KR20180074660A - 타일형 이미지 센서를 갖춘 방법 및 장치 - Google Patents

타일형 이미지 센서를 갖춘 방법 및 장치 Download PDF

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Publication number
KR20180074660A
KR20180074660A KR1020187004576A KR20187004576A KR20180074660A KR 20180074660 A KR20180074660 A KR 20180074660A KR 1020187004576 A KR1020187004576 A KR 1020187004576A KR 20187004576 A KR20187004576 A KR 20187004576A KR 20180074660 A KR20180074660 A KR 20180074660A
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South Korea
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sensor
substrate
tiles
tile
adhesive
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English (en)
Korean (ko)
Inventor
브래들리 에스 자드리치
마크 이 쉐퍼
에드워드 에이 틱크너
티모씨 제이 워직
스티븐 에프 엔츠
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케어스트림 덴탈 테크놀로지 톱코 리미티드
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Publication of KR20180074660A publication Critical patent/KR20180074660A/ko
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2018Scintillation-photodiode combinations
    • G01T1/20182Modular detectors, e.g. tiled scintillators or tiled photodiodes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2018Scintillation-photodiode combinations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2006Measuring radiation intensity with scintillation detectors using a combination of a scintillator and photodetector which measures the means radiation intensity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/208Circuits specially adapted for scintillation detectors, e.g. for the photo-multiplier section
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/24Measuring radiation intensity with semiconductor detectors
    • G01T1/243Modular detectors, e.g. arrays formed from self contained units
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H01L27/14663
    • H01L27/14676
    • H01L27/1469
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/018Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1898Indirect radiation image sensors, e.g. using luminescent members
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/191Photoconductor image sensors
    • H10F39/195X-ray, gamma-ray or corpuscular radiation imagers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass

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  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measurement Of Radiation (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Toxicology (AREA)
KR1020187004576A 2015-08-18 2016-07-26 타일형 이미지 센서를 갖춘 방법 및 장치 Withdrawn KR20180074660A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/828,772 2015-08-18
US14/828,772 US9599723B2 (en) 2015-08-18 2015-08-18 Method and apparatus with tiled image sensors
PCT/US2016/043962 WO2017030751A1 (en) 2015-08-18 2016-07-26 Method and apparatus with tiled image sensors

Publications (1)

Publication Number Publication Date
KR20180074660A true KR20180074660A (ko) 2018-07-03

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Family Applications (1)

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KR1020187004576A Withdrawn KR20180074660A (ko) 2015-08-18 2016-07-26 타일형 이미지 센서를 갖춘 방법 및 장치

Country Status (7)

Country Link
US (2) US9599723B2 (enExample)
EP (1) EP3338111A1 (enExample)
JP (1) JP2018532293A (enExample)
KR (1) KR20180074660A (enExample)
CN (1) CN108291972A (enExample)
TW (1) TW201724548A (enExample)
WO (1) WO2017030751A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200113129A (ko) * 2019-03-22 2020-10-06 아크소프트 코포레이션 리미티드 타일형 이미지 센서

