KR20110070975A - Ｌｅｄ 모듈 및 제조 방법 - Google Patents

Ｌｅｄ 모듈 및 제조 방법 Download PDF

Info

Publication number
KR20110070975A
KR20110070975A KR1020117003394A KR20117003394A KR20110070975A KR 20110070975 A KR20110070975 A KR 20110070975A KR 1020117003394 A KR1020117003394 A KR 1020117003394A KR 20117003394 A KR20117003394 A KR 20117003394A KR 20110070975 A KR20110070975 A KR 20110070975A
Authority
KR
South Korea
Prior art keywords
substrate
wafer
contact
led
leds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117003394A
Other languages
English (en)
Korean (ko)
Inventor
게오르그 보그너
베르톨드 한
시그프레이드 헤르만
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20110070975A publication Critical patent/KR20110070975A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Led Device Packages (AREA)
KR1020117003394A 2008-09-29 2009-08-26 Ｌｅｄ 모듈 및 제조 방법 Withdrawn KR20110070975A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008049535A DE102008049535A1 (de) 2008-09-29 2008-09-29 LED-Modul und Herstellungsverfahren
DE102008049535.2 2008-09-29

Publications (1)

Publication Number Publication Date
KR20110070975A true KR20110070975A (ko) 2011-06-27

Family

ID=41611100

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117003394A Withdrawn KR20110070975A (ko) 2008-09-29 2009-08-26 Ｌｅｄ 모듈 및 제조 방법

Country Status (8)

Country Link
US (1) US20110227103A1 (enExample)
EP (1) EP2332186A1 (enExample)
JP (1) JP5717636B2 (enExample)
KR (1) KR20110070975A (enExample)
CN (1) CN102165612A (enExample)
DE (1) DE102008049535A1 (enExample)
TW (1) TW201013999A (enExample)
WO (1) WO2010034277A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010045054A1 (de) * 2010-09-10 2012-03-15 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung
DE102012109139A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, Elektronische Baugruppe, Verfahren zum Herstellen von Gehäusen und Verfahren zum Herstellen elektronischer Baugruppen
DE102013103226A1 (de) 2013-03-28 2014-10-02 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
CN104681690A (zh) * 2013-12-03 2015-06-03 复盛精密工业股份有限公司 侧向型发光二极管的支架结构
JP6405697B2 (ja) 2014-05-21 2018-10-17 日亜化学工業株式会社 発光装置
DE102017115780A1 (de) * 2017-07-13 2019-01-17 Tdk Electronics Ag Leuchtdiodenbauteil, Leuchtdiodenanordnung und Verfahren zur Herstellung eines Leuchtdiodenbauteils
JP6822455B2 (ja) * 2018-09-19 2021-01-27 日亜化学工業株式会社 発光装置
CN112023255B (zh) * 2020-08-26 2023-05-26 清华大学 多功能植入式探针及其制备方法
JP1682191S (enExample) * 2020-09-25 2021-03-29
DE102022111033A1 (de) 2022-05-04 2023-11-09 Ams-Osram International Gmbh Optoelektronisches halbleiterbauelement

