JP5508395B2 - ワイヤーソー装置およびそれを操作するための方法 - Google Patents

ワイヤーソー装置およびそれを操作するための方法 Download PDF

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Publication number
JP5508395B2
JP5508395B2 JP2011504552A JP2011504552A JP5508395B2 JP 5508395 B2 JP5508395 B2 JP 5508395B2 JP 2011504552 A JP2011504552 A JP 2011504552A JP 2011504552 A JP2011504552 A JP 2011504552A JP 5508395 B2 JP5508395 B2 JP 5508395B2
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Japan
Prior art keywords
wire
web
saw
wafer
semiconductor material
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JP2011504552A
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English (en)
Japanese (ja)
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JP2011517133A5 (https=
JP2011517133A (ja
Inventor
シュテファン シュネーバーガー，
フィリップ， エム． ナッシュ，
セドリク トメン，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2011517133A5 publication Critical patent/JP2011517133A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0038—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of frames; of tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0448—With subsequent handling [i.e., of product]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2011504552A 2008-04-14 2009-04-09 ワイヤーソー装置およびそれを操作するための方法 Active JP5508395B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US4460208P 2008-04-14 2008-04-14
EP20080154493 EP2110216B1 (en) 2008-04-14 2008-04-14 Wire saw device and method for operating same
US61/044,602 2008-04-14
EP08154493.4 2008-04-14
PCT/IB2009/005220 WO2009127932A2 (en) 2008-04-14 2009-04-09 Wire saw device and method for operating same

Publications (3)

Publication Number Publication Date
JP2011517133A JP2011517133A (ja) 2011-05-26
JP2011517133A5 JP2011517133A5 (https=) 2012-06-07
JP5508395B2 true JP5508395B2 (ja) 2014-05-28

Family

ID=39735271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011504552A Active JP5508395B2 (ja) 2008-04-14 2009-04-09 ワイヤーソー装置およびそれを操作するための方法

Country Status (7)

Country Link
US (1) US20110132345A1 (https=)
EP (1) EP2110216B1 (https=)
JP (1) JP5508395B2 (https=)
KR (1) KR20110007188A (https=)
CN (1) CN102067288B (https=)
TW (1) TW200952060A (https=)
WO (1) WO2009127932A2 (https=)

