KR20140034210A - 내부식성 전기 도전체 - Google Patents

내부식성 전기 도전체 Download PDF

Info

Publication number
KR20140034210A
KR20140034210A KR1020137032521A KR20137032521A KR20140034210A KR 20140034210 A KR20140034210 A KR 20140034210A KR 1020137032521 A KR1020137032521 A KR 1020137032521A KR 20137032521 A KR20137032521 A KR 20137032521A KR 20140034210 A KR20140034210 A KR 20140034210A
Authority
KR
South Korea
Prior art keywords
plating layer
seal
nickel
layer
metal substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020137032521A
Other languages
English (en)
Korean (ko)
Inventor
조지 지샨 슈
로버트 다니엘 힐티
Original Assignee
타이코 일렉트로닉스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 타이코 일렉트로닉스 코포레이션 filed Critical 타이코 일렉트로닉스 코포레이션
Publication of KR20140034210A publication Critical patent/KR20140034210A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/028—Including graded layers in composition or in physical properties, e.g. density, porosity, grain size
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020137032521A 2011-05-09 2012-04-17 내부식성 전기 도전체 Ceased KR20140034210A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/103,552 2011-05-09
US13/103,552 US8574722B2 (en) 2011-05-09 2011-05-09 Corrosion resistant electrical conductor
PCT/US2012/033886 WO2012154374A1 (en) 2011-05-09 2012-04-17 Corrosion resistant electrical conductor

Publications (1)

Publication Number Publication Date
KR20140034210A true KR20140034210A (ko) 2014-03-19

Family

ID=45992872

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137032521A Ceased KR20140034210A (ko) 2011-05-09 2012-04-17 내부식성 전기 도전체

Country Status (7)

Country Link
US (2) US8574722B2 (enExample)
EP (1) EP2707522A1 (enExample)
JP (1) JP2014519548A (enExample)
KR (1) KR20140034210A (enExample)
CN (1) CN103518006A (enExample)
BR (1) BR112013028717A2 (enExample)
WO (1) WO2012154374A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8652649B2 (en) 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
KR20140047077A (ko) * 2011-06-23 2014-04-21 엑스탤릭 코포레이션 전착 코팅을 포함하는 인쇄 회로 기판 및 관련 물품
JP6089341B2 (ja) * 2011-12-22 2017-03-08 オーエム産業株式会社 めっき品及びその製造方法
JP5966874B2 (ja) * 2012-01-27 2016-08-10 Tdk株式会社 構造体、及びそれを含む電子部品、プリント配線板
US9142902B2 (en) 2013-08-01 2015-09-22 Lear Corporation Electrical terminal assembly
US9190756B2 (en) 2013-08-01 2015-11-17 Lear Corporation Electrical terminal assembly
JP2015110829A (ja) * 2013-10-30 2015-06-18 三菱マテリアル株式会社 錫めっき銅合金端子材
US9711926B2 (en) 2013-11-19 2017-07-18 Lear Corporation Method of forming an interface for an electrical terminal
US20180097325A1 (en) * 2016-10-03 2018-04-05 Tyco Electronics Corporation Corrosion Protection System and Method for Use with Electrical Contacts
DE202017104061U1 (de) * 2017-07-07 2018-10-09 Aixtron Se Beschichtungseinrichtung mit beschichteter Sendespule
JP7230570B2 (ja) * 2019-02-18 2023-03-01 三菱マテリアル株式会社 コネクタ端子用導電部材及びコネクタ端子
WO2021020064A1 (ja) 2019-07-31 2021-02-04 昭和電工株式会社 積層体およびその製造方法
EP4043611A4 (en) * 2019-10-10 2023-11-01 Resonac Corporation MULTI-LAYER BODY AND PRODUCTION PROCESS THEREOF
US20240247379A1 (en) * 2023-01-20 2024-07-25 Applied Materials, Inc. Formation of metallic films on electroless metal plating of surfaces

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855521A (ja) * 1994-08-10 1996-02-27 Mitsubishi Shindoh Co Ltd 通電部材およびその製造方法
JP2002129375A (ja) * 2000-10-24 2002-05-09 Suzuka National College Of Technology すずーニッケル合金膜の製造方法
KR20070057682A (ko) * 2005-12-01 2007-06-07 에이에스엠 어쌤블리 오토메이션 리미티드 주석 도금 또는 이로부터 형성된 금속간층을 포함하는리드프레임
JP2009076322A (ja) * 2007-09-20 2009-04-09 Sumitomo Electric Ind Ltd フレキシブルフラットケーブルおよびその製造方法
US20090291321A1 (en) * 2004-09-28 2009-11-26 Lsi Corporation Whisker-free lead frames

