EP2664692A3 - Plating apparatus and plating solution management method - Google Patents

Plating apparatus and plating solution management method Download PDF

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Publication number
EP2664692A3
EP2664692A3 EP13020015.7A EP13020015A EP2664692A3 EP 2664692 A3 EP2664692 A3 EP 2664692A3 EP 13020015 A EP13020015 A EP 13020015A EP 2664692 A3 EP2664692 A3 EP 2664692A3
Authority
EP
European Patent Office
Prior art keywords
plating solution
plating
free acid
dialysis
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13020015.7A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2664692A2 (en
Inventor
Yuji Araki
Masashi Shimoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of EP2664692A2 publication Critical patent/EP2664692A2/en
Publication of EP2664692A3 publication Critical patent/EP2664692A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/22—Regeneration of process solutions by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
EP13020015.7A 2012-05-15 2013-05-14 Plating apparatus and plating solution management method Withdrawn EP2664692A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012111115A JP5876767B2 (ja) 2012-05-15 2012-05-15 めっき装置及びめっき液管理方法

Publications (2)

Publication Number Publication Date
EP2664692A2 EP2664692A2 (en) 2013-11-20
EP2664692A3 true EP2664692A3 (en) 2017-02-15

Family

ID=48463682

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13020015.7A Withdrawn EP2664692A3 (en) 2012-05-15 2013-05-14 Plating apparatus and plating solution management method

Country Status (6)

Country Link
US (1) US20130306483A1 (enrdf_load_stackoverflow)
EP (1) EP2664692A3 (enrdf_load_stackoverflow)
JP (1) JP5876767B2 (enrdf_load_stackoverflow)
KR (2) KR20130127921A (enrdf_load_stackoverflow)
CN (1) CN103422140A (enrdf_load_stackoverflow)
TW (1) TW201350625A (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6022922B2 (ja) * 2012-12-13 2016-11-09 株式会社荏原製作所 Ｓｎ合金めっき装置及び方法
US20150247251A1 (en) * 2014-02-28 2015-09-03 Applied Materials, Inc. Methods for electrochemical deposition of multi-component solder using cation permeable barrier
KR101631484B1 (ko) 2014-12-19 2016-06-17 주식회사 포스코 니켈도금용액 관리 장치
CN105177646B (zh) * 2015-08-27 2017-12-08 江苏智光创业投资有限公司 一种用于生产无氰镀铜溶液的装置
KR102002342B1 (ko) * 2018-06-28 2019-07-23 김대범 도금액 교반 및 공급 장치
JP7293765B2 (ja) * 2018-07-24 2023-06-20 富士フイルムビジネスイノベーション株式会社 めっき装置
CN110161306A (zh) * 2019-05-31 2019-08-23 苏州迅鹏仪器仪表有限公司 多回路安培小时总计量仪表和电镀控制系统及方法
CN110318090B (zh) * 2019-08-08 2021-08-31 湖南金康电路板有限公司 一种印刷电路板电镀装置及电镀方法
CN111663172A (zh) * 2020-05-28 2020-09-15 甬矽电子(宁波)股份有限公司 电镀化学品监控方法、系统和装置
KR102192890B1 (ko) * 2020-07-10 2020-12-18 김춘옥 유전체 세라믹 필터 디핑 방법
JP7484865B2 (ja) * 2021-10-14 2024-05-16 トヨタ自動車株式会社 金属皮膜の成膜装置および金属皮膜の成膜方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729600A (en) * 1980-07-26 1982-02-17 Sumitomo Metal Ind Ltd Method for adjusting ph value of electroplating bath
GB2111080A (en) * 1981-12-08 1983-06-29 Ppg Industries Inc Electrodeposition bath treatment
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
JP2002241991A (ja) * 2001-02-14 2002-08-28 Canon Inc 酸化亜鉛膜の成膜方法及び成膜装置
JP2005139474A (ja) * 2003-11-04 2005-06-02 Ishihara Chem Co Ltd 電気スズ合金メッキ方法

