KR20180072774A - 은-팔라듐 합금 전해질을 위한 첨가물 - Google Patents

은-팔라듐 합금 전해질을 위한 첨가물 Download PDF

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Publication number
KR20180072774A
KR20180072774A KR1020187014301A KR20187014301A KR20180072774A KR 20180072774 A KR20180072774 A KR 20180072774A KR 1020187014301 A KR1020187014301 A KR 1020187014301A KR 20187014301 A KR20187014301 A KR 20187014301A KR 20180072774 A KR20180072774 A KR 20180072774A
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KR
South Korea
Prior art keywords
silver
palladium
acid
electrolyte
concentration
Prior art date
Application number
KR1020187014301A
Other languages
English (en)
Korean (ko)
Inventor
베른트 바이뮐러
알렉산더 페터스
우베 만츠
Original Assignee
유미코아 갈바노테히닉 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 유미코아 갈바노테히닉 게엠베하 filed Critical 유미코아 갈바노테히닉 게엠베하
Publication of KR20180072774A publication Critical patent/KR20180072774A/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020187014301A 2015-10-21 2016-10-19 은-팔라듐 합금 전해질을 위한 첨가물 KR20180072774A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15190885.2A EP3159435B1 (fr) 2015-10-21 2015-10-21 Supplement pour electrolyte d'alliage argent-palladium
EP15190885.2 2015-10-21
PCT/EP2016/075096 WO2017067985A1 (fr) 2015-10-21 2016-10-19 Additif pour électrolytes d'alliage argent-palladium

Publications (1)

Publication Number Publication Date
KR20180072774A true KR20180072774A (ko) 2018-06-29

Family

ID=54360003

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187014301A KR20180072774A (ko) 2015-10-21 2016-10-19 은-팔라듐 합금 전해질을 위한 첨가물

Country Status (8)

Country Link
US (1) US20190071789A1 (fr)
EP (2) EP3159435B1 (fr)
JP (1) JP2018535318A (fr)
KR (1) KR20180072774A (fr)
CN (1) CN108350592A (fr)
PL (1) PL3159435T3 (fr)
TW (1) TW201728787A (fr)
WO (1) WO2017067985A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110770371A (zh) * 2017-05-23 2020-02-07 萨克森爱德美塔尔有限责任公司 贵金属盐制剂、其生产方法及用于电镀的用途
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
JP7405827B2 (ja) * 2018-08-21 2023-12-26 ウミコレ・ガルファノテフニック・ゲーエムベーハー 銀の非シアン系析出用電解質
DE102018126174B3 (de) * 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermisch stabile Silberlegierungsschichten, Verfahren zur Abscheidung und Verwendung
US11242609B2 (en) 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
DE102020109818A1 (de) * 2020-04-08 2021-04-22 Doduco Solutions Gmbh Elektrischer Steckverbinder zum Anschließen eines Elektrofahrzeugs an eine Ladestation
CN111455360A (zh) * 2020-05-06 2020-07-28 广东工业大学 一种化学镀钯还原剂及化学镀钯液

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915718A (en) * 1972-10-04 1975-10-28 Schering Ag Chemical silver bath
DE2445538C2 (de) 1974-09-20 1984-05-30 Schering AG, 1000 Berlin und 4709 Bergkamen Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Edelmetall - Legierungen
US4126524A (en) * 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
DE3118908C2 (de) 1981-05-13 1986-07-10 Degussa Ag, 6000 Frankfurt Galvanisches Palladiumbad
US4478692A (en) * 1982-12-22 1984-10-23 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4465563A (en) * 1982-12-22 1984-08-14 Learonal, Inc. Electrodeposition of palladium-silver alloys
PL157733B1 (pl) * 1988-05-10 1992-06-30 Lubelska Polt Sposób otrzymywania stopów palladu ze srebrem PL PL PL
DE3935664C1 (en) * 1989-10-26 1991-03-28 W.C. Heraeus Gmbh, 6450 Hanau, De Palladium-silver alloys for electrical contacts - deposited from ammoniacal bath contg. palladium tetramine complex, silver di:amine complex and organic sulphur cpd.
EP0693579B1 (fr) * 1994-07-21 1997-08-27 W.C. Heraeus GmbH Bain pour le dépÔt électrolytique d'alliages Palladium-Argent
US6251249B1 (en) 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JP2001335986A (ja) * 2000-05-30 2001-12-07 Matsuda Sangyo Co Ltd パラジウムめっき液
FR2825721B1 (fr) * 2001-06-12 2003-10-03 Engelhard Clal Sas Melange utilisable comme brillanteur dans un bain de depot electrolytique d'argent, d'or ou d'un de leurs alliages
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
DE102011105207B4 (de) * 2011-06-17 2015-09-10 Umicore Galvanotechnik Gmbh Elektrolyt und seine Verwendung zur Abscheidung von Schwarz-Ruthenium-Überzügen und so erhaltene Überzüge und Artikel
US9512529B2 (en) * 2013-06-04 2016-12-06 Rohm And Haas Electronic Materials Llc Electroplating baths of silver and tin alloys
DE102013215476B3 (de) 2013-08-06 2015-01-08 Umicore Galvanotechnik Gmbh Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung

Also Published As

Publication number Publication date
EP3365478A1 (fr) 2018-08-29
CN108350592A (zh) 2018-07-31
PL3159435T3 (pl) 2018-10-31
US20190071789A1 (en) 2019-03-07
EP3159435B1 (fr) 2018-05-23
WO2017067985A1 (fr) 2017-04-27
JP2018535318A (ja) 2018-11-29
TW201728787A (zh) 2017-08-16
EP3159435A1 (fr) 2017-04-26

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