TW201013999A - LED-module and manufacturing method - Google Patents

LED-module and manufacturing method Download PDF

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Publication number
TW201013999A
TW201013999A TW098130158A TW98130158A TW201013999A TW 201013999 A TW201013999 A TW 201013999A TW 098130158 A TW098130158 A TW 098130158A TW 98130158 A TW98130158 A TW 98130158A TW 201013999 A TW201013999 A TW 201013999A
Authority
TW
Taiwan
Prior art keywords
substrate
led
wafer
top surface
contact
Prior art date
Application number
TW098130158A
Other languages
English (en)
Chinese (zh)
Inventor
Georg Bogner
Berthold Hahn
Siegfried Herrmann
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of TW201013999A publication Critical patent/TW201013999A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Led Device Packages (AREA)
TW098130158A 2008-09-29 2009-09-08 LED-module and manufacturing method TW201013999A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008049535A DE102008049535A1 (de) 2008-09-29 2008-09-29 LED-Modul und Herstellungsverfahren

Publications (1)

Publication Number Publication Date
TW201013999A true TW201013999A (en) 2010-04-01

Family

ID=41611100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098130158A TW201013999A (en) 2008-09-29 2009-09-08 LED-module and manufacturing method

Country Status (8)

Country Link
US (1) US20110227103A1 (enExample)
EP (1) EP2332186A1 (enExample)
JP (1) JP5717636B2 (enExample)
KR (1) KR20110070975A (enExample)
CN (1) CN102165612A (enExample)
DE (1) DE102008049535A1 (enExample)
TW (1) TW201013999A (enExample)
WO (1) WO2010034277A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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DE102010045054A1 (de) * 2010-09-10 2012-03-15 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung
DE102012109139A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, Elektronische Baugruppe, Verfahren zum Herstellen von Gehäusen und Verfahren zum Herstellen elektronischer Baugruppen
DE102013103226A1 (de) 2013-03-28 2014-10-02 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
CN104681690A (zh) * 2013-12-03 2015-06-03 复盛精密工业股份有限公司 侧向型发光二极管的支架结构
JP6405697B2 (ja) 2014-05-21 2018-10-17 日亜化学工業株式会社 発光装置
DE102017115780A1 (de) * 2017-07-13 2019-01-17 Tdk Electronics Ag Leuchtdiodenbauteil, Leuchtdiodenanordnung und Verfahren zur Herstellung eines Leuchtdiodenbauteils
JP6822455B2 (ja) * 2018-09-19 2021-01-27 日亜化学工業株式会社 発光装置
CN112023255B (zh) * 2020-08-26 2023-05-26 清华大学 多功能植入式探针及其制备方法
JP1682191S (enExample) * 2020-09-25 2021-03-29
DE102022111033A1 (de) 2022-05-04 2023-11-09 Ams-Osram International Gmbh Optoelektronisches halbleiterbauelement

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Also Published As

Publication number Publication date
EP2332186A1 (de) 2011-06-15
CN102165612A (zh) 2011-08-24
US20110227103A1 (en) 2011-09-22
KR20110070975A (ko) 2011-06-27
JP5717636B2 (ja) 2015-05-13
DE102008049535A1 (de) 2010-04-08
JP2012504318A (ja) 2012-02-16
WO2010034277A1 (de) 2010-04-01

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