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61202786A (ja) * 1985-03-05 1986-09-08 Tanaka Kikinzoku Kogyo Kk 装飾品用複合素材及びその製造方法
JPH07109830B2 (ja) * 1990-10-22 1995-11-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 薄膜積層体における障壁の改良
JPH0798996B2 (ja) * 1992-12-28 1995-10-25 株式会社八光電機製作所 金メッキ処理を施したコネクター用接触子
US5360991A (en) * 1993-07-29 1994-11-01 At&T Bell Laboratories Integrated circuit devices with solderable lead frame
JPH10134869A (ja) * 1996-10-30 1998-05-22 Yazaki Corp 端子材料および端子
JP4489232B2 (ja) * 1999-06-14 2010-06-23 日鉱金属株式会社 コネクタ用めっき材料
JP2001094238A (ja) 1999-07-16 2001-04-06 Sharp Corp 金属配線の製造方法およびその金属配線を備えた配線基板
US6130479A (en) * 1999-08-02 2000-10-10 International Business Machines Corporation Nickel alloy films for reduced intermetallic formation in solder
EP1260609A4 (en) 2000-02-24 2005-01-05 Ibiden Co Ltd NICKEL GOLD PLATING WITH HIGH CORROSION RESISTANCE
JP4598238B2 (ja) * 2000-06-01 2010-12-15 常木鍍金工業株式会社 接点部材及びその製造方法
JP4285753B2 (ja) * 2004-06-21 2009-06-24 田中貴金属工業株式会社 ハーメチックシールカバー及びその製造方法
JP4934456B2 (ja) * 2006-02-20 2012-05-16 古河電気工業株式会社 めっき材料および前記めっき材料が用いられた電気電子部品
JP4374366B2 (ja) 2006-10-18 2009-12-02 アルプス電気株式会社 スイッチ装置に用いられる回路基板の製造方法
DE102007047007A1 (de) 2007-10-01 2009-04-09 Tyco Electronics Amp Gmbh Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben
JP2009097053A (ja) * 2007-10-19 2009-05-07 Hitachi Ltd 金属条、コネクタ、および金属条の製造方法
JP4706690B2 (ja) * 2007-11-05 2011-06-22 パナソニック電工株式会社 回路基板及びその製造方法
JP5246503B2 (ja) * 2009-02-23 2013-07-24 住友電装株式会社 端子金具
JP5384382B2 (ja) * 2009-03-26 2014-01-08 株式会社神戸製鋼所 耐熱性に優れるＳｎめっき付き銅又は銅合金及びその製造方法
US8652649B2 (en) 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855521A (ja) * 1994-08-10 1996-02-27 Mitsubishi Shindoh Co Ltd 通電部材およびその製造方法
JP2002129375A (ja) * 2000-10-24 2002-05-09 Suzuka National College Of Technology すずーニッケル合金膜の製造方法
US20090291321A1 (en) * 2004-09-28 2009-11-26 Lsi Corporation Whisker-free lead frames
KR20070057682A (ko) * 2005-12-01 2007-06-07 에이에스엠 어쌤블리 오토메이션 리미티드 주석 도금 또는 이로부터 형성된 금속간층을 포함하는리드프레임
JP2009076322A (ja) * 2007-09-20 2009-04-09 Sumitomo Electric Ind Ltd フレキシブルフラットケーブルおよびその製造方法

Also Published As

Publication number Publication date
US20120285720A1 (en) 2012-11-15
EP2707522A1 (en) 2014-03-19
WO2012154374A1 (en) 2012-11-15
US20140023880A1 (en) 2014-01-23
JP2014519548A (ja) 2014-08-14
CN103518006A (zh) 2014-01-15
US9064613B2 (en) 2015-06-23
US8574722B2 (en) 2013-11-05
BR112013028717A2 (pt) 2017-01-24

Similar Documents

Publication Publication Date Title
KR20140034210A (ko) 내부식성 전기 도전체
KR101370137B1 (ko) 전기전자 부품용 복합재료 및 그것을 이용한 전기전자 부품
JP4402132B2 (ja) リフローＳｎめっき材及びそれを用いた電子部品
JP5215305B2 (ja) 電子部品の製造方法及び該方法により製造する電子部品
JP4708357B2 (ja) 耐フレッチング性及び耐ウィスカー性の被覆装置
JP4940081B2 (ja) リフローＳｎめっき材及びそれを用いた電子部品
JP2002317295A (ja) リフロー処理Ｓｎ合金めっき材料、それを用いた嵌合型接続端子
CN100407503C (zh) 端子及其电镀方法
US20120058692A1 (en) Contact of electrical connector and plating method thereof
KR101184875B1 (ko) 전기 접속단자 구조체 및 이의 제조방법
JP4805409B2 (ja) 電気電子部品用複合材料およびそれを用いた電気電子部品
KR20140016470A (ko) 내식성 및 내마모성이 우수한 단자를 구비하는 인쇄회로기판 및 그 제조 방법
CN102394413A (zh) 电子部件
CN102055099A (zh) 电连接器端子及其电镀方法
TW201114114A (en) Electrical connector contact and electroplating method thereof
JP2006161127A (ja) 嵌合型接続端子に適した電子材料とその製造方法
JP5964478B2 (ja) コネクタ
KR102075469B1 (ko) 커넥터 및 이의 제조방법
JP4856745B2 (ja) フレキシブル基板用導体およびその製造方法並びにフレキシブル基板

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20131206

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20170321

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20180102

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20181129

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20180102

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I