CN102387656B - 具有接地屏蔽结构的电路板及其制作方法 - Google Patents
具有接地屏蔽结构的电路板及其制作方法 Download PDFInfo
- Publication number
- CN102387656B CN102387656B CN2010102668264A CN201010266826A CN102387656B CN 102387656 B CN102387656 B CN 102387656B CN 2010102668264 A CN2010102668264 A CN 2010102668264A CN 201010266826 A CN201010266826 A CN 201010266826A CN 102387656 B CN102387656 B CN 102387656B
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive adhesive
- circuit
- circuit board
- weld pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102668264A CN102387656B (zh) | 2010-08-30 | 2010-08-30 | 具有接地屏蔽结构的电路板及其制作方法 |
US13/117,159 US8648261B2 (en) | 2010-08-30 | 2011-05-27 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102668264A CN102387656B (zh) | 2010-08-30 | 2010-08-30 | 具有接地屏蔽结构的电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102387656A CN102387656A (zh) | 2012-03-21 |
CN102387656B true CN102387656B (zh) | 2013-10-09 |
Family
ID=45695632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102668264A Active CN102387656B (zh) | 2010-08-30 | 2010-08-30 | 具有接地屏蔽结构的电路板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8648261B2 (zh) |
CN (1) | CN102387656B (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011018873A (ja) * | 2009-05-22 | 2011-01-27 | Sony Ericsson Mobilecommunications Japan Inc | 電磁シールド方法および電磁シールド用フィルム |
KR20140099258A (ko) | 2011-11-24 | 2014-08-11 | 다츠다 덴센 가부시키가이샤 | 차폐 필름, 차폐 프린트 배선판, 및 차폐 필름의 제조 방법 |
DE102012212087A1 (de) * | 2012-07-11 | 2014-01-16 | Robert Bosch Gmbh | Leiterplatte mit einer Lotmittel führenden Kapillare |
EP2739126B1 (en) | 2012-11-30 | 2021-06-30 | Airbus Operations GmbH | Electronic device |
CN104080280B (zh) * | 2013-03-26 | 2017-08-08 | 深南电路有限公司 | 一种封装基板单元及其制作方法和基板组件 |
CN103763893B (zh) * | 2014-01-14 | 2016-04-13 | 广州方邦电子股份有限公司 | 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法 |
CN105101762B (zh) * | 2014-05-06 | 2018-08-07 | 昆山雅森电子材料科技有限公司 | 薄型化高传输电磁干扰屏蔽膜及其制造方法和应用 |
CN104332217B (zh) * | 2014-10-08 | 2018-04-10 | 广州方邦电子股份有限公司 | 自由接地膜及其制作方法、包含自由接地膜的屏蔽线路板及接地方法 |
CN105828587A (zh) * | 2015-01-06 | 2016-08-03 | 富葵精密组件(深圳)有限公司 | 感光油墨及应用其的电磁屏蔽结构、电路板、电子装置 |
CN106612609B (zh) * | 2015-10-26 | 2024-03-26 | 昆山雅森电子材料科技有限公司 | 轻薄型黑色导电胶膜 |
CN105828517B (zh) * | 2016-05-11 | 2019-03-15 | 昆山龙朋精密电子有限公司 | 一种低损耗高柔性高频传输的fpc板的制备方法 |
CN105848409B (zh) * | 2016-05-11 | 2019-03-19 | 昆山龙朋精密电子有限公司 | 一种低损耗高柔性高频传输的fpc板 |
CN107660112B (zh) * | 2016-07-25 | 2019-12-27 | 鹏鼎控股(深圳)股份有限公司 | 电磁屏蔽罩及其制造方法 |
JP6935702B2 (ja) * | 2016-10-24 | 2021-09-15 | デクセリアルズ株式会社 | 異方性導電フィルム |
WO2019031555A1 (ja) * | 2017-08-09 | 2019-02-14 | タツタ電線株式会社 | 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 |
CN108427520A (zh) * | 2018-04-02 | 2018-08-21 | 业成科技(成都)有限公司 | 触控面板与其制造方法 |
KR102640186B1 (ko) * | 2018-12-03 | 2024-02-22 | 타츠타 전선 주식회사 | 그라운드 부재 및 차폐 프린트 배선판 |
JP7363103B2 (ja) | 2019-05-30 | 2023-10-18 | 東洋インキScホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
TWI751506B (zh) * | 2020-03-06 | 2022-01-01 | 欣興電子股份有限公司 | 線路板及其製造方法 |
CN111526706A (zh) * | 2020-04-20 | 2020-08-11 | 京东方科技集团股份有限公司 | 一种导电布、电子元件及显示装置 |
WO2022217549A1 (en) * | 2021-04-15 | 2022-10-20 | Aes Global Holdings Pte Ltd. | Printed circuit board grounding |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101742814A (zh) * | 2009-12-22 | 2010-06-16 | 深圳华为通信技术有限公司 | 一种印刷电路板屏蔽方法及印刷电路板 |
CN102026529A (zh) * | 2009-09-18 | 2011-04-20 | 大自达电线株式会社 | 屏蔽膜、具有该屏蔽膜的屏蔽配线板、屏蔽膜的接地方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7009297B1 (en) * | 2000-10-13 | 2006-03-07 | Bridge Semiconductor Corporation | Semiconductor chip assembly with embedded metal particle |
US7264991B1 (en) * | 2000-10-13 | 2007-09-04 | Bridge Semiconductor Corporation | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive |
JP2006024824A (ja) * | 2004-07-09 | 2006-01-26 | Tatsuta System Electronics Kk | インピーダンスコントロールフィルム、インピーダンスコントロールシールドフィルム及びそれを用いた配線板 |
TWI398198B (zh) * | 2010-09-13 | 2013-06-01 | Zhen Ding Technology Co Ltd | 具有接地屏蔽結構之電路板及其製作方法 |
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2010
- 2010-08-30 CN CN2010102668264A patent/CN102387656B/zh active Active
-
2011
- 2011-05-27 US US13/117,159 patent/US8648261B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102026529A (zh) * | 2009-09-18 | 2011-04-20 | 大自达电线株式会社 | 屏蔽膜、具有该屏蔽膜的屏蔽配线板、屏蔽膜的接地方法 |
CN101742814A (zh) * | 2009-12-22 | 2010-06-16 | 深圳华为通信技术有限公司 | 一种印刷电路板屏蔽方法及印刷电路板 |
Non-Patent Citations (1)
Title |
---|
JP特开2006-24824A 2006.01.26 |
Also Published As
Publication number | Publication date |
---|---|
US20120048603A1 (en) | 2012-03-01 |
CN102387656A (zh) | 2012-03-21 |
US8648261B2 (en) | 2014-02-11 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
CP03 | Change of name, title or address |