KR20140002746A - 기판 전단 방법 및 장치 - Google Patents

기판 전단 방법 및 장치 Download PDF

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Publication number
KR20140002746A
KR20140002746A KR1020137022734A KR20137022734A KR20140002746A KR 20140002746 A KR20140002746 A KR 20140002746A KR 1020137022734 A KR1020137022734 A KR 1020137022734A KR 20137022734 A KR20137022734 A KR 20137022734A KR 20140002746 A KR20140002746 A KR 20140002746A
Authority
KR
South Korea
Prior art keywords
mold
substrate
convex portion
shearing
support
Prior art date
Application number
KR1020137022734A
Other languages
English (en)
Korean (ko)
Inventor
카주마로 나이토
Original Assignee
메이코 일렉트로닉스 컴파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 메이코 일렉트로닉스 컴파니 리미티드 filed Critical 메이코 일렉트로닉스 컴파니 리미티드
Publication of KR20140002746A publication Critical patent/KR20140002746A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
    • B21D28/16—Shoulder or burr prevention, e.g. fine-blanking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR1020137022734A 2011-03-24 2011-03-24 기판 전단 방법 및 장치 KR20140002746A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/057080 WO2012127672A1 (ja) 2011-03-24 2011-03-24 基板剪断方法及び装置

Publications (1)

Publication Number Publication Date
KR20140002746A true KR20140002746A (ko) 2014-01-08

Family

ID=46878865

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137022734A KR20140002746A (ko) 2011-03-24 2011-03-24 기판 전단 방법 및 장치

Country Status (5)

Country Link
JP (1) JP5499218B2 (ja)
KR (1) KR20140002746A (ja)
CN (1) CN103442860B (ja)
TW (1) TWI492685B (ja)
WO (1) WO2012127672A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104476943A (zh) * 2014-11-28 2015-04-01 江西铜鼓江桥竹木业有限责任公司 一种竹质名片、制作方法及冲压刀具
CH716830A1 (de) 2019-11-22 2021-05-31 Soudronic Ag Verfahren und Vorrichtungen zur Herstellung von Aufreissdeckeln.

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61142615A (ja) * 1984-12-17 1986-06-30 株式会社東芝 電子装置用合成樹脂製ホルダの製造方法
CN2721273Y (zh) * 2004-05-25 2005-08-31 河南新飞电器有限公司 双向冲裁模具
JP2006198738A (ja) * 2005-01-21 2006-08-03 Yoshiharu Fujiwara プリント基板打抜き用金型
CN200984602Y (zh) * 2006-08-28 2007-12-05 无锡相川铁龙电子有限公司 笔记本电脑读卡器超薄构件的冲裁模具
TWM393131U (en) * 2010-04-02 2010-11-21 Techmech Technologies Corp Improved structure of circuit board cutter
CN201669335U (zh) * 2010-05-07 2010-12-15 福州鑫威电器有限公司 一种被冲裁件断裂面规则的冲压模
CN201728265U (zh) * 2010-07-05 2011-02-02 上海德朗汽车零部件制造有限公司 一种空调用全铝水室切边模具

Also Published As

Publication number Publication date
JPWO2012127672A1 (ja) 2014-07-24
CN103442860B (zh) 2015-07-22
TWI492685B (zh) 2015-07-11
JP5499218B2 (ja) 2014-05-21
WO2012127672A1 (ja) 2012-09-27
TW201242459A (en) 2012-10-16
CN103442860A (zh) 2013-12-11

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E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E601 Decision to refuse application