KR20100126505A - 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물 - Google Patents

금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물 Download PDF

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Publication number
KR20100126505A
KR20100126505A KR1020107022917A KR20107022917A KR20100126505A KR 20100126505 A KR20100126505 A KR 20100126505A KR 1020107022917 A KR1020107022917 A KR 1020107022917A KR 20107022917 A KR20107022917 A KR 20107022917A KR 20100126505 A KR20100126505 A KR 20100126505A
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South Korea
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weight
component
components
substrate
metal
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English (en)
Korean (ko)
Inventor
슈테판 헤르메스
케탄 조쉬
노르베르트 바그너
크리스토퍼 키부르크
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바스프 에스이
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
KR1020107022917A 2008-03-13 2009-03-13 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물 Withdrawn KR20100126505A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08152712.9 2008-03-13
EP08152712 2008-03-13

Publications (1)

Publication Number Publication Date
KR20100126505A true KR20100126505A (ko) 2010-12-01

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KR1020107022917A Withdrawn KR20100126505A (ko) 2008-03-13 2009-03-13 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물

Country Status (6)

Country Link
US (1) US20110014492A1 (https=)
EP (1) EP2265746A2 (https=)
JP (1) JP5575669B2 (https=)
KR (1) KR20100126505A (https=)
CN (1) CN101970720B (https=)
WO (1) WO2009112573A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101537638B1 (ko) * 2010-05-18 2015-07-17 삼성전자 주식회사 그라펜 박막을 이용한 수지의 도금 방법

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100270513A1 (en) * 2009-04-03 2010-10-28 Luke Haylock Conductive solid film material
US9080259B2 (en) 2009-06-30 2015-07-14 Basf Se Polyamide fibers with dyeable particles and production thereof
SG178932A1 (en) 2009-09-04 2012-04-27 Basf Se Composition for printing conductor tracks and a process for producing solar cells
US9396833B2 (en) 2009-09-04 2016-07-19 Basf Se Composition for printing electrodes
DE102009055428B4 (de) * 2009-12-30 2013-04-11 Dronco Ag Schrupp- und /oder Trennscheibe
KR20120137481A (ko) * 2010-02-16 2012-12-21 바스프 에스이 시드 층을 인쇄하기 위한 조성물 및 전도체 트랙을 제조하기 위한 방법
US8895651B2 (en) * 2010-02-16 2014-11-25 Basf Se Composition for printing a seed layer and process for producing conductor tracks
MX2012009464A (es) 2010-02-17 2012-09-12 Basf Se Proceso para producir uniones conductoras de electricidad entre celdas solares.
JP5792963B2 (ja) * 2011-02-01 2015-10-14 早川ゴム株式会社 グラフェン構造を持つナノ構造体の吸着方法及びその吸着方法を用いた無電解メッキ方法
FR2971637A1 (fr) * 2011-02-16 2012-08-17 Getelec Procede et dispositif permettant de relier un cable et un connecteur, en assurant la continuite du blindage electromagnetique de l'ensemble.
CN103402914B (zh) * 2011-03-23 2015-08-12 积水化学工业株式会社 氧化薄片化石墨衍生物、其树脂复合材料以及该树脂复合材料的制造方法
