KR20120052875A - 고체 이미지 센서, 고체 이미지 센서의 제조 방법 및 촬상 시스템 - Google Patents

고체 이미지 센서, 고체 이미지 센서의 제조 방법 및 촬상 시스템 Download PDF

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Publication number
KR20120052875A
KR20120052875A KR1020110118686A KR20110118686A KR20120052875A KR 20120052875 A KR20120052875 A KR 20120052875A KR 1020110118686 A KR1020110118686 A KR 1020110118686A KR 20110118686 A KR20110118686 A KR 20110118686A KR 20120052875 A KR20120052875 A KR 20120052875A
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South Korea
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region
mos transistor
pixel
drain
source
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KR1020110118686A
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English (en)
Korean (ko)
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후미히로 이누이
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캐논 가부시끼가이샤
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Publication of KR20120052875A publication Critical patent/KR20120052875A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
KR1020110118686A 2010-11-16 2011-11-15 고체 이미지 센서, 고체 이미지 센서의 제조 방법 및 촬상 시스템 Ceased KR20120052875A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010256318 2010-11-16
JPJP-P-2010-256318 2010-11-16
JPJP-P-2011-219565 2011-10-03
JP2011219565A JP5960961B2 (ja) 2010-11-16 2011-10-03 固体撮像素子及び撮像システム

Publications (1)

Publication Number Publication Date
KR20120052875A true KR20120052875A (ko) 2012-05-24

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KR1020110118686A Ceased KR20120052875A (ko) 2010-11-16 2011-11-15 고체 이미지 센서, 고체 이미지 센서의 제조 방법 및 촬상 시스템

Country Status (6)

Country Link
US (1) US8952433B2 (enExample)
EP (1) EP2453478A1 (enExample)
JP (1) JP5960961B2 (enExample)
KR (1) KR20120052875A (enExample)
CN (1) CN102468317B (enExample)
RU (1) RU2488190C1 (enExample)

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JP2014011253A (ja) * 2012-06-28 2014-01-20 Sony Corp 固体撮像装置および電子機器
JP6037873B2 (ja) * 2013-02-06 2016-12-07 オリンパス株式会社 固体撮像装置および撮像装置
US8835211B1 (en) * 2013-05-24 2014-09-16 Omnivision Technologies, Inc. Image sensor pixel cell with global shutter having narrow spacing between gates
JP6261361B2 (ja) 2014-02-04 2018-01-17 キヤノン株式会社 固体撮像装置およびカメラ
JP6541347B2 (ja) * 2014-03-27 2019-07-10 キヤノン株式会社 固体撮像装置および撮像システム
JP2016033980A (ja) * 2014-07-31 2016-03-10 キヤノン株式会社 撮像デバイス、撮像装置および撮像システム
JP6598436B2 (ja) * 2014-08-08 2019-10-30 キヤノン株式会社 光電変換装置、撮像システム、及び光電変換装置の製造方法
JP6578676B2 (ja) * 2015-03-03 2019-09-25 セイコーエプソン株式会社 画像読取装置および半導体装置
JP6738200B2 (ja) 2016-05-26 2020-08-12 キヤノン株式会社 撮像装置
JP6688165B2 (ja) 2016-06-10 2020-04-28 キヤノン株式会社 撮像装置及び撮像システム
JP7013119B2 (ja) 2016-07-21 2022-01-31 キヤノン株式会社 固体撮像素子、固体撮像素子の製造方法、及び撮像システム
CN108630713B (zh) * 2017-03-17 2020-11-27 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法
JP2017130693A (ja) * 2017-04-13 2017-07-27 ルネサスエレクトロニクス株式会社 撮像装置およびその製造方法
JP7171170B2 (ja) * 2017-06-29 2022-11-15 キヤノン株式会社 撮像装置、撮像システム、移動体、撮像装置の製造方法
JP7150504B2 (ja) 2018-07-18 2022-10-11 キヤノン株式会社 固体撮像装置及びその駆動方法
JP7395502B2 (ja) * 2018-11-21 2023-12-11 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子
US11393870B2 (en) 2018-12-18 2022-07-19 Canon Kabushiki Kaisha Photoelectric conversion device, imaging system, and mobile apparatus
JP7555703B2 (ja) 2019-02-25 2024-09-25 キヤノン株式会社 光電変換装置、撮像システム及び移動体
JP6986046B2 (ja) 2019-05-30 2021-12-22 キヤノン株式会社 光電変換装置および機器
JP7345301B2 (ja) 2019-07-18 2023-09-15 キヤノン株式会社 光電変換装置および機器

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JP2746154B2 (ja) * 1994-12-07 1998-04-28 日本電気株式会社 固体撮像素子
JP3511772B2 (ja) * 1995-12-21 2004-03-29 ソニー株式会社 固体撮像素子、固体撮像素子の駆動方法、カメラ装置及びカメラシステム
JPH09326482A (ja) * 1996-06-05 1997-12-16 Sony Corp 固体撮像素子
JP3047850B2 (ja) * 1997-03-31 2000-06-05 日本電気株式会社 半導体装置
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JP4455435B2 (ja) 2004-08-04 2010-04-21 キヤノン株式会社 固体撮像装置及び同固体撮像装置を用いたカメラ
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KR100660549B1 (ko) 2005-07-13 2006-12-22 삼성전자주식회사 이미지 센서 및 그 제조 방법
JP2007134615A (ja) * 2005-11-14 2007-05-31 Nec Electronics Corp 半導体装置
EP1788797B1 (en) 2005-11-18 2013-06-26 Canon Kabushiki Kaisha Solid-state image pickup device
KR100790228B1 (ko) * 2005-12-26 2008-01-02 매그나칩 반도체 유한회사 시모스 이미지 센서
JP5110820B2 (ja) 2006-08-02 2012-12-26 キヤノン株式会社 光電変換装置、光電変換装置の製造方法及び撮像システム
JP5110831B2 (ja) 2006-08-31 2012-12-26 キヤノン株式会社 光電変換装置及び撮像システム
JP2009111217A (ja) * 2007-10-31 2009-05-21 Toshiba Corp 半導体装置
JP5221982B2 (ja) * 2008-02-29 2013-06-26 キヤノン株式会社 固体撮像装置及びカメラ
KR20100036034A (ko) * 2008-09-29 2010-04-07 크로스텍 캐피탈, 엘엘씨 트랜지스터, 이를 구비한 이미지 센서 및 그의 제조방법
JP4911158B2 (ja) * 2008-10-30 2012-04-04 ソニー株式会社 半導体装置および固体撮像装置

Also Published As

Publication number Publication date
RU2488190C1 (ru) 2013-07-20
CN102468317A (zh) 2012-05-23
JP5960961B2 (ja) 2016-08-02
RU2011146342A (ru) 2013-05-20
US20120119272A1 (en) 2012-05-17
EP2453478A1 (en) 2012-05-16
CN102468317B (zh) 2016-04-27
JP2012124462A (ja) 2012-06-28
US8952433B2 (en) 2015-02-10

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