KR20120120389A - 반도체 발광 소자, 반도체 발광 소자의 보호막 및 그 제작 방법 - Google Patents

반도체 발광 소자, 반도체 발광 소자의 보호막 및 그 제작 방법 Download PDF

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Publication number
KR20120120389A
KR20120120389A KR1020127022724A KR20127022724A KR20120120389A KR 20120120389 A KR20120120389 A KR 20120120389A KR 1020127022724 A KR1020127022724 A KR 1020127022724A KR 20127022724 A KR20127022724 A KR 20127022724A KR 20120120389 A KR20120120389 A KR 20120120389A
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KR
South Korea
Prior art keywords
protective film
film
semiconductor light
light emitting
emitting element
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Ceased
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KR1020127022724A
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English (en)
Korean (ko)
Inventor
히데따까 가후꾸
도시히꼬 니시모리
히사오 가와사끼
Original Assignee
미츠비시 쥬고교 가부시키가이샤
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Publication of KR20120120389A publication Critical patent/KR20120120389A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/034—Manufacture or treatment of coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y10T428/24975—No layer or component greater than 5 mils thick

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  • Led Devices (AREA)
KR1020127022724A 2010-04-28 2011-02-10 반도체 발광 소자, 반도체 발광 소자의 보호막 및 그 제작 방법 Ceased KR20120120389A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-104442 2010-04-28
JP2010104442A JP2011233783A (ja) 2010-04-28 2010-04-28 半導体発光素子、半導体発光素子の保護膜及びその作製方法
PCT/JP2011/052813 WO2011135888A1 (ja) 2010-04-28 2011-02-10 半導体発光素子、半導体発光素子の保護膜及びその作製方法

Publications (1)

Publication Number Publication Date
KR20120120389A true KR20120120389A (ko) 2012-11-01

Family

ID=44861209

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127022724A Ceased KR20120120389A (ko) 2010-04-28 2011-02-10 반도체 발광 소자, 반도체 발광 소자의 보호막 및 그 제작 방법

Country Status (6)

Country Link
US (1) US20130049063A1 (enExample)
EP (1) EP2565945A1 (enExample)
JP (1) JP2011233783A (enExample)
KR (1) KR20120120389A (enExample)
TW (1) TW201228036A (enExample)
WO (1) WO2011135888A1 (enExample)

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JP5857786B2 (ja) * 2012-02-21 2016-02-10 日亜化学工業株式会社 半導体発光素子の製造方法
DE102016105056A1 (de) 2016-03-18 2017-09-21 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
JP6669144B2 (ja) 2016-12-16 2020-03-18 日亜化学工業株式会社 発光素子の製造方法
US10505072B2 (en) 2016-12-16 2019-12-10 Nichia Corporation Method for manufacturing light emitting element
DE102018101815A1 (de) 2018-01-26 2019-08-01 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
JP6570702B1 (ja) 2018-05-29 2019-09-04 日機装株式会社 半導体発光素子および半導体発光素子の製造方法
CN109037407B (zh) * 2018-08-03 2024-04-23 厦门乾照光电股份有限公司 半导体发光芯片及其制造方法
JP7023899B2 (ja) * 2019-07-29 2022-02-22 日機装株式会社 半導体発光素子
CN112272870B (zh) * 2020-03-19 2024-04-02 厦门三安光电有限公司 发光二极管
CN113284999B (zh) * 2021-03-29 2022-06-14 华灿光电(苏州）有限公司 发光二极管芯片及其制备方法
CN114122084B (zh) * 2021-11-09 2024-04-30 深圳市华星光电半导体显示技术有限公司 顶发射oled显示面板

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JPH07240535A (ja) * 1994-02-28 1995-09-12 Kyocera Corp 薄膜パターンの形成方法
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JP3292044B2 (ja) * 1996-05-31 2002-06-17 豊田合成株式会社 ｐ伝導形３族窒化物半導体の電極パッド及びそれを有した素子及び素子の製造方法
US6936859B1 (en) * 1998-05-13 2005-08-30 Toyoda Gosei Co., Ltd. Light-emitting semiconductor device using group III nitride compound
EP1168539B1 (en) * 1999-03-04 2009-12-16 Nichia Corporation Nitride semiconductor laser device
JP3723434B2 (ja) * 1999-09-24 2005-12-07 三洋電機株式会社 半導体発光素子
US20020017652A1 (en) * 2000-08-08 2002-02-14 Stefan Illek Semiconductor chip for optoelectronics
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JP3795007B2 (ja) * 2002-11-27 2006-07-12 松下電器産業株式会社 半導体発光素子及びその製造方法
US6744196B1 (en) * 2002-12-11 2004-06-01 Oriol, Inc. Thin film LED
KR100593886B1 (ko) * 2003-06-24 2006-07-03 삼성전기주식회사 질화갈륨계 반도체 발광소자의 제조방법
WO2005008795A1 (en) * 2003-07-18 2005-01-27 Epivalley Co., Ltd. Nitride semiconductor light emitting device
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JP2011233784A (ja) * 2010-04-28 2011-11-17 Mitsubishi Heavy Ind Ltd 半導体発光素子、半導体発光素子の保護膜及びその作製方法
TW201145614A (en) * 2010-06-03 2011-12-16 Toshiba Kk Method for manufacturing light-emitting device and light-emitting device manufactured by the same

Also Published As

Publication number Publication date
TW201228036A (en) 2012-07-01
US20130049063A1 (en) 2013-02-28
JP2011233783A (ja) 2011-11-17
EP2565945A1 (en) 2013-03-06
WO2011135888A1 (ja) 2011-11-03

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