KR20120125326A - 반도체 발광 소자, 반도체 발광 소자의 보호막 및 그 제작 방법 - Google Patents
반도체 발광 소자, 반도체 발광 소자의 보호막 및 그 제작 방법 Download PDFInfo
- Publication number
- KR20120125326A KR20120125326A KR1020127022725A KR20127022725A KR20120125326A KR 20120125326 A KR20120125326 A KR 20120125326A KR 1020127022725 A KR1020127022725 A KR 1020127022725A KR 20127022725 A KR20127022725 A KR 20127022725A KR 20120125326 A KR20120125326 A KR 20120125326A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- protective film
- semiconductor light
- emitting element
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/034—Manufacture or treatment of coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/981—Auxiliary members, e.g. spacers
- H10W72/983—Reinforcing structures, e.g. collars
Landscapes
- Led Devices (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010104443A JP2011233784A (ja) | 2010-04-28 | 2010-04-28 | 半導体発光素子、半導体発光素子の保護膜及びその作製方法 |
| JPJP-P-2010-104443 | 2010-04-28 | ||
| PCT/JP2011/052814 WO2011135889A1 (ja) | 2010-04-28 | 2011-02-10 | 半導体発光素子、半導体発光素子の保護膜及びその作製方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120125326A true KR20120125326A (ko) | 2012-11-14 |
Family
ID=44861210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127022725A Ceased KR20120125326A (ko) | 2010-04-28 | 2011-02-10 | 반도체 발광 소자, 반도체 발광 소자의 보호막 및 그 제작 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20130037850A1 (https=) |
| EP (1) | EP2565946A4 (https=) |
| JP (1) | JP2011233784A (https=) |
| KR (1) | KR20120125326A (https=) |
| TW (1) | TW201203613A (https=) |
| WO (1) | WO2011135889A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011233783A (ja) * | 2010-04-28 | 2011-11-17 | Mitsubishi Heavy Ind Ltd | 半導体発光素子、半導体発光素子の保護膜及びその作製方法 |
| JP2013251423A (ja) * | 2012-06-01 | 2013-12-12 | Mitsubishi Heavy Ind Ltd | 発光素子の保護膜の作製方法及び装置 |
| JP6476854B2 (ja) * | 2014-12-26 | 2019-03-06 | 日亜化学工業株式会社 | 発光素子の製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240535A (ja) * | 1994-02-28 | 1995-09-12 | Kyocera Corp | 薄膜パターンの形成方法 |
| DE69516933T2 (de) * | 1994-04-06 | 2000-12-07 | At&T Ipm Corp., Coral Gables | Herstellungsverfahren für eine Vorrichtung mit einer SiOx Schicht |
| JP3723434B2 (ja) * | 1999-09-24 | 2005-12-07 | 三洋電機株式会社 | 半導体発光素子 |
| JP2003332616A (ja) * | 2002-05-14 | 2003-11-21 | Sharp Corp | 化合物半導体素子およびその製造方法 |
| JP2005286135A (ja) * | 2004-03-30 | 2005-10-13 | Eudyna Devices Inc | 半導体装置および半導体装置の製造方法 |
| JP4543732B2 (ja) * | 2004-04-20 | 2010-09-15 | 日立電線株式会社 | 発光ダイオードアレイ |
| JP2006041403A (ja) | 2004-07-29 | 2006-02-09 | Nichia Chem Ind Ltd | 半導体発光素子 |
| JP2007189097A (ja) | 2006-01-13 | 2007-07-26 | Nichia Chem Ind Ltd | 半導体発光素子 |
| US20100308357A1 (en) * | 2007-10-29 | 2010-12-09 | Mitsubishi Chemical Corporation | Semiconductor light emitting element and method for manufacturing the same |
| US8031754B2 (en) * | 2008-04-24 | 2011-10-04 | The Furukawa Electric Co., Ltd. | Surface emitting laser element, surface emitting laser element array, method of fabricating a surface emitting laser element |
-
2010
- 2010-04-28 JP JP2010104443A patent/JP2011233784A/ja active Pending
-
2011
- 2011-02-10 EP EP11774674.3A patent/EP2565946A4/en not_active Withdrawn
- 2011-02-10 WO PCT/JP2011/052814 patent/WO2011135889A1/ja not_active Ceased
- 2011-02-10 US US13/582,192 patent/US20130037850A1/en not_active Abandoned
- 2011-02-10 KR KR1020127022725A patent/KR20120125326A/ko not_active Ceased
- 2011-02-23 TW TW100105984A patent/TW201203613A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011233784A (ja) | 2011-11-17 |
| EP2565946A4 (en) | 2014-09-10 |
| US20130037850A1 (en) | 2013-02-14 |
| WO2011135889A1 (ja) | 2011-11-03 |
| TW201203613A (en) | 2012-01-16 |
| EP2565946A1 (en) | 2013-03-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0105 | International application |
Patent event date: 20120830 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20140429 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20140901 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20140429 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |