KR20170020552A - 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어 - Google Patents

보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어 Download PDF

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Publication number
KR20170020552A
KR20170020552A KR1020177004117A KR20177004117A KR20170020552A KR 20170020552 A KR20170020552 A KR 20170020552A KR 1020177004117 A KR1020177004117 A KR 1020177004117A KR 20177004117 A KR20177004117 A KR 20177004117A KR 20170020552 A KR20170020552 A KR 20170020552A
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KR
South Korea
Prior art keywords
substrate
carrier
region
top surface
electrode assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020177004117A
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English (en)
Korean (ko)
Inventor
마이클 에스. 콕스
체릴 에이. 크넵플레어
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20170020552A publication Critical patent/KR20170020552A/ko
Ceased legal-status Critical Current

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Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H01L21/6773—
    • H01L21/67739—
    • H01L21/67748—
    • H01L21/6835—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020177004117A 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어 Ceased KR20170020552A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/099,856 2013-12-06
US14/099,856 US9460950B2 (en) 2013-12-06 2013-12-06 Wafer carrier for smaller wafers and wafer pieces
PCT/US2014/056607 WO2015084463A1 (en) 2013-12-06 2014-09-19 Wafer carrier for smaller wafers and wafer pieces

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167017937A Division KR101757378B1 (ko) 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어

Publications (1)

Publication Number Publication Date
KR20170020552A true KR20170020552A (ko) 2017-02-22

Family

ID=53271907

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177004117A Ceased KR20170020552A (ko) 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어
KR1020167017937A Active KR101757378B1 (ko) 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167017937A Active KR101757378B1 (ko) 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어

Country Status (6)

Country Link
US (2) US9460950B2 (https=)
JP (1) JP6656153B2 (https=)
KR (2) KR20170020552A (https=)
CN (1) CN105793974B (https=)
TW (2) TWI620262B (https=)
WO (1) WO2015084463A1 (https=)

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US9740111B2 (en) * 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
WO2018141366A1 (en) * 2017-01-31 2018-08-09 Applied Materials, Inc. Substrate carrier and method of processing a substrate
TWI827502B (zh) * 2017-06-19 2023-12-21 美商應用材料股份有限公司 用於高溫處理腔室的靜電吸座及其形成方法
US20180374736A1 (en) * 2017-06-22 2018-12-27 Applied Materials, Inc. Electrostatic carrier for die bonding applications
CN111128834B (zh) * 2018-10-31 2022-09-06 成都辰显光电有限公司 微元件转移设备及其制作方法
CN109545731B (zh) * 2018-11-20 2021-12-28 合肥京东方显示技术有限公司 转移头及其制备方法、转移方法、转移装置
US12125728B2 (en) * 2019-01-21 2024-10-22 Applied Materials, Inc. Substrate carrier
CN113646668A (zh) 2019-04-11 2021-11-12 应用材料公司 用于光学装置的多深度膜
CN110137130B (zh) * 2019-05-15 2020-12-29 江苏鲁汶仪器有限公司 一种干法刻蚀系统用尺寸转换托盘
JP7350438B2 (ja) * 2019-09-09 2023-09-26 株式会社ディスコ チャックテーブル及びチャックテーブルの製造方法
KR102842706B1 (ko) * 2020-05-18 2025-08-06 삼성디스플레이 주식회사 정전척
CN112117230B (zh) * 2020-10-19 2025-01-24 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置
KR102327829B1 (ko) * 2020-11-02 2021-11-17 주식회사 엘케이엔지니어링 정전척
CN120500743A (zh) * 2023-01-12 2025-08-15 日本碍子株式会社 晶片载放台
US20250391699A1 (en) * 2024-06-20 2025-12-25 Applied Materials Israel Ltd. Hybrid vacuum electrostatic chuck carrier for high warpage wafers
US20250391692A1 (en) * 2024-06-20 2025-12-25 Applied Materials Israel Ltd. Hybrid vacuum electrostatic chuck in vacuum chamber for high warpage wafers

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Also Published As

Publication number Publication date
TW201732992A (zh) 2017-09-16
KR20160093711A (ko) 2016-08-08
CN105793974B (zh) 2020-01-10
TWI600110B (zh) 2017-09-21
US20160365269A1 (en) 2016-12-15
JP6656153B2 (ja) 2020-03-04
JP2017501572A (ja) 2017-01-12
US9460950B2 (en) 2016-10-04
TW201523787A (zh) 2015-06-16
US20150162231A1 (en) 2015-06-11
TWI620262B (zh) 2018-04-01
WO2015084463A1 (en) 2015-06-11
US10236201B2 (en) 2019-03-19
KR101757378B1 (ko) 2017-07-12
CN105793974A (zh) 2016-07-20

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