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US8439723B2 (en) 2008-08-11 2013-05-14 Applied Materials, Inc. Chemical mechanical polisher with heater and method
US8414357B2 (en) 2008-08-22 2013-04-09 Applied Materials, Inc. Chemical mechanical polisher having movable slurry dispensers and method
US8833219B2 (en) 2009-01-26 2014-09-16 Illinois Tool Works Inc. Wire saw
CN102398314B (zh) * 2010-09-17 2014-05-21 上海日进机床有限公司 金刚线切片机
CN102229092A (zh) * 2011-06-20 2011-11-02 江西赛维Ldk太阳能高科技有限公司 一种多线切割装置
ITTV20110116A1 (it) * 2011-08-10 2013-02-11 Luca Toncelli Macchina per il taglio in lastre di blocchi di materiale lapideo
DE102011110360B4 (de) 2011-08-17 2014-07-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Drahtsägeanordnung und Verfahren hierzu
US9186805B2 (en) 2011-09-08 2015-11-17 Illinois Tool Works Inc. Wire saw for cutting pipe
EP2586555A1 (en) * 2011-10-27 2013-05-01 Applied Materials Switzerland Sàrl Modular wafering concept for wafering plant
EP2586554A1 (en) * 2011-10-27 2013-05-01 Applied Materials Switzerland Sàrl Wire saw device with two independent wire webs and method thereof
US20130144421A1 (en) * 2011-12-01 2013-06-06 Memc Electronic Materials, Spa Systems For Controlling Temperature Of Bearings In A Wire Saw
CN103182747B (zh) * 2011-12-27 2015-04-15 浙江昱辉阳光能源有限公司 一种多线锯线网系统
EP2647458A1 (en) * 2012-04-04 2013-10-09 Applied Materials Switzerland Sàrl Wire for semiconductor wire saw and wire saw
JP5973778B2 (ja) * 2012-05-08 2016-08-23 トーヨーエイテック株式会社 ワイヤソー装置及びワイヤ走行制御方法
CN102773930A (zh) * 2012-07-17 2012-11-14 铜陵市琨鹏光电科技有限公司 水晶切割机
EP2711151A1 (en) 2012-09-24 2014-03-26 Meyer Burger AG Method of making wafers
EP2711978A1 (en) 2012-09-24 2014-03-26 Meyer Burger AG Method of making wafers
EP2767375A1 (en) * 2013-02-13 2014-08-20 Applied Materials Switzerland Sàrl Wire guide and a method for forming a wire guide
CN105142867A (zh) * 2013-04-24 2015-12-09 梅耶博格公司 线锯
TWI510343B (zh) * 2013-05-30 2015-12-01 G Tech Optoelectronics Corp 鑽石線切割機及該鑽石線切割機的切割方法
US10076797B2 (en) 2013-10-11 2018-09-18 Illinois Tool Works Inc. Cutting apparatus including a wire cutting member
CN103496043A (zh) * 2013-10-16 2014-01-08 内蒙古中环光伏材料有限公司 一种太阳能硅片线切割槽轮
EP2944444A1 (en) 2014-05-16 2015-11-18 Meyer Burger AG Wafer processing method
CN107097362B (zh) * 2016-02-19 2020-04-17 友达晶材股份有限公司 晶圆切片机及其轮组结构与晶圆切片的方法
CN110944784B (zh) 2017-06-09 2022-05-13 伊利诺斯工具制品有限公司 切割装置
WO2019008530A1 (en) * 2017-07-07 2019-01-10 Meyer Burger (Switzerland) Ag METHOD FOR WINDING A CUTTING WIRE
WO2019079823A1 (en) * 2017-10-20 2019-04-25 Gfsi Group Llc VEHICLE MOUNTED WIRE SAW FOR CUTTING WIND TURBINE BLADES
CN111421688A (zh) * 2020-05-09 2020-07-17 西安奕斯伟硅片技术有限公司 多线切割装置及多线切割方法
CN113290633B (zh) * 2021-07-23 2021-09-17 南通弈驰新型建材科技有限公司 一种家具填充材料用切割设备
CN117841191B (zh) * 2024-03-01 2024-07-12 秦皇岛中恒精机设备有限公司 一种超细线双工位石材切割机

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JPH0511439U (ja) * 1991-07-24 1993-02-12 日立電線株式会社 結晶切断装置
JPH07314435A (ja) * 1994-05-19 1995-12-05 M Setetsuku Kk ワイヤソー装置
DE19510625A1 (de) * 1995-03-23 1996-09-26 Wacker Siltronic Halbleitermat Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück
US5609148A (en) * 1995-03-31 1997-03-11 Siemens Aktiengesellschaft Method and apparatus for dicing semiconductor wafers
CH691292A5 (fr) * 1995-10-03 2001-06-29 Hct Shaping Systems Sa Dispositif de sciage par fil équipé d'un système de gestion de fil permettant l'utilisation de bobines de fil de très grande longueur.
JPH10321564A (ja) * 1997-05-20 1998-12-04 Tokyo Seimitsu Co Ltd ウェーハ回収装置
JP3716556B2 (ja) * 1997-06-10 2005-11-16 株式会社東京精密 マルチ切断ワイヤソーのウェーハ回収方法
DE19739966A1 (de) * 1997-09-11 1999-03-18 Wacker Siltronic Halbleitermat Drahtsäge und Verfahren zum Abtrennen von Formkörpern
JP3674818B2 (ja) * 1998-08-21 2005-07-27 三菱住友シリコン株式会社 ワイヤソー
JP3704586B2 (ja) * 2001-07-30 2005-10-12 株式会社ファインテクニカ ワイヤソー装置
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Also Published As

Publication number Publication date
TW200952060A (en) 2009-12-16
WO2009127932A3 (en) 2009-12-23
WO2009127932A2 (en) 2009-10-22
US20110132345A1 (en) 2011-06-09
CN102067288A (zh) 2011-05-18
EP2110216B1 (en) 2013-06-05
JP2011517133A (ja) 2011-05-26
CN102067288B (zh) 2013-12-04
EP2110216A1 (en) 2009-10-21
KR20110007188A (ko) 2011-01-21

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