KR20140099258A - 차폐 필름, 차폐 프린트 배선판, 및 차폐 필름의 제조 방법 - Google Patents

차폐 필름, 차폐 프린트 배선판, 및 차폐 필름의 제조 방법 Download PDF

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Publication number
KR20140099258A
KR20140099258A KR20147014926A KR20147014926A KR20140099258A KR 20140099258 A KR20140099258 A KR 20140099258A KR 20147014926 A KR20147014926 A KR 20147014926A KR 20147014926 A KR20147014926 A KR 20147014926A KR 20140099258 A KR20140099258 A KR 20140099258A
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KR
South Korea
Prior art keywords
shielding film
metal layer
layer
shielding
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR20147014926A
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English (en)
Korean (ko)
Inventor
히로시 다지마
시로 야마우치
겐지 가미노
마사히로 와타나베
Original Assignee
다츠다 덴센 가부시키가이샤
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Application filed by 다츠다 덴센 가부시키가이샤 filed Critical 다츠다 덴센 가부시키가이샤
Publication of KR20140099258A publication Critical patent/KR20140099258A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49226—Electret making

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
KR20147014926A 2011-11-24 2012-10-12 차폐 필름, 차폐 프린트 배선판, 및 차폐 필름의 제조 방법 Ceased KR20140099258A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011256816 2011-11-24
JPJP-P-2011-256816 2011-11-24
PCT/JP2012/076473 WO2013077108A1 (ja) 2011-11-24 2012-10-12 シールドフィルム、シールドプリント配線板、及び、シールドフィルムの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020197026802A Division KR20190107768A (ko) 2011-11-24 2012-10-12 차폐 필름, 차폐 프린트 배선판, 및 차폐 필름의 제조 방법

Publications (1)

Publication Number Publication Date
KR20140099258A true KR20140099258A (ko) 2014-08-11

Family

ID=48469561

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020197026802A Ceased KR20190107768A (ko) 2011-11-24 2012-10-12 차폐 필름, 차폐 프린트 배선판, 및 차폐 필름의 제조 방법
KR20147014926A Ceased KR20140099258A (ko) 2011-11-24 2012-10-12 차폐 필름, 차폐 프린트 배선판, 및 차폐 필름의 제조 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020197026802A Ceased KR20190107768A (ko) 2011-11-24 2012-10-12 차폐 필름, 차폐 프린트 배선판, 및 차폐 필름의 제조 방법

Country Status (6)

Country Link
US (2) US10015915B2 (enExample)
JP (5) JPWO2013077108A1 (enExample)
KR (2) KR20190107768A (enExample)
CN (2) CN103140126A (enExample)
TW (1) TWI596998B (enExample)
WO (1) WO2013077108A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
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KR20170140350A (ko) * 2015-05-26 2017-12-20 다츠다 덴센 가부시키가이샤 차폐 필름 및 차폐 프린트 배선판
KR20180108345A (ko) * 2017-03-24 2018-10-04 (주)창성 롤투롤 공정을 이용한 fpcb용 다층 전자파 차폐 필름 제조방법
KR20190073037A (ko) * 2017-12-18 2019-06-26 주식회사 잉크테크 전자파 차폐필름, 인쇄회로기판 제조방법 및 전자파 차폐필름 제조방법

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JPWO2013077108A1 (ja) * 2011-11-24 2015-04-27 タツタ電線株式会社 シールドフィルム、シールドプリント配線板、及び、シールドフィルムの製造方法
JP6368711B2 (ja) * 2013-05-28 2018-08-01 タツタ電線株式会社 形状保持シールドフィルム、及びこの形状保持シールドフィルムを備えた形状保持型シールドフレキシブル配線板
JP6139284B2 (ja) * 2013-06-11 2017-05-31 住友電工プリントサーキット株式会社 シールドフィルム及びプリント配線板
TWI573498B (zh) * 2013-07-26 2017-03-01 Adv Flexible Circuits Co Ltd The flattened cladding structure of soft circuit board
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CN104582240B (zh) * 2013-10-25 2017-08-25 富葵精密组件(深圳)有限公司 电路板及电路板制作方法
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JP6184025B2 (ja) * 2014-09-04 2017-08-23 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
JP6467701B2 (ja) * 2014-10-28 2019-02-13 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
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WO2016092691A1 (ja) * 2014-12-12 2016-06-16 株式会社メイコー モールド回路モジュール及びその製造方法
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KR102280175B1 (ko) * 2016-03-23 2021-07-20 타츠타 전선 주식회사 전자파 차폐 필름
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JP5139156B2 (ja) 2008-05-30 2013-02-06 タツタ電線株式会社 電磁波シールド材及びプリント配線板
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KR20170140350A (ko) * 2015-05-26 2017-12-20 다츠다 덴센 가부시키가이샤 차폐 필름 및 차폐 프린트 배선판
US10196545B2 (en) 2015-05-26 2019-02-05 Tatsuta Electric Wire & Cable Co., Ltd. Shielding film and shielded printed wiring board
KR20180108345A (ko) * 2017-03-24 2018-10-04 (주)창성 롤투롤 공정을 이용한 fpcb용 다층 전자파 차폐 필름 제조방법
KR20190073037A (ko) * 2017-12-18 2019-06-26 주식회사 잉크테크 전자파 차폐필름, 인쇄회로기판 제조방법 및 전자파 차폐필름 제조방법

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WO2013077108A1 (ja) 2013-05-30
KR20190107768A (ko) 2019-09-20
US10015915B2 (en) 2018-07-03
US20160205817A1 (en) 2016-07-14
US10051765B2 (en) 2018-08-14
US20140326484A1 (en) 2014-11-06
JP2016036044A (ja) 2016-03-17
JP6321535B2 (ja) 2018-05-09
JP2019083205A (ja) 2019-05-30
JPWO2013077108A1 (ja) 2015-04-27
JP2015109449A (ja) 2015-06-11
TW201322836A (zh) 2013-06-01
CN203225988U (zh) 2013-10-02
CN103140126A (zh) 2013-06-05
JP2016040837A (ja) 2016-03-24

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