KR20170123238A - 반도체 패키지 및 반도체 패키지의 제조 방법 - Google Patents

반도체 패키지 및 반도체 패키지의 제조 방법 Download PDF

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KR20170123238A
KR20170123238A KR1020170047733A KR20170047733A KR20170123238A KR 20170123238 A KR20170123238 A KR 20170123238A KR 1020170047733 A KR1020170047733 A KR 1020170047733A KR 20170047733 A KR20170047733 A KR 20170047733A KR 20170123238 A KR20170123238 A KR 20170123238A
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South Korea
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semiconductor device
concave portion
insulating layer
resin insulating
substrate
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Korean (ko)
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야스유키 타케하라
카즈히코 키타노
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가부시키가이샤 제이디바이스
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Publication of KR20170123238A publication Critical patent/KR20170123238A/ko
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    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/042—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers
    • H10W20/043—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers for electroplating
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    • H10W20/044—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers for electroless plating
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    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
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    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
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    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/134—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being in grooves in the semiconductor body
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    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
KR1020170047733A 2016-04-28 2017-04-13 반도체 패키지 및 반도체 패키지의 제조 방법 Withdrawn KR20170123238A (ko)

Applications Claiming Priority (2)

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JPJP-P-2016-090189 2016-04-28
JP2016090189A JP6678506B2 (ja) 2016-04-28 2016-04-28 半導体パッケージ及び半導体パッケージの製造方法

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KR20170123238A true KR20170123238A (ko) 2017-11-07

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Country Link
US (1) US10553456B2 (cg-RX-API-DMAC10.html)
JP (1) JP6678506B2 (cg-RX-API-DMAC10.html)
KR (1) KR20170123238A (cg-RX-API-DMAC10.html)
CN (2) CN107424980B (cg-RX-API-DMAC10.html)
TW (2) TWI745359B (cg-RX-API-DMAC10.html)

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JP6691835B2 (ja) * 2016-06-17 2020-05-13 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージの製造方法
KR102138012B1 (ko) * 2018-08-28 2020-07-27 삼성전자주식회사 팬-아웃 반도체 패키지
CN111415908B (zh) 2019-01-07 2022-02-22 台达电子企业管理（上海）有限公司 电源模块、芯片嵌入式封装模块及制备方法
WO2021111517A1 (ja) * 2019-12-03 2021-06-10 太陽誘電株式会社 部品モジュールおよびその製造方法
US12266581B2 (en) * 2020-10-30 2025-04-01 Intel Corporation Electronic substrates having heterogeneous dielectric layers
US20220238473A1 (en) * 2021-01-25 2022-07-28 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices and corresponding semiconductor device

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US20170316996A1 (en) 2017-11-02
TWI784738B (zh) 2022-11-21
TW201803036A (zh) 2018-01-16
CN114823629A (zh) 2022-07-29
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JP2017199823A (ja) 2017-11-02
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