KR20150056633A - 개량된 미세연마 방법 - Google Patents

개량된 미세연마 방법 Download PDF

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Publication number
KR20150056633A
KR20150056633A KR1020157009892A KR20157009892A KR20150056633A KR 20150056633 A KR20150056633 A KR 20150056633A KR 1020157009892 A KR1020157009892 A KR 1020157009892A KR 20157009892 A KR20157009892 A KR 20157009892A KR 20150056633 A KR20150056633 A KR 20150056633A
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KR
South Korea
Prior art keywords
abrasive
wafer
polishing
substrate
microns
Prior art date
Application number
KR1020157009892A
Other languages
English (en)
Korean (ko)
Inventor
로버트 에이. 리주토
에이제이 크리쉬난
크리스토퍼 아코나
아난드 타니켈라
Original Assignee
생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 filed Critical 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드
Publication of KR20150056633A publication Critical patent/KR20150056633A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020157009892A 2012-09-28 2013-09-18 개량된 미세연마 방법 KR20150056633A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261707528P 2012-09-28 2012-09-28
US61/707,528 2012-09-28
PCT/US2013/060442 WO2014052130A1 (en) 2012-09-28 2013-09-18 Modified microgrinding process

Publications (1)

Publication Number Publication Date
KR20150056633A true KR20150056633A (ko) 2015-05-26

Family

ID=50385635

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157009892A KR20150056633A (ko) 2012-09-28 2013-09-18 개량된 미세연마 방법

Country Status (8)

Country Link
US (1) US20140094094A1 (zh)
JP (1) JP6120974B2 (zh)
KR (1) KR20150056633A (zh)
CN (1) CN104813448A (zh)
IN (1) IN2015DN03023A (zh)
RU (1) RU2015114097A (zh)
TW (1) TWI494981B (zh)
WO (1) WO2014052130A1 (zh)

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CN110018028B (zh) * 2019-04-17 2023-01-13 宸鸿科技(厦门)有限公司 一种蓝宝石基材电子组件的金相切片样品制备方法
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CN110900342B (zh) * 2019-11-29 2020-12-08 上海磐盟电子材料有限公司 一种磨片机
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
CN111761505B (zh) * 2020-07-10 2021-07-27 浙江中晶科技股份有限公司 一种硅片双面磨削设备及其生产工艺
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
JP7240013B2 (ja) * 2021-03-19 2023-03-15 大昌精機株式会社 立型研削盤
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CN114800109A (zh) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 双面抛光机及其抛光方法

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Also Published As

Publication number Publication date
TW201413809A (zh) 2014-04-01
RU2015114097A (ru) 2016-11-20
JP2015531318A (ja) 2015-11-02
US20140094094A1 (en) 2014-04-03
IN2015DN03023A (zh) 2015-10-02
JP6120974B2 (ja) 2017-04-26
CN104813448A (zh) 2015-07-29
WO2014052130A1 (en) 2014-04-03
TWI494981B (zh) 2015-08-01

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