KR20100017712A - 과잉 에폭시 수지를 포함하는 에폭시 열경화성 조성물 및 이의 제조 방법 - Google Patents

과잉 에폭시 수지를 포함하는 에폭시 열경화성 조성물 및 이의 제조 방법 Download PDF

Info

Publication number
KR20100017712A
KR20100017712A KR1020097025616A KR20097025616A KR20100017712A KR 20100017712 A KR20100017712 A KR 20100017712A KR 1020097025616 A KR1020097025616 A KR 1020097025616A KR 20097025616 A KR20097025616 A KR 20097025616A KR 20100017712 A KR20100017712 A KR 20100017712A
Authority
KR
South Korea
Prior art keywords
epoxy
epoxy resin
excess
groups
catalyst
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097025616A
Other languages
English (en)
Korean (ko)
Inventor
마우리스 조엘 마크스
코트니 로렌스 셔만
Original Assignee
다우 글로벌 테크놀로지스 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 글로벌 테크놀로지스 인크. filed Critical 다우 글로벌 테크놀로지스 인크.
Publication of KR20100017712A publication Critical patent/KR20100017712A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020097025616A 2007-05-09 2008-04-22 과잉 에폭시 수지를 포함하는 에폭시 열경화성 조성물 및 이의 제조 방법 Ceased KR20100017712A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92848207P 2007-05-09 2007-05-09
US60/928,482 2007-05-09

Publications (1)

Publication Number Publication Date
KR20100017712A true KR20100017712A (ko) 2010-02-16

Family

ID=39673147

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097025616A Ceased KR20100017712A (ko) 2007-05-09 2008-04-22 과잉 에폭시 수지를 포함하는 에폭시 열경화성 조성물 및 이의 제조 방법

Country Status (8)