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US3244620A (en) * 1964-11-02 1966-04-05 Dow Chemical Co Separation of acid from polymers by dialysis with anion-exchange membranes
DE2729387A1 (de) * 1977-06-27 1979-01-18 Schering Ag Verfahren zur kontinuierlichen aufbereitung eines galvanischen nickelbades sowie vorrichtung zur durchfuehrung des verfahrens
FI71573C (fi) * 1979-06-15 1987-01-19 Akzo Nv Foerfarande och anordning foer minskning av jaesta dryckers alkoholhalt genom dialys.
JPS5928584A (ja) 1982-08-10 1984-02-15 Asahi Glass Co Ltd 電解槽又は透析槽への液の供給方法
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
US4816407A (en) * 1985-10-11 1989-03-28 Sepracor Inc. Production of low-ethanol beverages by membrane extraction
JPH01312099A (ja) 1988-06-10 1989-12-15 Asahi Glass Co Ltd 電気メッキ浴の管理方法
DE4106080A1 (de) * 1991-02-27 1991-06-20 Volker Dipl Ing Teuchert Verfahren zur automatischen regelung der konzentration eines stoffes in der aus einem zur reduzierung der konzentration dieses stoffes eingesetzten dialysators austretenden fluessigkeit
JP2559935B2 (ja) * 1991-12-20 1996-12-04 日本リーロナール株式会社 不溶性陽極を用いた錫又は錫ー鉛合金電気めっきの方法及び装置
JP2888001B2 (ja) * 1992-01-09 1999-05-10 日本電気株式会社 金属メッキ装置
JP3066675B2 (ja) * 1992-04-20 2000-07-17 富士写真フイルム株式会社 印刷版用アルミニウム板の表面処理方法
JP3437600B2 (ja) * 1993-03-15 2003-08-18 株式会社荏原製作所 はんだめっき液自動分析方法及び装置
JP3213113B2 (ja) * 1993-03-15 2001-10-02 株式会社荏原製作所 はんだめっき液自動管理装置
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
JP3241227B2 (ja) * 1995-02-14 2001-12-25 株式会社東芝 メッキ液自動管理装置
JPH08271497A (ja) * 1995-03-29 1996-10-18 C Uyemura & Co Ltd 電気銅めっき浴中の電解生成物濃度の測定方法
JPH0975681A (ja) 1995-09-13 1997-03-25 Japan Nuclear Fuel Co Ltd<Jnf> 拡散透析装置及び方法
US6562220B2 (en) * 1999-03-19 2003-05-13 Technic, Inc. Metal alloy sulfate electroplating baths
JP4698904B2 (ja) 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
US7012333B2 (en) * 2002-12-26 2006-03-14 Ebara Corporation Lead free bump and method of forming the same
KR20060043958A (ko) * 2004-11-11 2006-05-16 주식회사 팬택 이동통신단말기를 이용한 설문조사 방법
KR20070118694A (ko) * 2005-05-25 2007-12-17 가부시키가이샤 씽크. 라보라토리 그라비아 실린더용 구리도금방법 및 장치
JP4812365B2 (ja) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 錫電気めっき液および錫電気めっき方法
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
EP2194165A1 (en) * 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
JP5458604B2 (ja) * 2009-03-04 2014-04-02 三菱マテリアル株式会社 Ｓｎ合金めっき装置及びそのＳｎ成分補給方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729600A (en) * 1980-07-26 1982-02-17 Sumitomo Metal Ind Ltd Method for adjusting ph value of electroplating bath
GB2111080A (en) * 1981-12-08 1983-06-29 Ppg Industries Inc Electrodeposition bath treatment
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
JP2002241991A (ja) * 2001-02-14 2002-08-28 Canon Inc 酸化亜鉛膜の成膜方法及び成膜装置
JP2005139474A (ja) * 2003-11-04 2005-06-02 Ishihara Chem Co Ltd 電気スズ合金メッキ方法

Also Published As

Publication number Publication date
EP2664692A2 (en) 2013-11-20
JP5876767B2 (ja) 2016-03-02
US20130306483A1 (en) 2013-11-21
TW201350625A (zh) 2013-12-16
KR20160098144A (ko) 2016-08-18
JP2013237894A (ja) 2013-11-28
KR20130127921A (ko) 2013-11-25
TWI560325B (enrdf_load_stackoverflow) 2016-12-01
CN103422140A (zh) 2013-12-04

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