KR20160017101A - 스퍼터링 타깃재 - Google Patents

스퍼터링 타깃재 Download PDF

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Publication number
KR20160017101A
KR20160017101A KR1020167001775A KR20167001775A KR20160017101A KR 20160017101 A KR20160017101 A KR 20160017101A KR 1020167001775 A KR1020167001775 A KR 1020167001775A KR 20167001775 A KR20167001775 A KR 20167001775A KR 20160017101 A KR20160017101 A KR 20160017101A
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KR
South Korea
Prior art keywords
copper
oxide
phase
alloy
sputtering target
Prior art date
Application number
KR1020167001775A
Other languages
English (en)
Korean (ko)
Inventor
마코토 이케다
Original Assignee
미쓰이금속광업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54392387&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20160017101(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 미쓰이금속광업주식회사 filed Critical 미쓰이금속광업주식회사
Publication of KR20160017101A publication Critical patent/KR20160017101A/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/087—Oxides of copper or solid solutions thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
KR1020167001775A 2014-05-08 2015-04-02 스퍼터링 타깃재 KR20160017101A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014096515 2014-05-08
JPJP-P-2014-096515 2014-05-08
PCT/JP2015/060441 WO2015170534A1 (fr) 2014-05-08 2015-04-02 Matériau de cible de pulvérisation cathodique

Publications (1)

Publication Number Publication Date
KR20160017101A true KR20160017101A (ko) 2016-02-15

Family

ID=54392387

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167001775A KR20160017101A (ko) 2014-05-08 2015-04-02 스퍼터링 타깃재

Country Status (5)

Country Link
JP (1) JP5808513B1 (fr)
KR (1) KR20160017101A (fr)
CN (1) CN105358734B (fr)
TW (1) TWI525208B (fr)
WO (1) WO2015170534A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180125946A (ko) * 2016-03-22 2018-11-26 미쓰비시 마테리알 가부시키가이샤 스퍼터링 타깃
KR20190120167A (ko) * 2017-03-01 2019-10-23 미쓰비시 마테리알 가부시키가이샤 스퍼터링 타깃 및 스퍼터링 타깃의 제조 방법

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017164168A1 (fr) * 2016-03-22 2017-09-28 三菱マテリアル株式会社 Cible de pulvérisation cathodique
JP6932908B2 (ja) * 2016-09-26 2021-09-08 住友金属鉱山株式会社 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
WO2018159753A1 (fr) * 2017-03-01 2018-09-07 三菱マテリアル株式会社 Cible de pulvérisation et son procédé de fabrication
JP6533805B2 (ja) * 2017-03-31 2019-06-19 Ｊｘ金属株式会社 スパッタリングターゲット、スパッタリングターゲットの製造方法、非晶質膜、非晶質膜の製造方法、結晶質膜及び結晶質膜の製造方法
WO2019167564A1 (fr) * 2018-03-01 2019-09-06 三菱マテリアル株式会社 CIBLE DE PULVÉRISATION EN ALLIAGE Cu-Ni
JP6627993B2 (ja) * 2018-03-01 2020-01-08 三菱マテリアル株式会社 Ｃｕ−Ｎｉ合金スパッタリングターゲット
JP6853440B2 (ja) * 2019-03-11 2021-03-31 三菱マテリアル株式会社 金属銅及び酸化銅含有粉、金属銅及び酸化銅含有粉の製造方法、及び、スパッタリングターゲット材、スパッタリングターゲット材の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3779856B2 (ja) * 2000-04-10 2006-05-31 株式会社日鉱マテリアルズ 光ディスク保護膜形成用スパッタリングターゲット
JP2010030824A (ja) * 2008-07-28 2010-02-12 Idemitsu Kosan Co Ltd 金属相含有酸化インジウム焼結体及びその製造方法
JP2010077530A (ja) * 2008-08-26 2010-04-08 Hitachi Metals Ltd スパッタリングターゲットの製造方法及びスパタリングターゲット
JP2011084754A (ja) * 2009-10-13 2011-04-28 Hitachi Metals Ltd スパッタリングターゲットの製造方法
JP5641402B2 (ja) * 2010-02-01 2014-12-17 学校法人 龍谷大学 酸化物膜及びその製造方法、並びにターゲット及び酸化物焼結体の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180125946A (ko) * 2016-03-22 2018-11-26 미쓰비시 마테리알 가부시키가이샤 스퍼터링 타깃
KR20190120167A (ko) * 2017-03-01 2019-10-23 미쓰비시 마테리알 가부시키가이샤 스퍼터링 타깃 및 스퍼터링 타깃의 제조 방법

Also Published As

Publication number Publication date
TW201542849A (zh) 2015-11-16
JPWO2015170534A1 (ja) 2017-04-20
JP5808513B1 (ja) 2015-11-10
CN105358734A (zh) 2016-02-24
TWI525208B (zh) 2016-03-11
CN105358734B (zh) 2017-03-29
WO2015170534A1 (fr) 2015-11-12

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