TW201724548A - 使用分片式影像感測器之方法及設備 - Google Patents
使用分片式影像感測器之方法及設備 Download PDFInfo
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- TW201724548A TW201724548A TW105126269A TW105126269A TW201724548A TW 201724548 A TW201724548 A TW 201724548A TW 105126269 A TW105126269 A TW 105126269A TW 105126269 A TW105126269 A TW 105126269A TW 201724548 A TW201724548 A TW 201724548A
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- Taiwan
- Prior art keywords
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- sheets
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- flexible film
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Links
- 238000000034 method Methods 0.000 title claims description 30
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000000853 adhesive Substances 0.000 claims description 60
- 230000001070 adhesive effect Effects 0.000 claims description 60
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000003384 imaging method Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 2
- 239000007767 bonding agent Substances 0.000 claims 2
- 239000011230 binding agent Substances 0.000 abstract description 9
- 239000011521 glass Substances 0.000 description 25
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000002601 radiography Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007408 cone-beam computed tomography Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20182—Modular detectors, e.g. tiled scintillators or tiled photodiodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2006—Measuring radiation intensity with scintillation detectors using a combination of a scintillator and photodetector which measures the means radiation intensity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/208—Circuits specially adapted for scintillation detectors, e.g. for the photo-multiplier section
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/243—Modular detectors, e.g. arrays formed from self contained units
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
- H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
- H10F39/195—X-ray, gamma-ray or corpuscular radiation imagers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
Landscapes
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measurement Of Radiation (AREA)
- Toxicology (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/828,772 US9599723B2 (en) | 2015-08-18 | 2015-08-18 | Method and apparatus with tiled image sensors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201724548A true TW201724548A (zh) | 2017-07-01 |
Family
ID=56682254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105126269A TW201724548A (zh) | 2015-08-18 | 2016-08-17 | 使用分片式影像感測器之方法及設備 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9599723B2 (enExample) |
| EP (1) | EP3338111A1 (enExample) |
| JP (1) | JP2018532293A (enExample) |
| KR (1) | KR20180074660A (enExample) |
| CN (1) | CN108291972A (enExample) |
| TW (1) | TW201724548A (enExample) |
| WO (1) | WO2017030751A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107850678B (zh) * | 2015-07-17 | 2021-05-18 | 模拟技术公司 | 用于辐射成像模态装置的探测器阵列的探测器单元 |
| US9599723B2 (en) * | 2015-08-18 | 2017-03-21 | Carestream Health, Inc. | Method and apparatus with tiled image sensors |
| US10686003B2 (en) * | 2015-12-31 | 2020-06-16 | General Electric Company | Radiation detector assembly |
| WO2018202465A1 (en) * | 2017-05-01 | 2018-11-08 | Koninklijke Philips N.V. | Multi-layer radiation detector |
| US11156510B2 (en) * | 2017-05-26 | 2021-10-26 | Shenzhen New Degree Technology Co., Ltd. | Key unit and key array |
| CN107361858A (zh) * | 2017-08-29 | 2017-11-21 | 蒙显章 | 一次性手术定位膜及定位膜包 |
| US11942503B2 (en) | 2018-05-08 | 2024-03-26 | Eastern Blue Technologies, Inc. | Module and methods of assembly for large area flat panel detectors |
| KR102393910B1 (ko) * | 2019-03-22 | 2022-05-03 | 아크소프트 코포레이션 리미티드 | 타일형 이미지 센서 |