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017014798A1 (en) * 2015-07-17 2017-01-26 Analogic Corporation Detector unit for detector array of radiation imaging modality
US9599723B2 (en) * 2015-08-18 2017-03-21 Carestream Health, Inc. Method and apparatus with tiled image sensors
US10686003B2 (en) * 2015-12-31 2020-06-16 General Electric Company Radiation detector assembly
CN110582708A (zh) * 2017-05-01 2019-12-17 皇家飞利浦有限公司 多层辐射探测器
CN110612507B (zh) * 2017-05-26 2023-06-09 深圳纽迪瑞科技开发有限公司 单按键及按键阵列
CN107361858A (zh) * 2017-08-29 2017-11-21 蒙显章 一次性手术定位膜及定位膜包
US11942503B2 (en) 2018-05-08 2024-03-26 Eastern Blue Technologies, Inc. Module and methods of assembly for large area flat panel detectors
US11869912B2 (en) * 2020-07-15 2024-01-09 Semiconductor Components Industries, Llc Method for defining a gap height within an image sensor package
CN114520239B (zh) * 2020-11-20 2025-05-13 京东方科技集团股份有限公司 X射线平板探测器及其制作方法、探测装置、成像系统
US12261186B2 (en) 2021-03-25 2025-03-25 Raytheon Company Mosaic focal plane array
US12181616B2 (en) * 2021-04-14 2024-12-31 Canon Medical Systems Corporation Radiation detector module, radiation detector, and X-ray CT apparatus
JP2024065926A (ja) * 2022-10-31 2024-05-15 キヤノン株式会社 放射線検出装置、その製造方法、センサモジュール及びct装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707760A (en) 1971-05-19 1973-01-02 Sieburg Ind Inc Method and device for article working such as fracturing of semiconductor slices and separating semiconductor chips
US4617420A (en) 1985-06-28 1986-10-14 The Standard Oil Company Flexible, interconnected array of amorphous semiconductor photovoltaic cells
US4942405A (en) 1988-10-11 1990-07-17 Hewlett-Packard Company Light emitting diode print head assembly
US5072074A (en) 1990-07-24 1991-12-10 Interflex Corporation High yield combined rigid and flexible printed circuits and method of manufacture
US5453145A (en) 1991-03-04 1995-09-26 Eastman Kodak Company Z-axis dimensional control in manufacturing an LED printhead
US5254480A (en) 1992-02-20 1993-10-19 Minnesota Mining And Manufacturing Company Process for producing a large area solid state radiation detector
FR2693033B1 (fr) 1992-06-30 1994-08-19 Commissariat Energie Atomique Dispositif d'imagerie de grande dimension.
EP0696358A1 (en) 1993-04-28 1996-02-14 University Of Surrey Radiation detectors
US5670009A (en) 1995-02-28 1997-09-23 Eastman Kodak Company Assembly technique for an image sensor array
JP3235717B2 (ja) * 1995-09-28 2001-12-04 キヤノン株式会社 光電変換装置及びx線撮像装置
JP3805031B2 (ja) 1995-10-20 2006-08-02 キヤノン株式会社 光電変換装置
US5909244A (en) 1996-04-15 1999-06-01 Massachusetts Institute Of Technology Real time adaptive digital image processing for dynamic range remapping of imagery including low-light-level visible imagery
GB2315157B (en) 1996-07-11 1998-09-30 Simage Oy Imaging apparatus
US5827757A (en) 1996-07-16 1998-10-27 Direct Radiography Corp. Fabrication of large area x-ray image capturing element
US5834782A (en) 1996-11-20 1998-11-10 Schick Technologies, Inc. Large area image detector
JP3285815B2 (ja) 1998-03-12 2002-05-27 松下電器産業株式会社 リードフレーム,樹脂封止型半導体装置及びその製造方法
EP1254483A4 (en) 1999-12-24 2008-03-05 Bae Systems Information Multi-color, multi-focal plane optical detector
JP3637826B2 (ja) 2000-01-21 2005-04-13 セイコーエプソン株式会社 半導体記憶装置
US6426991B1 (en) 2000-11-16 2002-07-30 Koninklijke Philips Electronics N.V. Back-illuminated photodiodes for computed tomography detectors
US6510195B1 (en) 2001-07-18 2003-01-21 Koninklijke Philips Electronics, N.V. Solid state x-radiation detector modules and mosaics thereof, and an imaging method and apparatus employing the same
US6782076B2 (en) 2001-12-07 2004-08-24 Bede Scientific Instruments Limited X-ray topographic system
US7868665B2 (en) 2002-03-05 2011-01-11 Nova R&D, Inc. Integrated circuit and sensor for imaging
US6946661B2 (en) 2002-12-23 2005-09-20 Ge Medical Systems Global Technology Company, Llc Methods and apparatus for X-ray image detector assemblies
CN100374878C (zh) 2003-01-06 2008-03-12 皇家飞利浦电子股份有限公司 辐射探测器模块和辐射探测方法,计算机断层摄影扫描器
CN1973214B (zh) * 2003-11-10 2010-09-15 江苏康众数字医疗设备有限公司 使用电互连的平铺光电传感器阵列的平板检测器
US20050098732A1 (en) 2003-11-10 2005-05-12 Ls Technologies, Inc. Flat-panel detector utilizing electrically interconnecting tiled photosensor arrays
US7067817B2 (en) 2004-01-29 2006-06-27 Hamamatsu Photonics K.K. Radiation image sensor and making method of same
EP1779141A2 (en) 2004-08-13 2007-05-02 Koninklijke Philips Electronics N.V. Solid state radiation detector packaging technique
US7539284B2 (en) 2005-02-11 2009-05-26 Besson Guy M Method and system for dynamic low dose X-ray imaging
US20060192087A1 (en) 2005-02-28 2006-08-31 Real Time Radiography Ltd. Two-dimensional CMOS-based flat panel imaging sensor
CN101278208A (zh) 2005-10-05 2008-10-01 皇家飞利浦电子股份有限公司 使用薄电路的计算机断层摄影探测器
CA2647407A1 (en) 2006-03-30 2007-10-18 Koninklijke Philips Electronics N.V. Radiation detector array
US7692709B2 (en) 2006-05-12 2010-04-06 Ricoh Co., Ltd. End-to-end design of electro-optic imaging systems with adjustable optical cutoff frequency
WO2008003351A1 (en) 2006-07-04 2008-01-10 Mario Caria Imaging system with tiled sensor chips having partially overlapping active areas
US7450683B2 (en) 2006-09-07 2008-11-11 General Electric Company Tileable multi-layer detector
GB2446185A (en) 2006-10-30 2008-08-06 Sensl Technologies Ltd Optical assembly and method of assembly
EP2359161B1 (en) 2008-11-21 2017-05-31 Trixell Assembly method for a tiled radiation detector
JP5665494B2 (ja) * 2010-06-24 2015-02-04 キヤノン株式会社 放射線検出装置及び放射線撮像システム
WO2012145038A1 (en) 2011-04-19 2012-10-26 Teledyne Rad-Icon Imaging Corp. Method of direct silicon tiling of a tiled image sensor array
US9012859B2 (en) 2012-05-18 2015-04-21 General Electric Company Tiled X-ray imager panel and method of forming the same
JP6000680B2 (ja) * 2012-06-20 2016-10-05 キヤノン株式会社 放射線検出装置、その製造方法及び撮像システム
EA021593B1 (ru) 2012-11-21 2015-07-30 Закрытое Акционерное Общество "Импульс" Детектор рентгеновского изображения, способ изготовления фоточувствительного элемента и способ изготовления детектора
US9599723B2 (en) * 2015-08-18 2017-03-21 Carestream Health, Inc. Method and apparatus with tiled image sensors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200113129A (ko) * 2019-03-22 2020-10-06 아크소프트 코포레이션 리미티드 타일형 이미지 센서

Also Published As

Publication number Publication date
TW201724548A (zh) 2017-07-01
WO2017030751A1 (en) 2017-02-23
US20170153334A1 (en) 2017-06-01
CN108291972A (zh) 2018-07-17
EP3338111A1 (en) 2018-06-27
JP2018532293A (ja) 2018-11-01
US9846246B2 (en) 2017-12-19
US20170052263A1 (en) 2017-02-23
US9599723B2 (en) 2017-03-21

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Patent event date: 20180214

Patent event code: PA01051R01D

Comment text: International Patent Application

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