KR20180135886A - 열경화성 수지 조성물, 경화막, 경화막 부착 기판 및 전자 부품 - Google Patents

열경화성 수지 조성물, 경화막, 경화막 부착 기판 및 전자 부품 Download PDF

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Publication number
KR20180135886A
KR20180135886A KR1020187024329A KR20187024329A KR20180135886A KR 20180135886 A KR20180135886 A KR 20180135886A KR 1020187024329 A KR1020187024329 A KR 1020187024329A KR 20187024329 A KR20187024329 A KR 20187024329A KR 20180135886 A KR20180135886 A KR 20180135886A
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KR
South Korea
Prior art keywords
epoxy
compound
cured film
resin composition
thermosetting resin
Prior art date
Application number
KR1020187024329A
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English (en)
Korean (ko)
Inventor
도모쓰구 후루타
아야코 기쿠치
Original Assignee
제이엔씨 주식회사
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Publication date
Application filed by 제이엔씨 주식회사 filed Critical 제이엔씨 주식회사
Publication of KR20180135886A publication Critical patent/KR20180135886A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Formation Of Insulating Films (AREA)
  • Polyethers (AREA)
KR1020187024329A 2016-04-18 2016-11-28 열경화성 수지 조성물, 경화막, 경화막 부착 기판 및 전자 부품 KR20180135886A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-083027 2016-04-18
JP2016083027 2016-04-18
PCT/JP2016/085088 WO2017183226A1 (ja) 2016-04-18 2016-11-28 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板および電子部品

Publications (1)

Publication Number Publication Date
KR20180135886A true KR20180135886A (ko) 2018-12-21

Family

ID=60115901

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187024329A KR20180135886A (ko) 2016-04-18 2016-11-28 열경화성 수지 조성물, 경화막, 경화막 부착 기판 및 전자 부품

Country Status (4)

Country Link
JP (1) JP6729684B2 (zh)
KR (1) KR20180135886A (zh)
CN (1) CN109071774B (zh)
WO (1) WO2017183226A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102140259B1 (ko) * 2018-01-11 2020-07-31 주식회사 엘지화학 반도체 몰딩용 에폭시 수지 조성물, 이를 이용한 몰딩필름 및 반도체 패키지
JP2019139091A (ja) * 2018-02-13 2019-08-22 Jnc株式会社 感光性組成物
CN109825082A (zh) * 2019-02-10 2019-05-31 成都其其小数科技有限公司 一种聚酯酰亚胺/双马来酰亚胺树脂复合材料及制备方法
EP4059976A4 (en) * 2019-11-15 2023-11-29 Toray Industries, Inc. EPOXY RESIN COMPOSITION, PRE-PREG, AND FIBER REINFORCED COMPOSITE MATERIAL
KR20240036669A (ko) * 2021-07-26 2024-03-20 아지노모토 가부시키가이샤 투명 수지 조성물

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4569233B2 (ja) * 2003-09-09 2010-10-27 チッソ株式会社 熱硬化性樹脂組成物及び硬化膜
JP5086710B2 (ja) * 2007-07-06 2012-11-28 昭和電工株式会社 変性オルガノポリシロキサン、その製造方法、それを含む組成物及び発光ダイオード封止用組成物
TW200909521A (en) * 2007-07-27 2009-03-01 Chisso Corp Composition comprising polyester amide acid and ink-jet composition using the composition
JP5109576B2 (ja) * 2007-10-23 2012-12-26 Ｊｎｃ株式会社 スクリーン印刷用組成物
JP5362209B2 (ja) * 2007-12-25 2013-12-11 株式会社アドマテックス 微小粒子含有組成物及び微小粒子含有樹脂組成物並びにそれらの製造方法
JP2010248297A (ja) * 2009-04-10 2010-11-04 Taiyo Ink Mfg Ltd 光硬化性樹脂及び光硬化性樹脂組成物
TWI550019B (zh) * 2011-12-27 2016-09-21 日本化藥股份有限公司 透明電路基板用環氧樹脂組成物及層合玻璃片
JP6610253B2 (ja) * 2013-07-25 2019-11-27 Ｊｎｃ株式会社 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板および電子部品
JP6206071B2 (ja) * 2013-10-15 2017-10-04 東レ株式会社 樹脂組成物、それを用いたポリイミド樹脂膜、それを含むカラーフィルタ、ｔｆｔ基板、表示デバイスおよびそれらの製造方法
JP6374714B2 (ja) * 2014-06-26 2018-08-15 旭化成株式会社 エポキシ樹脂組成物、接着剤、硬化物及び電子部材
WO2016117579A1 (ja) * 2015-01-23 2016-07-28 Jnc株式会社 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板および電子部品
CN107406690B (zh) * 2015-04-21 2020-06-09 株式会社大赛璐 硬涂层形成用树脂组合物及其固化物

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Publication number Publication date
CN109071774B (zh) 2021-08-03
JPWO2017183226A1 (ja) 2019-02-21
CN109071774A (zh) 2018-12-21
WO2017183226A1 (ja) 2017-10-26
JP6729684B2 (ja) 2020-07-22

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