AU2012250670C1 (en) * 2011-05-03 2016-07-21 The Board Of Regents For Oklahoma State University Polyethylene terephthalate-graphene nanocomposites
DE102011081517A1 (de) * 2011-08-24 2013-02-28 Endress + Hauser Gmbh + Co. Kg Feldgerät für die Automatisierungstechnik
JP2013147707A (ja) * 2012-01-19 2013-08-01 Sunarrow Ltd 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物
US8691335B2 (en) * 2012-02-08 2014-04-08 Empire Technology Development, Llc Coating a substance with graphene
KR101392880B1 (ko) * 2012-02-21 2014-05-12 주식회사 카보랩 방열 코팅 조성물, 이를 코팅시킨 방열판 및 그 제조방법
US20130224905A1 (en) * 2012-02-27 2013-08-29 E I Du Pont De Nemours And Company Silver paste and use thereof in the production of solar cells
CN102888041B (zh) * 2012-10-18 2014-04-30 合肥工业大学 一种具有防静电和抗菌性能的薄膜包装材料及其制备方法
TW201500064A (zh) 2013-06-28 2015-01-01 Nat Univ Tsing Hua 抗菌材料及其製備與使用方法
CN107849292B (zh) 2015-03-17 2021-03-12 尼亚加拉装瓶有限责任公司 石墨烯增强的聚对苯二甲酸乙二醇酯
WO2017007568A1 (en) 2015-07-08 2017-01-12 Niagara Bottling, Llc Graphene reinforced polyethylene terephthalate
KR20180034611A (ko) * 2015-07-30 2018-04-04 바스프 에스이 플라스틱 표면을 금속화하는 방법
JP6322663B2 (ja) * 2016-03-28 2018-05-09 株式会社Ｓｕｂａｒｕ 樹脂組成物の成形品の接合構造
JP6939150B2 (ja) * 2017-06-30 2021-09-22 東洋インキＳｃホールディングス株式会社 導電性組成物および導体膜の製造方法
US11332830B2 (en) 2017-11-15 2022-05-17 Global Graphene Group, Inc. Functionalized graphene-mediated metallization of polymer article
CN110158132A (zh) * 2018-02-13 2019-08-23 华瑞墨石丹阳有限公司 一种绝缘材料的电镀方法
WO2019182652A1 (en) * 2018-03-19 2019-09-26 Nanotek Instruments, Inc. Apparatus for graphene-mediated production of metallized polymer articles
US20200002470A1 (en) 2018-05-09 2020-01-02 Niagara Bottling, Llc Poly(ethylene terephthalate)-graphene nanocomposites from improved dispersion
DE102018111595A1 (de) * 2018-05-15 2019-11-21 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
CN109096973A (zh) * 2018-06-28 2018-12-28 芜湖卓越线束系统有限公司 一种汽车线束用导电热熔胶及其制备方法
JP7561485B2 (ja) * 2019-01-15 2024-10-04 株式会社プロテリアル 導電性繊維、ケーブル及び導電性繊維の製造方法
DE102019104014A1 (de) * 2019-02-18 2020-08-20 Schreiner Group Gmbh & Co. Kg Transponderetikett und Herstellungsverfahren für ein Transponderetikett
EP3715406A1 (en) * 2019-03-29 2020-09-30 Henkel AG & Co. KGaA Process for modifying the surface polarity of rubber substrates
MX2021012056A (es) 2019-04-01 2022-02-21 Niagara Bottling Llc Compuesto de tereftalato de polietileno con grafeno para mejorar el consumo de energía de recalentamiento.
CN112409712A (zh) * 2019-08-20 2021-02-26 贝内克-长顺汽车内饰材料（张家港）有限公司 包含聚氯乙烯的组合物及其用途和由其得到的人造革
JP7350307B2 (ja) * 2019-10-30 2023-09-26 国立大学法人 名古屋工業大学 Ａｇ－グラフェン複合めっき膜金属製端子とその製造方法
EP4103422A1 (en) * 2020-02-10 2022-12-21 Deiana, Roberto Production of plastic touch controls using laser-etched conductive layers
US11719865B2 (en) * 2020-03-11 2023-08-08 Apple Inc. Visible-light-reflecting coatings for electronic devices
WO2023243528A1 (ja) * 2022-06-17 2023-12-21 芝浦機械株式会社 導電層付樹脂基材の形成方法
CN115850788B (zh) * 2023-01-03 2023-12-12 吉林大学 一种导热填料/聚酰亚胺气凝胶金属化高导热复合材料及制备方法