| US11869912B2 (en) | 2020-07-15 | 2024-01-09 | Semiconductor Components Industries, Llc | Method for defining a gap height within an image sensor package |
| CN114520239B (zh) * | 2020-11-20 | 2025-05-13 | 京东方科技集团股份有限公司 | X射线平板探测器及其制作方法、探测装置、成像系统 |
| US12261186B2 (en) | 2021-03-25 | 2025-03-25 | Raytheon Company | Mosaic focal plane array |
| CN115201236B (zh) * | 2021-04-14 | 2025-10-24 | 佳能医疗系统株式会社 | 放射线检测器模块、放射线检测器及x射线ct装置 |
| JP2024065926A (ja) * | 2022-10-31 | 2024-05-15 | キヤノン株式会社 | 放射線検出装置、その製造方法、センサモジュール及びｃｔ装置 |
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| US3707760A (en) | 1971-05-19 | 1973-01-02 | Sieburg Ind Inc | Method and device for article working such as fracturing of semiconductor slices and separating semiconductor chips |
| US4617420A (en) | 1985-06-28 | 1986-10-14 | The Standard Oil Company | Flexible, interconnected array of amorphous semiconductor photovoltaic cells |
| US4942405A (en) | 1988-10-11 | 1990-07-17 | Hewlett-Packard Company | Light emitting diode print head assembly |
| US5072074A (en) | 1990-07-24 | 1991-12-10 | Interflex Corporation | High yield combined rigid and flexible printed circuits and method of manufacture |
| US5453145A (en) | 1991-03-04 | 1995-09-26 | Eastman Kodak Company | Z-axis dimensional control in manufacturing an LED printhead |
| US5254480A (en) | 1992-02-20 | 1993-10-19 | Minnesota Mining And Manufacturing Company | Process for producing a large area solid state radiation detector |
| FR2693033B1 (fr) | 1992-06-30 | 1994-08-19 | Commissariat Energie Atomique | Dispositif d'imagerie de grande dimension. |
| US5693947A (en) | 1993-04-28 | 1997-12-02 | The University Of Surrey | Radiation detectors |
| US5670009A (en) | 1995-02-28 | 1997-09-23 | Eastman Kodak Company | Assembly technique for an image sensor array |
| JP3235717B2 (ja) * | 1995-09-28 | 2001-12-04 | キヤノン株式会社 | 光電変換装置及びｘ線撮像装置 |
| JP3805031B2 (ja) | 1995-10-20 | 2006-08-02 | キヤノン株式会社 | 光電変換装置 |
| US5909244A (en) | 1996-04-15 | 1999-06-01 | Massachusetts Institute Of Technology | Real time adaptive digital image processing for dynamic range remapping of imagery including low-light-level visible imagery |
| GB2315157B (en) | 1996-07-11 | 1998-09-30 | Simage Oy | Imaging apparatus |
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| CN1973214B (zh) * | 2003-11-10 | 2010-09-15 | 江苏康众数字医疗设备有限公司 | 使用电互连的平铺光电传感器阵列的平板检测器 |
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| JP5665494B2 (ja) * | 2010-06-24 | 2015-02-04 | キヤノン株式会社 | 放射線検出装置及び放射線撮像システム |
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| JP6000680B2 (ja) * | 2012-06-20 | 2016-10-05 | キヤノン株式会社 | 放射線検出装置、その製造方法及び撮像システム |
| EA021593B1 (ru) | 2012-11-21 | 2015-07-30 | Закрытое Акционерное Общество "Импульс" | Детектор рентгеновского изображения, способ изготовления фоточувствительного элемента и способ изготовления детектора |
| US9599723B2 (en) * | 2015-08-18 | 2017-03-21 | Carestream Health, Inc. | Method and apparatus with tiled image sensors |
-
2015
- 2015-08-18 US US14/828,772 patent/US9599723B2/en not_active Expired - Fee Related
-
2016
- 2016-07-26 CN CN201680048578.1A patent/CN108291972A/zh active Pending
- 2016-07-26 EP EP16750557.7A patent/EP3338111A1/en not_active Withdrawn
- 2016-07-26 WO PCT/US2016/043962 patent/WO2017030751A1/en not_active Ceased
- 2016-07-26 JP JP2018509503A patent/JP2018532293A/ja not_active Ceased
- 2016-07-26 KR KR1020187004576A patent/KR20180074660A/ko not_active Withdrawn
- 2016-08-17 TW TW105126269A patent/TW201724548A/zh unknown
-
2017
- 2017-02-03 US US15/423,645 patent/US9846246B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US9846246B2 (en) | 2017-12-19 |
| US9599723B2 (en) | 2017-03-21 |
| JP2018532293A (ja) | 2018-11-01 |
| EP3338111A1 (en) | 2018-06-27 |
| KR20180074660A (ko) | 2018-07-03 |
| US20170153334A1 (en) | 2017-06-01 |
| CN108291972A (zh) | 2018-07-17 |
| US20170052263A1 (en) | 2017-02-23 |
| WO2017030751A1 (en) | 2017-02-23 |
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