725A (ja) * 2001-11-27 2003-06-06 Matsushita Electric Works Ltd ポリフェニレンオキサイド樹脂組成物、プリプレグ、積層板、プリント配線板、多層プリント配線板
AU2003244110A1 (en) * 2002-06-24 2004-01-06 Asahi Denka Co., Ltd. Flame retarder composition and flame retardant resin composition containing the composition
JP4455114B2 (ja) * 2004-03-25 2010-04-21 タムラ化研株式会社 ビルドアップ基板層間絶縁材料用の熱硬化性樹脂組成物、樹脂フィルム、製品およびビルドアップ基板の層間絶縁材料
JP5152955B2 (ja) * 2007-02-27 2013-02-27 株式会社Ａｄｅｋａ 難燃性樹脂組成物
CN105492542B (zh) * 2013-10-31 2019-10-15 松下知识产权经营株式会社 热固性树脂组合物、预浸渍体、覆金属箔层叠板、以及印刷电路板
WO2016114286A1 (ja) * 2015-01-13 2016-07-21 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
SG11201705674TA (en) * 2015-01-13 2017-08-30 Hitachi Chemical Co Ltd Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243836A (ja) 2002-02-14 2003-08-29 Hitachi Chem Co Ltd 多層配線板の製造方法及び絶縁樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102376072B1 (ko) * 2021-08-23 2022-03-18 주식회사 퍼시픽인터켐코포레이션 질소계 난연보조제
KR102376073B1 (ko) * 2021-08-23 2022-03-18 주식회사 퍼시픽인터켐코포레이션 복합 난연보조제

Also Published As

Publication number Publication date
JP2018044065A (ja) 2018-03-22
WO2018051715A1 (ja) 2018-03-22
TW201819536A (zh) 2018-06-01
CN109689778A (zh) 2019-04-26

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