KR20130127921A - 도금 장치 및 도금액 관리 방법 - Google Patents

도금 장치 및 도금액 관리 방법 Download PDF

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Publication number
KR20130127921A
KR20130127921A KR1020130052387A KR20130052387A KR20130127921A KR 20130127921 A KR20130127921 A KR 20130127921A KR 1020130052387 A KR1020130052387 A KR 1020130052387A KR 20130052387 A KR20130052387 A KR 20130052387A KR 20130127921 A KR20130127921 A KR 20130127921A
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KR
South Korea
Prior art keywords
plating
plating liquid
dialysis
tank
line
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Ceased
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KR1020130052387A
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English (en)
Korean (ko)
Inventor
유지 아라키
마사시 시모야마
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20130127921A publication Critical patent/KR20130127921A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/22—Regeneration of process solutions by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
KR1020130052387A 2012-05-15 2013-05-09 도금 장치 및 도금액 관리 방법 Ceased KR20130127921A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-111115 2012-05-15
JP2012111115A JP5876767B2 (ja) 2012-05-15 2012-05-15 めっき装置及びめっき液管理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020160100330A Division KR20160098144A (ko) 2012-05-15 2016-08-05 도금 장치 및 도금액 관리 방법

Publications (1)

Publication Number Publication Date
KR20130127921A true KR20130127921A (ko) 2013-11-25

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020130052387A Ceased KR20130127921A (ko) 2012-05-15 2013-05-09 도금 장치 및 도금액 관리 방법
KR1020160100330A Withdrawn KR20160098144A (ko) 2012-05-15 2016-08-05 도금 장치 및 도금액 관리 방법

Family Applications After (1)

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KR1020160100330A Withdrawn KR20160098144A (ko) 2012-05-15 2016-08-05 도금 장치 및 도금액 관리 방법

Country Status (6)

Country Link
US (1) US20130306483A1 (enrdf_load_stackoverflow)
EP (1) EP2664692A3 (enrdf_load_stackoverflow)
JP (1) JP5876767B2 (enrdf_load_stackoverflow)
KR (2) KR20130127921A (enrdf_load_stackoverflow)
CN (1) CN103422140A (enrdf_load_stackoverflow)
TW (1) TW201350625A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101631484B1 (ko) 2014-12-19 2016-06-17 주식회사 포스코 니켈도금용액 관리 장치

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JP6022922B2 (ja) * 2012-12-13 2016-11-09 株式会社荏原製作所 Ｓｎ合金めっき装置及び方法
US20150247251A1 (en) * 2014-02-28 2015-09-03 Applied Materials, Inc. Methods for electrochemical deposition of multi-component solder using cation permeable barrier
CN105177646B (zh) * 2015-08-27 2017-12-08 江苏智光创业投资有限公司 一种用于生产无氰镀铜溶液的装置
KR102002342B1 (ko) * 2018-06-28 2019-07-23 김대범 도금액 교반 및 공급 장치
JP7293765B2 (ja) * 2018-07-24 2023-06-20 富士フイルムビジネスイノベーション株式会社 めっき装置
CN110161306A (zh) * 2019-05-31 2019-08-23 苏州迅鹏仪器仪表有限公司 多回路安培小时总计量仪表和电镀控制系统及方法
CN110318090B (zh) * 2019-08-08 2021-08-31 湖南金康电路板有限公司 一种印刷电路板电镀装置及电镀方法
CN111663172A (zh) * 2020-05-28 2020-09-15 甬矽电子(宁波)股份有限公司 电镀化学品监控方法、系统和装置
KR102192890B1 (ko) * 2020-07-10 2020-12-18 김춘옥 유전체 세라믹 필터 디핑 방법
JP7484865B2 (ja) * 2021-10-14 2024-05-16 トヨタ自動車株式会社 金属皮膜の成膜装置および金属皮膜の成膜方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101631484B1 (ko) 2014-12-19 2016-06-17 주식회사 포스코 니켈도금용액 관리 장치

Also Published As

Publication number Publication date
EP2664692A2 (en) 2013-11-20
JP5876767B2 (ja) 2016-03-02
US20130306483A1 (en) 2013-11-21
TW201350625A (zh) 2013-12-16
KR20160098144A (ko) 2016-08-18
JP2013237894A (ja) 2013-11-28
EP2664692A3 (en) 2017-02-15
TWI560325B (enrdf_load_stackoverflow) 2016-12-01
CN103422140A (zh) 2013-12-04

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