KR20150016552A - 기재막 및 소결 방법 - Google Patents

기재막 및 소결 방법 Download PDF

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Publication number
KR20150016552A
KR20150016552A KR1020147034282A KR20147034282A KR20150016552A KR 20150016552 A KR20150016552 A KR 20150016552A KR 1020147034282 A KR1020147034282 A KR 1020147034282A KR 20147034282 A KR20147034282 A KR 20147034282A KR 20150016552 A KR20150016552 A KR 20150016552A
Authority
KR
South Korea
Prior art keywords
film
coating layer
functional thin
base film
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020147034282A
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English (en)
Korean (ko)
Inventor
쿠르트 에이. 슈로더
히로시 우치다
켄지 시노자키
Original Assignee
쇼와 덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 쇼와 덴코 가부시키가이샤 filed Critical 쇼와 덴코 가부시키가이샤
Publication of KR20150016552A publication Critical patent/KR20150016552A/ko
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G13/00—Electrographic processes using a charge pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Pest Control & Pesticides (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
KR1020147034282A 2012-06-05 2013-05-31 기재막 및 소결 방법 Ceased KR20150016552A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261655644P 2012-06-05 2012-06-05
US61/655,644 2012-06-05
PCT/IB2013/001254 WO2013182896A1 (en) 2012-06-05 2013-05-31 Substrate film and sintering method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020177004747A Division KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Publications (1)

Publication Number Publication Date
KR20150016552A true KR20150016552A (ko) 2015-02-12

Family

ID=49711481

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020147034282A Ceased KR20150016552A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020197017474A Active KR102122749B1 (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020177004747A Ceased KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020197017474A Active KR102122749B1 (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020177004747A Ceased KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Country Status (6)

Country Link
US (1) US9631283B2 (enExample)
EP (1) EP2855148B1 (enExample)
JP (1) JP6258303B2 (enExample)
KR (3) KR20150016552A (enExample)
CN (1) CN104797419B (enExample)
WO (1) WO2013182896A1 (enExample)

Cited By (1)

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WO2017073967A1 (ko) * 2015-10-26 2017-05-04 한국기계연구원 광소결을 이용한 패턴 형성 장치 및 이를 이용한 패턴 형성 방법

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US10060180B2 (en) 2010-01-16 2018-08-28 Cardinal Cg Company Flash-treated indium tin oxide coatings, production methods, and insulating glass unit transparent conductive coating technology
US10000965B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductive coating technology
US10000411B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductivity and low emissivity coating technology
JP5275498B1 (ja) * 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
KR102292668B1 (ko) * 2013-03-29 2021-08-24 다이요 홀딩스 가부시키가이샤 광 소성용 열가소성 수지 필름 기재, 이를 사용한 도전 회로 기판 및 그의 제조 방법
EP3122542B1 (en) * 2014-03-28 2019-06-05 Ez Print, LLC 3d print bed having permanent coating
CN209440968U (zh) * 2015-12-24 2019-09-27 株式会社村田制作所 树脂片
JP2017216303A (ja) * 2016-05-30 2017-12-07 株式会社リコー 回路部材用基材、回路部材、回路部材用基材の製造方法、及び回路部材の製造方法
KR102401226B1 (ko) * 2016-11-17 2022-05-24 니폰 가가쿠 고교 가부시키가이샤 아산화구리 입자, 그의 제조 방법, 광 소결형 조성물, 그것을 사용한 도전막의 형성 방법 및 아산화구리 입자 페이스트
CN109426397B (zh) * 2017-08-22 2020-08-04 京东方科技集团股份有限公司 触控结构的制备方法、触控结构
US11028012B2 (en) 2018-10-31 2021-06-08 Cardinal Cg Company Low solar heat gain coatings, laminated glass assemblies, and methods of producing same
US11267763B2 (en) 2019-05-17 2022-03-08 Raytheon Technologies Corporation Rapid processing of laminar composite components
DE102019114806A1 (de) * 2019-06-03 2020-12-03 Value & Intellectual Properties Management Gmbh Verfahren zur Herstellung elektrischer oder elektronischer Bauteile oder Schaltungen auf einem flexiblen flächigen Träger
WO2021019707A1 (ja) * 2019-07-31 2021-02-04 株式会社Ｆｕｊｉ ３次元積層造形による回路配線の製造方法
CN114051501A (zh) * 2019-09-05 2022-02-15 株式会社艾迪科 聚合性组合物、被覆结构体的制造方法、被覆结构体及被覆材
CN110577771A (zh) * 2019-09-17 2019-12-17 宁波石墨烯创新中心有限公司 一种导电油墨、rfid天线和电子标签及制备方法
JP2023017150A (ja) * 2021-07-26 2023-02-07 株式会社リコー 導体の製造方法、導体の製造装置、及び構造体
EP4274391A1 (en) 2022-05-06 2023-11-08 Ecole Polytechnique Federale De Lausanne (Epfl) Method for manufacturing an electrically conductive metal trace and corresponding metal trace, particularly suitable for transient electronic devices

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017073967A1 (ko) * 2015-10-26 2017-05-04 한국기계연구원 광소결을 이용한 패턴 형성 장치 및 이를 이용한 패턴 형성 방법

Also Published As

Publication number Publication date
CN104797419A (zh) 2015-07-22
EP2855148B1 (en) 2019-04-10
US9631283B2 (en) 2017-04-25
US20150225857A1 (en) 2015-08-13
JP2015528753A (ja) 2015-10-01
EP2855148A4 (en) 2016-01-20
JP6258303B2 (ja) 2018-01-10
WO2013182896A1 (en) 2013-12-12
EP2855148A1 (en) 2015-04-08
KR20170023202A (ko) 2017-03-02
CN104797419B (zh) 2018-02-23
KR102122749B1 (ko) 2020-06-15
KR20190075151A (ko) 2019-06-28

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