KR20150094669A - 컨포멀한 차폐를 위한 방법들 및 장치 - Google Patents

컨포멀한 차폐를 위한 방법들 및 장치 Download PDF

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Publication number
KR20150094669A
KR20150094669A KR1020157017904A KR20157017904A KR20150094669A KR 20150094669 A KR20150094669 A KR 20150094669A KR 1020157017904 A KR1020157017904 A KR 1020157017904A KR 20157017904 A KR20157017904 A KR 20157017904A KR 20150094669 A KR20150094669 A KR 20150094669A
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KR
South Korea
Prior art keywords
shielding
circuit board
conformal
stencil
molding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020157017904A
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English (en)
Korean (ko)
Inventor
양 창
자크 브라이언 스틴스트라
Original Assignee
퀄컴 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20150094669A publication Critical patent/KR20150094669A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H01L23/552—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/273—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being between laterally adjacent chips, e.g. walls between chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H01L2924/0002—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0169—Using a temporary frame during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
KR1020157017904A 2012-12-11 2013-11-29 컨포멀한 차폐를 위한 방법들 및 장치 Ceased KR20150094669A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261735699P 2012-12-11 2012-12-11
US61/735,699 2012-12-11
US14/038,633 2013-09-26
US14/038,633 US10091918B2 (en) 2012-12-11 2013-09-26 Methods and apparatus for conformal shielding
PCT/US2013/072478 WO2014093035A1 (en) 2012-12-11 2013-11-29 Methods and apparatus for conformal shielding

Publications (1)

Publication Number Publication Date
KR20150094669A true KR20150094669A (ko) 2015-08-19

Family

ID=50880758

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157017904A Ceased KR20150094669A (ko) 2012-12-11 2013-11-29 컨포멀한 차폐를 위한 방법들 및 장치

Country Status (6)

Country Link
US (1) US10091918B2 (https=)
EP (1) EP2932815B1 (https=)
JP (1) JP6373862B2 (https=)
KR (1) KR20150094669A (https=)
CN (1) CN104838737B (https=)
WO (1) WO2014093035A1 (https=)

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KR20200064859A (ko) * 2018-11-28 2020-06-08 청-체 차이 인-패키지 구획 차폐를 갖는 반도체 패키지 및 그 제조 방법
KR20200084302A (ko) * 2019-01-01 2020-07-10 차이 시안-총 패키지 내 구획 차폐물 및 능동 전자기 적합성 차폐물을 갖는 반도체 패키지
WO2020263018A1 (ko) * 2019-06-28 2020-12-30 주식회사 아모센스 전자 소자 어셈블리 패키지, 전자 소자 모듈용 회로 기판 및 이의 제조 방법
US10896880B2 (en) 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
KR20230165165A (ko) * 2017-03-13 2023-12-05 스태츠 칩팩 피티이. 엘티디. 반도체 컴포넌트들 주위에 파티션 펜스 및 차폐 층을 형성하는 반도체 디바이스 및 방법

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Publication number Priority date Publication date Assignee Title
KR20230165165A (ko) * 2017-03-13 2023-12-05 스태츠 칩팩 피티이. 엘티디. 반도체 컴포넌트들 주위에 파티션 펜스 및 차폐 층을 형성하는 반도체 디바이스 및 방법
KR20200064859A (ko) * 2018-11-28 2020-06-08 청-체 차이 인-패키지 구획 차폐를 갖는 반도체 패키지 및 그 제조 방법
US10847480B2 (en) 2018-11-28 2020-11-24 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US10896880B2 (en) 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
KR20200084302A (ko) * 2019-01-01 2020-07-10 차이 시안-총 패키지 내 구획 차폐물 및 능동 전자기 적합성 차폐물을 갖는 반도체 패키지
WO2020263018A1 (ko) * 2019-06-28 2020-12-30 주식회사 아모센스 전자 소자 어셈블리 패키지, 전자 소자 모듈용 회로 기판 및 이의 제조 방법

Also Published As

Publication number Publication date
JP6373862B2 (ja) 2018-08-15
JP2016500477A (ja) 2016-01-12
CN104838737A (zh) 2015-08-12
CN104838737B (zh) 2019-03-05
US20140160699A1 (en) 2014-06-12
US10091918B2 (en) 2018-10-02
EP2932815B1 (en) 2019-06-12
WO2014093035A1 (en) 2014-06-19
EP2932815A1 (en) 2015-10-21

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