Country Link
US (1) US20100144965A1 (enExample)
EP (1) EP2147034B1 (enExample)
JP (1) JP2010526907A (enExample)
KR (1) KR20100017712A (enExample)
CN (2) CN101679603A (enExample)
BR (1) BRPI0810290A2 (enExample)
TW (1) TWI372766B (enExample)
WO (1) WO2008140906A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2581832C2 (ru) 2010-05-21 2016-04-20 БЛЮ КЬЮБ АйПи ЭлЭлСи Отверждаемые композиции
US20110319564A1 (en) 2010-06-24 2011-12-29 Larry Steven Corley Epoxy systems for composites
WO2012177392A1 (en) 2011-06-24 2012-12-27 Dow Global Technolgies Llc Thermosetting composition and process for preparing fiber-reinforced composites
WO2013003202A1 (en) 2011-06-30 2013-01-03 Dow Global Technologies Llc Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups
EP2794757B1 (en) * 2011-12-20 2019-05-15 Dow Global Technologies LLC Process for preparing cured epoxy composites
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
BR112015010679A2 (pt) 2012-11-13 2017-07-11 Dow Global Technologies Llc sistema de resina epóxi curável, processo para formar um compósito de epóxi reforçado com fibra e compósito reforçado com fibra curada
US9688807B2 (en) 2012-11-13 2017-06-27 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
WO2014100238A2 (en) 2012-12-21 2014-06-26 Dow Global Technologies Llc Phase-segmented non-isocyanate elastomers
CN104955865B (zh) 2012-12-21 2017-12-19 陶氏环球技术有限责任公司 硫醇固化弹性体环氧树脂
JP6379110B2 (ja) 2012-12-21 2018-08-29 ダウ グローバル テクノロジーズ エルエルシー 電気ケーブル接続のための非イソシアネート系シーラント
CA2922853C (en) 2013-09-16 2020-10-20 Dow Global Technologies Llc Polyurethane elastomer for use in subsea pipeline insulation
WO2015094896A1 (en) 2013-12-18 2015-06-25 Dow Global Technologies Llc Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents
WO2015103427A1 (en) 2013-12-31 2015-07-09 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
JP6641283B2 (ja) 2014-02-07 2020-02-05 ダウ グローバル テクノロジーズ エルエルシー 速硬化性で高ガラス転移温度のエポキシ樹脂系
KR102322526B1 (ko) 2014-03-18 2021-11-08 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지 시스템
WO2015164031A1 (en) 2014-04-22 2015-10-29 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
KR102375219B1 (ko) 2014-07-17 2022-03-17 다우 글로벌 테크놀로지스 엘엘씨 트리에틸아민테트라아민 및 주석 촉매를 이용한 에폭시 시스템
US10253135B2 (en) 2014-09-12 2019-04-09 Drexel University Toughening of anhydride cured thermosetting epoxy polymers using grafted triglycerides
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
EP3218421B1 (en) 2014-11-11 2020-03-11 Dow Global Technologies LLC Fast curing high glass transition temperature epoxy resin system
EP3237485A1 (en) 2014-12-24 2017-11-01 Dow Global Technologies LLC Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system
JP6978326B2 (ja) 2015-06-25 2021-12-08 ダウ グローバル テクノロジーズ エルエルシー 炭素繊維複合材を作製するための新規エポキシ樹脂系
CN107922590B (zh) 2015-07-07 2020-08-04 陶氏环球技术有限责任公司 用于制造复合材料的稳定高玻璃化转变温度环氧树脂系统
KR102716321B1 (ko) * 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
CN109790279B (zh) 2016-08-19 2022-06-28 陶氏环球技术有限责任公司 含有内部脱模剂的环氧树脂组合物
US11261289B2 (en) 2016-10-17 2022-03-01 Warren Environmental & Coating, Llc Method of lining a pipeline with a delayed curing resin composition
WO2018164794A1 (en) 2017-03-09 2018-09-13 Dow Global Technologies Llc Stable epoxy/internal mold release agent blends for the manufacture of composite articles
JP7028884B2 (ja) 2017-03-17 2022-03-02 ダウ グローバル テクノロジーズ エルエルシー エポキシ-アクリルハイブリッド接着剤
JP2020524187A (ja) 2017-06-20 2020-08-13 ダウ グローバル テクノロジーズ エルエルシー 繊維強化複合材を製造するためのエポキシ樹脂系
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
WO2020033036A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033037A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
CN114651025B (zh) * 2019-11-14 2024-06-04 Dic株式会社 固化性组合物、固化物、纤维增强复合材料、成型品及其制造方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2750395A (en) * 1954-01-05 1956-06-12 Union Carbide & Carbon Corp Diepoxides
US2890194A (en) * 1956-05-24 1959-06-09 Union Carbide Corp Compositions of epoxides and polycarboxylic acid compounds
US3018262A (en) * 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
US3960979A (en) * 1974-12-24 1976-06-01 E. I. Du Pont De Nemours And Company High solids can coating compositions based on epoxy resin crosslinking agent, flexibilizing polyol, co-reactive acid catalyst, and surface modifier
