KR20170104648A - 코어리스 빌드업 지지 기판 및 당해 코어리스 빌드업 지지 기판을 사용하여 제조된 프린트 배선판 - Google Patents

코어리스 빌드업 지지 기판 및 당해 코어리스 빌드업 지지 기판을 사용하여 제조된 프린트 배선판 Download PDF

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Publication number
KR20170104648A
KR20170104648A KR1020177024807A KR20177024807A KR20170104648A KR 20170104648 A KR20170104648 A KR 20170104648A KR 1020177024807 A KR1020177024807 A KR 1020177024807A KR 20177024807 A KR20177024807 A KR 20177024807A KR 20170104648 A KR20170104648 A KR 20170104648A
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KR
South Korea
Prior art keywords
layer
copper foil
carrier
thin copper
wiring board
Prior art date
Application number
KR1020177024807A
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English (en)
Korean (ko)
Inventor
아유무 다테오카
Original Assignee
미쓰이금속광업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰이금속광업주식회사 filed Critical 미쓰이금속광업주식회사
Publication of KR20170104648A publication Critical patent/KR20170104648A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020177024807A 2013-11-22 2014-11-21 코어리스 빌드업 지지 기판 및 당해 코어리스 빌드업 지지 기판을 사용하여 제조된 프린트 배선판 KR20170104648A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013241584 2013-11-22
JPJP-P-2013-241584 2013-11-22
PCT/JP2014/080917 WO2015076372A1 (ja) 2013-11-22 2014-11-21 埋設回路を備えるプリント配線板の製造方法及びその製造方法で得られるプリント配線板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167013101A Division KR20160089364A (ko) 2013-11-22 2014-11-21 매설 회로를 구비하는 프린트 배선판의 제조 방법 및 그 제조 방법으로 얻어지는 프린트 배선판

Publications (1)

Publication Number Publication Date
KR20170104648A true KR20170104648A (ko) 2017-09-15

Family

ID=53179631

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020167013101A KR20160089364A (ko) 2013-11-22 2014-11-21 매설 회로를 구비하는 프린트 배선판의 제조 방법 및 그 제조 방법으로 얻어지는 프린트 배선판
KR1020177024807A KR20170104648A (ko) 2013-11-22 2014-11-21 코어리스 빌드업 지지 기판 및 당해 코어리스 빌드업 지지 기판을 사용하여 제조된 프린트 배선판

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020167013101A KR20160089364A (ko) 2013-11-22 2014-11-21 매설 회로를 구비하는 프린트 배선판의 제조 방법 및 그 제조 방법으로 얻어지는 프린트 배선판

Country Status (5)

Country Link
JP (2) JP6753669B2 (zh)
KR (2) KR20160089364A (zh)
CN (2) CN107708314B (zh)
TW (2) TWI589201B (zh)
WO (1) WO2015076372A1 (zh)

Cited By (2)

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KR20220019747A (ko) * 2015-02-03 2022-02-17 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR102429384B1 (ko) * 2021-07-02 2022-08-04 와이엠티 주식회사 캐리어박 부착 금속박, 이를 이용한 프린트 배선판용 적층체 및 이의 제조방법

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KR20160089364A (ko) * 2013-11-22 2016-07-27 미쓰이금속광업주식회사 매설 회로를 구비하는 프린트 배선판의 제조 방법 및 그 제조 방법으로 얻어지는 프린트 배선판
JP6546526B2 (ja) * 2015-12-25 2019-07-17 三井金属鉱業株式会社 キャリア付銅箔及びコアレス支持体用積層板、並びに配線層付コアレス支持体及びプリント配線板の製造方法
WO2017149810A1 (ja) * 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法
CN109716871B (zh) * 2016-10-06 2023-02-17 三井金属矿业株式会社 多层布线板的制造方法
WO2020145003A1 (ja) * 2019-01-11 2020-07-16 三井金属鉱業株式会社 積層体
CN110996540B (zh) * 2019-12-31 2022-02-08 生益电子股份有限公司 一种pcb的制作方法
JP2023552727A (ja) * 2020-11-24 2023-12-19 コーニング インコーポレイテッド マイクロｌｅｄ及びマイクロエレクトロニクス転写用基板
CN113380529A (zh) * 2021-05-13 2021-09-10 江苏普诺威电子股份有限公司 单层无线充电线圈载板的加工工艺
CN113473721A (zh) * 2021-07-08 2021-10-01 江西柔顺科技有限公司 一种柔性印刷电路板及其制备方法
KR20240042062A (ko) * 2021-08-09 2024-04-01 광저우 팡 방 일렉트로닉 컴퍼니, 리미티드 금속박, 회로 기판 및 회로 기판의 제조 방법

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US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
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JP5473838B2 (ja) * 2010-03-30 2014-04-16 日本電解株式会社 支持体金属箔付き複合金属層、これを用いた配線板とその製造方法、この配線板を用いた半導体パッケージの製造方法
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JP5896200B2 (ja) * 2010-09-29 2016-03-30 日立化成株式会社 半導体素子搭載用パッケージ基板の製造方法
CN103430642B (zh) * 2011-03-30 2016-04-06 三井金属矿业株式会社 多层印刷线路板的制造方法
KR20160089364A (ko) * 2013-11-22 2016-07-27 미쓰이금속광업주식회사 매설 회로를 구비하는 프린트 배선판의 제조 방법 및 그 제조 방법으로 얻어지는 프린트 배선판

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220019747A (ko) * 2015-02-03 2022-02-17 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR102429384B1 (ko) * 2021-07-02 2022-08-04 와이엠티 주식회사 캐리어박 부착 금속박, 이를 이용한 프린트 배선판용 적층체 및 이의 제조방법
WO2023277462A1 (ko) * 2021-07-02 2023-01-05 와이엠티 주식회사 캐리어박 부착 금속박, 이를 이용한 프린트 배선판용 적층체 및 이의 제조방법

Also Published As

Publication number Publication date
WO2015076372A1 (ja) 2015-05-28
TWI589201B (zh) 2017-06-21
TW201536134A (zh) 2015-09-16
JP2017224848A (ja) 2017-12-21
TW201731355A (zh) 2017-09-01
CN105746003A (zh) 2016-07-06
TWI633817B (zh) 2018-08-21
CN107708314A (zh) 2018-02-16
CN107708314B (zh) 2021-01-01
JP6753825B2 (ja) 2020-09-09
CN105746003B (zh) 2018-12-21
JP6753669B2 (ja) 2020-09-09
KR20160089364A (ko) 2016-07-27
JPWO2015076372A1 (ja) 2017-03-16

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