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1300266B (de) * 1960-06-10 1969-07-31 Bayer Ag Verfahren zur Herstellung hochmolekularer, linearer Polycarbonate
DE1495730B2 (de) * 1963-07-24 1971-03-18 Farbenfabriken Bayer AG, 5090 Le verkusen Verfahren zum herstellen thermoplastischer polykondensations produkte
US3737409A (en) * 1971-03-08 1973-06-05 Gen Electric Copolycarbonate of bis-3,5-dimethyl-4-hydroxyphenyl)sulfone with bisphenol-a
JPS5313610A (en) * 1976-07-23 1978-02-07 Nippon Carbon Co Ltd Compound sheet materials
DE2826925A1 (de) * 1978-06-20 1980-01-17 Basf Ag Witterungsbestaendige, schlagzaehe thermoplastische massen mit guter einfaerbbarkeit
DE3040784C2 (de) * 1980-10-29 1982-11-18 Schildkröt Spielwaren GmbH, 8057 Eching Verfahren zum Aufbringen eines metallischen Überzuges und hierfür geeigneter Leitlack
DE3149358A1 (de) * 1981-12-12 1983-06-16 Basf Ag, 6700 Ludwigshafen Thermoplastische formmasse
JPS60110893A (ja) * 1983-11-17 1985-06-17 Kansai Paint Co Ltd プラスチック製品の導電化処理法
DE3414118A1 (de) * 1984-04-14 1985-10-24 Basf Ag, 6700 Ludwigshafen Thermoplastische formmassen
JPS61151243A (ja) * 1984-12-25 1986-07-09 Isuzu Motors Ltd 樹脂成形品の塗装前処理方法
AT383991B (de) * 1985-11-14 1987-09-10 Klepsch Senoplast Verfahren zur herstellung von verbundplatten
DE3601421A1 (de) * 1986-01-20 1987-07-23 Basf Ag Thermoplastische formmassen
US5269891A (en) * 1989-03-09 1993-12-14 Novo Nordisk A/S Method and apparatus for determination of a constituent in a fluid
JP2847829B2 (ja) * 1989-12-11 1999-01-20 株式会社吉田商店 膨脹黒鉛分散複合樹脂成形体
DE4011162A1 (de) * 1990-04-06 1991-10-10 Basf Ag Thermoplastische formmasse
US5250228A (en) * 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
US5591382A (en) * 1993-03-31 1997-01-07 Hyperion Catalysis International Inc. High strength conductive polymers
US5390412A (en) * 1993-04-08 1995-02-21 Gregoire; George D. Method for making printed circuit boards
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US5725807A (en) * 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
DE4420952A1 (de) * 1994-06-17 1995-12-21 Basf Ag Thermoplastisches Elastomer
DE19615533A1 (de) * 1996-04-19 1997-10-23 Basf Ag Thermoplastische Formmasse
DE19728629A1 (de) * 1997-07-04 1999-01-07 Basf Ag Thermoplastische Formmassen mit geringer Eigenfarbe
JP2000256892A (ja) * 1999-03-11 2000-09-19 Mikuni Color Ltd プラスチック成形品のメッキ方法
JP2000265086A (ja) * 1999-03-11 2000-09-26 Mikuni Color Ltd 導電性塗料組成物とそれを用いた導電化処理方法
AU2001273816A1 (en) * 2000-03-30 2001-10-08 Aurentum Innovationstechnologien Gmbh Method of printing and corresponding print machine
DE10228376A1 (de) * 2002-06-25 2004-01-15 Basf Ag Formteil umfassend eine Verbundschichtplatte oder -folie und eine Trägerschicht
US6927250B2 (en) * 2002-08-15 2005-08-09 Advanced Energy Technology Inc. Graphite composites and methods of making such composites
US20060241237A1 (en) * 2002-09-12 2006-10-26 Board Of Trustees Of Michigan State University Continuous process for producing exfoliated nano-graphite platelets
JP4365114B2 (ja) * 2003-02-28 2009-11-18 トヨタ自動車株式会社 無電解めっき素材の前処理方法とめっき被覆部材の製造方法及びめっき部品
DE10321081A1 (de) * 2003-05-09 2004-12-02 Basf Ag Mischungen enthaltend thermoplastisches Polyurethan und ASA
US7354354B2 (en) * 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
WO2007039323A1 (de) * 2005-04-27 2007-04-12 Basf Aktiengesellschaft Kunststoffgegenstände zur metallisierung mit verbesserten formgebungseigenschaften
US20080210463A1 (en) * 2005-04-27 2008-09-04 Basf Aktiengesellschaft Plastics Articles for Metalization with Improved Shaping Properties
JP4681373B2 (ja) * 2005-07-06 2011-05-11 帝人化成株式会社 熱可塑性樹脂組成物
US7658901B2 (en) * 2005-10-14 2010-02-09 The Trustees Of Princeton University Thermally exfoliated graphite oxide
JP4468295B2 (ja) * 2005-12-15 2010-05-26 ダイセルポリマー株式会社 めっき樹脂成形体
EP2010700B1 (de) * 2006-04-18 2010-01-20 Basf Se Vorrichtung und verfahren zur galvanischen beschichtung
US20090101511A1 (en) * 2006-04-18 2009-04-23 Rene Lochtman Electroplating device and method
EP2033501A1 (de) * 2006-06-14 2009-03-11 Basf Se Verfahren zur herstellung von elektrisch leitfähigen oberflächen auf einem träger
WO2008015168A1 (de) * 2006-08-03 2008-02-07 Basf Se Verfahren zum aufbringen einer metallschicht auf einem substrat
EP2052018A2 (en) * 2006-08-10 2009-04-29 Dow Global Technologies Inc. Polymers filled with highly expanded graphite
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
CA2674702A1 (en) * 2007-01-05 2008-07-10 Basf Se Method for producing electrically conductive surfaces
TWI368722B (en) * 2007-01-17 2012-07-21 Univ Feng Chia Heat dissipation structure
US7849875B2 (en) * 2007-07-31 2010-12-14 Alcon, Inc. Check valve
US9600067B2 (en) * 2008-10-27 2017-03-21 Sri International System and method for generating a mixed reality environment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101537638B1 (ko) * 2010-05-18 2015-07-17 삼성전자 주식회사 그라펜 박막을 이용한 수지의 도금 방법

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WO2009112573A3 (de) 2010-02-25
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