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529659A (ja) * 1991-07-23 1993-02-05 Sharp Corp 側面発光型ｌｅｄランプとその製造方法
US6855552B2 (en) * 1998-09-03 2005-02-15 Ventana Medical Systems Automated immunohistochemical and in situ hybridization assay formulations
TWI289944B (en) * 2000-05-26 2007-11-11 Osram Opto Semiconductors Gmbh Light-emitting-diode-element with a light-emitting-diode-chip
US6547249B2 (en) * 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
JP3668438B2 (ja) * 2001-06-07 2005-07-06 シャープ株式会社 チップ発光ダイオード
JP2003204081A (ja) * 2002-01-08 2003-07-18 Rohm Co Ltd 半導体発光装置
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
JP2004281538A (ja) * 2003-03-13 2004-10-07 Seiko Epson Corp 電子装置及びその製造方法、回路基板並びに電子機器
JP4792726B2 (ja) * 2003-10-30 2011-10-12 日亜化学工業株式会社 半導体素子用支持体の製造方法
KR101332771B1 (ko) * 2004-02-20 2013-11-25 오스람 옵토 세미컨덕터스 게엠베하 광전 소자, 다수의 광전 소자를 구비한 장치 및 광전 소자를 제조하기 위한 방법
DE102005016592A1 (de) * 2004-04-14 2005-11-24 Osram Opto Semiconductors Gmbh Leuchtdiodenchip
JP4841550B2 (ja) * 2004-06-30 2011-12-21 ソウル オプト デバイス カンパニー リミテッド 発光素子及びその製造方法並びにこれを用いた発光装置
US7271420B2 (en) * 2004-07-07 2007-09-18 Cao Group, Inc. Monolitholic LED chip to emit multiple colors
US7256483B2 (en) * 2004-10-28 2007-08-14 Philips Lumileds Lighting Company, Llc Package-integrated thin film LED
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法
US7683393B2 (en) * 2004-12-07 2010-03-23 Ngk Spark Plug Co., Ltd. Wiring substrate for mounting light emitting element
JP4698259B2 (ja) * 2005-03-16 2011-06-08 三洋電機株式会社 電子部品搭載用パッケージ及びパッケージ集合基板
JP5279488B2 (ja) * 2005-05-30 2013-09-04 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ケーシング本体およびケーシング本体の製造方法
US7339196B2 (en) * 2005-06-25 2008-03-04 Industrial Technology Research Institute Packaging of SMD light emitting diodes
KR100606551B1 (ko) * 2005-07-05 2006-08-01 엘지전자 주식회사 발광소자 제조방법
GB2428879A (en) * 2005-07-26 2007-02-07 Unity Opto Technology Co Ltd Light emitting diode with uniform colour mixing
JP4821343B2 (ja) * 2006-02-04 2011-11-24 日亜化学工業株式会社 サブマウント基板及びこれを備える発光装置
DE102007021009A1 (de) * 2006-09-27 2008-04-10 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung und Verfahren zur Herstellung einer solchen
JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置
US7569421B2 (en) * 2007-05-04 2009-08-04 Stats Chippac, Ltd. Through-hole via on saw streets
DE102007030129A1 (de) * 2007-06-29 2009-01-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement
DE102008013030A1 (de) * 2007-12-14 2009-06-25 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
KR100981214B1 (ko) * 2008-01-28 2010-09-10 알티전자 주식회사 발광다이오드 패키지

Also Published As

Publication number Publication date
EP2332186A1 (de) 2011-06-15
CN102165612A (zh) 2011-08-24
US20110227103A1 (en) 2011-09-22
TW201013999A (en) 2010-04-01
JP5717636B2 (ja) 2015-05-13
DE102008049535A1 (de) 2010-04-08
JP2012504318A (ja) 2012-02-16
WO2010034277A1 (de) 2010-04-01

Similar Documents

Publication Publication Date Title
KR20110070975A (ko) Ｌｅｄ 모듈 및 제조 방법
KR102339163B1 (ko) 발광 모듈의 제조 방법 및 발광 모듈
US10593846B2 (en) Semiconductor light-emitting device, method for producing same, and display device
KR100784057B1 (ko) 발광소자 패키지 및 발광소자 패키지 제조 방법
KR101768720B1 (ko) 표면 실장 ｌｅｄ 모듈 및 표면 실장 ｌｅｄ 모듈의 제조 방법
CN101345283B (zh) 芯片部件型led及其制造方法
JP3668438B2 (ja) チップ発光ダイオード
KR20110096601A (ko) 다수의 이미터가 정렬된 구성을 갖는 패키지
CN114360390B (zh) 一种用于拼接的led显示模组的制作方法
WO2012059063A1 (en) White ceramic led package
KR20010105171A (ko) 이면발광 칩형 발광소자 및 그에 사용되는 절연성기판
US20100127294A1 (en) Side view type light-emitting diode package structure, and manufacturing method and application thereof
KR102519201B1 (ko) 픽셀용 발광소자 및 엘이디 디스플레이 장치
KR20130102746A (ko) 발광 장치의 제조 방법
CN103107273B (zh) 发光二极管封装
KR102559945B1 (ko) 발광모듈, 발광 캐비닛 및 표시장치
KR102519737B1 (ko) 마이크로 엘이디 모듈 및 그 제조방법
CN217544641U (zh) 一种高压Mini LED发光器件
KR20170022171A (ko) 커넥터, 광원모듈 및 이를 이용한 광원모듈 어레이
KR100759896B1 (ko) 적어도 하나의 발광소자가 장착된 백라이트 모듈 및 그제작 방법
CN114373839B (zh) 发光二极管芯片及其制备方法和显示装置
KR100791736B1 (ko) 전자 부품과 그 제조 방법, 및, 발광 다이오드용 패키지와그 제조 방법
KR20210009642A (ko) 반도체 발광소자 및 이의 제조방법
JP2024104824A (ja) 発光素子ブロックの配線用基板への転写による発光素子搭載配線用基板の製造方法ならびに発光素子ブロックと配線用基板および発光素子搭載基板
JP2000323754A (ja) チップ型発光素子

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20110214

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid