KR20110007188A - 와이어 톱 장치 및 이를 작동시키기 위한 방법 - Google Patents

와이어 톱 장치 및 이를 작동시키기 위한 방법 Download PDF

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Publication number
KR20110007188A
KR20110007188A KR1020107025486A KR20107025486A KR20110007188A KR 20110007188 A KR20110007188 A KR 20110007188A KR 1020107025486 A KR1020107025486 A KR 1020107025486A KR 20107025486 A KR20107025486 A KR 20107025486A KR 20110007188 A KR20110007188 A KR 20110007188A
Authority
KR
South Korea
Prior art keywords
wire
sawing
semiconductor material
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107025486A
Other languages
English (en)
Korean (ko)
Inventor
스테판 슈니베르거
필리페 엠. 나슈
세드릭 톰맨
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20110007188A publication Critical patent/KR20110007188A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0038—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of frames; of tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0448—With subsequent handling [i.e., of product]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020107025486A 2008-04-14 2009-04-09 와이어 톱 장치 및 이를 작동시키기 위한 방법 Withdrawn KR20110007188A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US4460208P 2008-04-14 2008-04-14
EP20080154493 EP2110216B1 (en) 2008-04-14 2008-04-14 Wire saw device and method for operating same
US61/044,602 2008-04-14
EP08154493.4 2008-04-14

Publications (1)

Publication Number Publication Date
KR20110007188A true KR20110007188A (ko) 2011-01-21

Family

ID=39735271

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107025486A Withdrawn KR20110007188A (ko) 2008-04-14 2009-04-09 와이어 톱 장치 및 이를 작동시키기 위한 방법

Country Status (7)

Country Link
US (1) US20110132345A1 (https=)
EP (1) EP2110216B1 (https=)
JP (1) JP5508395B2 (https=)
KR (1) KR20110007188A (https=)
CN (1) CN102067288B (https=)
TW (1) TW200952060A (https=)
WO (1) WO2009127932A2 (https=)

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US8439723B2 (en) 2008-08-11 2013-05-14 Applied Materials, Inc. Chemical mechanical polisher with heater and method
US8414357B2 (en) 2008-08-22 2013-04-09 Applied Materials, Inc. Chemical mechanical polisher having movable slurry dispensers and method
US8833219B2 (en) 2009-01-26 2014-09-16 Illinois Tool Works Inc. Wire saw
CN102398314B (zh) * 2010-09-17 2014-05-21 上海日进机床有限公司 金刚线切片机
CN102229092A (zh) * 2011-06-20 2011-11-02 江西赛维Ldk太阳能高科技有限公司 一种多线切割装置
ITTV20110116A1 (it) * 2011-08-10 2013-02-11 Luca Toncelli Macchina per il taglio in lastre di blocchi di materiale lapideo
DE102011110360B4 (de) 2011-08-17 2014-07-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Drahtsägeanordnung und Verfahren hierzu
US9186805B2 (en) 2011-09-08 2015-11-17 Illinois Tool Works Inc. Wire saw for cutting pipe
EP2586555A1 (en) * 2011-10-27 2013-05-01 Applied Materials Switzerland Sàrl Modular wafering concept for wafering plant
EP2586554A1 (en) * 2011-10-27 2013-05-01 Applied Materials Switzerland Sàrl Wire saw device with two independent wire webs and method thereof
US20130144421A1 (en) * 2011-12-01 2013-06-06 Memc Electronic Materials, Spa Systems For Controlling Temperature Of Bearings In A Wire Saw
CN103182747B (zh) * 2011-12-27 2015-04-15 浙江昱辉阳光能源有限公司 一种多线锯线网系统
EP2647458A1 (en) * 2012-04-04 2013-10-09 Applied Materials Switzerland Sàrl Wire for semiconductor wire saw and wire saw
JP5973778B2 (ja) * 2012-05-08 2016-08-23 トーヨーエイテック株式会社 ワイヤソー装置及びワイヤ走行制御方法
CN102773930A (zh) * 2012-07-17 2012-11-14 铜陵市琨鹏光电科技有限公司 水晶切割机
EP2711151A1 (en) 2012-09-24 2014-03-26 Meyer Burger AG Method of making wafers
EP2711978A1 (en) 2012-09-24 2014-03-26 Meyer Burger AG Method of making wafers
EP2767375A1 (en) * 2013-02-13 2014-08-20 Applied Materials Switzerland Sàrl Wire guide and a method for forming a wire guide
CN105142867A (zh) * 2013-04-24 2015-12-09 梅耶博格公司 线锯
TWI510343B (zh) * 2013-05-30 2015-12-01 G Tech Optoelectronics Corp 鑽石線切割機及該鑽石線切割機的切割方法
US10076797B2 (en) 2013-10-11 2018-09-18 Illinois Tool Works Inc. Cutting apparatus including a wire cutting member
CN103496043A (zh) * 2013-10-16 2014-01-08 内蒙古中环光伏材料有限公司 一种太阳能硅片线切割槽轮
EP2944444A1 (en) 2014-05-16 2015-11-18 Meyer Burger AG Wafer processing method
CN107097362B (zh) * 2016-02-19 2020-04-17 友达晶材股份有限公司 晶圆切片机及其轮组结构与晶圆切片的方法
CN110944784B (zh) 2017-06-09 2022-05-13 伊利诺斯工具制品有限公司 切割装置
WO2019008530A1 (en) * 2017-07-07 2019-01-10 Meyer Burger (Switzerland) Ag METHOD FOR WINDING A CUTTING WIRE
WO2019079823A1 (en) * 2017-10-20 2019-04-25 Gfsi Group Llc VEHICLE MOUNTED WIRE SAW FOR CUTTING WIND TURBINE BLADES
CN111421688A (zh) * 2020-05-09 2020-07-17 西安奕斯伟硅片技术有限公司 多线切割装置及多线切割方法
CN113290633B (zh) * 2021-07-23 2021-09-17 南通弈驰新型建材科技有限公司 一种家具填充材料用切割设备
CN117841191B (zh) * 2024-03-01 2024-07-12 秦皇岛中恒精机设备有限公司 一种超细线双工位石材切割机

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JPH0511439U (ja) * 1991-07-24 1993-02-12 日立電線株式会社 結晶切断装置
JPH07314435A (ja) * 1994-05-19 1995-12-05 M Setetsuku Kk ワイヤソー装置
DE19510625A1 (de) * 1995-03-23 1996-09-26 Wacker Siltronic Halbleitermat Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück
US5609148A (en) * 1995-03-31 1997-03-11 Siemens Aktiengesellschaft Method and apparatus for dicing semiconductor wafers
CH691292A5 (fr) * 1995-10-03 2001-06-29 Hct Shaping Systems Sa Dispositif de sciage par fil équipé d'un système de gestion de fil permettant l'utilisation de bobines de fil de très grande longueur.
JPH10321564A (ja) * 1997-05-20 1998-12-04 Tokyo Seimitsu Co Ltd ウェーハ回収装置
JP3716556B2 (ja) * 1997-06-10 2005-11-16 株式会社東京精密 マルチ切断ワイヤソーのウェーハ回収方法
DE19739966A1 (de) * 1997-09-11 1999-03-18 Wacker Siltronic Halbleitermat Drahtsäge und Verfahren zum Abtrennen von Formkörpern
JP3674818B2 (ja) * 1998-08-21 2005-07-27 三菱住友シリコン株式会社 ワイヤソー
JP3704586B2 (ja) * 2001-07-30 2005-10-12 株式会社ファインテクニカ ワイヤソー装置
JP2003127058A (ja) * 2001-10-23 2003-05-08 Sharp Corp ワイヤソー
JP3887574B2 (ja) * 2002-03-22 2007-02-28 トーヨーエイテック株式会社 ワイヤソーからのワーク引抜き方法
KR20070004073A (ko) * 2004-03-30 2007-01-05 솔라익스 인코퍼레이티드 초박형 실리콘 웨이퍼 절단방법 및 장치
GB2414204B (en) * 2004-05-18 2006-04-12 David Ainsworth Hukin Abrasive wire sawing
JP4309825B2 (ja) * 2004-09-09 2009-08-05 トーヨーエイテック株式会社 ワイヤソー
JP5127209B2 (ja) * 2005-11-29 2013-01-23 京セラ株式会社 半導体基板の製造方法
WO2008015895A1 (en) * 2006-08-04 2008-02-07 Towa Corporation Cutting device, and cutting method

Also Published As

Publication number Publication date
TW200952060A (en) 2009-12-16
JP5508395B2 (ja) 2014-05-28
WO2009127932A3 (en) 2009-12-23
WO2009127932A2 (en) 2009-10-22
US20110132345A1 (en) 2011-06-09
CN102067288A (zh) 2011-05-18
EP2110216B1 (en) 2013-06-05
JP2011517133A (ja) 2011-05-26
CN102067288B (zh) 2013-12-04
EP2110216A1 (en) 2009-10-21

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Legal Events

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000