US4018848A (en) * 1974-12-24 1977-04-19 E. I. Du Pont De Nemours And Company High solids can coating compositions based on epoxy resin, crosslinking agent, flexibilizing polyol, co-reactive acid catalyst, and surface modifier
US3969979A (en) * 1975-07-29 1976-07-20 Sun Ventures, Inc. Liquid propellant for a gun
US4076764A (en) * 1976-07-22 1978-02-28 Shell Oil Company Epoxy resin composition having improved physical properties
US4181784A (en) * 1977-12-27 1980-01-01 Ford Motor Company High solids coating composition adapted for use as automotive topcoat--#1
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents
US4595623A (en) * 1984-05-07 1986-06-17 Hughes Aircraft Company Fiber-reinforced syntactic foam composites and method of forming same
US4656207A (en) * 1985-02-19 1987-04-07 Hercules Incorporated Epoxy thermosets having improved toughness
EP0249262A3 (en) * 1986-06-09 1990-07-04 Shell Internationale Researchmaatschappij B.V. Thermoplastic polymer composition having thermosetting processing characteristics
CN1040810A (zh) * 1988-04-30 1990-03-28 三井东圧化学株式会社 多硫化合物基树脂透镜及其制备方法
GB8912952D0 (en) * 1989-06-06 1989-07-26 Dow Rheinmuenster Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
US5385990A (en) * 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance
JPH07228580A (ja) * 1993-12-21 1995-08-29 Yuka Shell Epoxy Kk 変性多価エポキシ化合物、同化合物の製造方法及びエポキシ樹脂組成物
GB9411367D0 (en) * 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US5962586A (en) * 1994-09-27 1999-10-05 Harper; John D. Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US5686185A (en) * 1996-06-28 1997-11-11 Morton International, Inc. Disbondment resistant epoxy powder coating composition
US6153719A (en) * 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
JP2000273280A (ja) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
US6469074B1 (en) * 1999-05-26 2002-10-22 Matsushita Electric Works, Ltd. Composition of cyanate ester, epoxy resin and acid anhydride
US6632893B2 (en) * 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
DE19956893A1 (de) * 1999-11-26 2001-05-31 Daimler Chrysler Ag Kühlkreis für einen Verbrennungsmotor
US20040082720A1 (en) * 2000-07-18 2004-04-29 Fmc Corporation Adducts of amine-terminated polyolefins and epoxides
JP2002212390A (ja) * 2001-01-19 2002-07-31 Hitachi Chem Co Ltd 絶縁樹脂組成物、銅箔付き絶縁材および銅張積層板
US6572971B2 (en) * 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) * 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
US6808819B2 (en) * 2002-02-14 2004-10-26 Shin Etsu Chemical Co., Ltd. Heat resistant resin composition and adhesive film
JP4047613B2 (ja) * 2002-03-29 2008-02-13 住友ベークライト株式会社 液状封止樹脂及びそれを用いた半導体装置
JP3862004B2 (ja) * 2002-05-10 2006-12-27 信越化学工業株式会社 耐熱性樹脂組成物及びそれを用いた接着フィルム
GB0212062D0 (en) * 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
JP4120780B2 (ja) * 2002-07-19 2008-07-16 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
US7163973B2 (en) * 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US20050215656A1 (en) * 2002-11-28 2005-09-29 Taiyo Ink Manufacturing Co., Ltd. Photocurable and thermosetting resin composition and printed circuit boards made by using the same
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices
US8048819B2 (en) * 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
US20110319564A1 (en) * 2010-06-24 2011-12-29 Larry Steven Corley Epoxy systems for composites
US20120328811A1 (en) * 2011-06-24 2012-12-27 Air Products And Chemicals, Inc. Epoxy Resin Compositions

Also Published As

Publication number Publication date
US20100144965A1 (en) 2010-06-10
CN101679603A (zh) 2010-03-24
BRPI0810290A2 (pt) 2014-11-04
WO2008140906A1 (en) 2008-11-20
CN103059267A (zh) 2013-04-24
EP2147034A1 (en) 2010-01-27
TWI372766B (en) 2012-09-21
EP2147034B1 (en) 2014-12-17
TW200914482A (en) 2009-04-01
JP2010526907A (ja) 2010-08-05

Similar Documents

Publication Publication Date Title
EP2147034B1 (en) Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof
US8404310B2 (en) Thermoset dampener material
CN101910238B (zh) 用于复合材料应用的高Tg环氧体系
KR101150311B1 (ko) 열경화성 에폭시 수지의 경화제로서 디시안디아미드를 사용한 디메틸포름아미드가 없는 제형
CA2720844C (en) Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions
CN101998970B (zh) 用于粉末涂料应用的环氧-咪唑催化剂
CN102471561A (zh) 用于电工用层压板组合物的核/壳橡胶
KR20100084561A (ko) 전기적 적층물에 사용하기 위한 이소시아누레이트 함유 에폭시 수지 조성물
CN118834371A (zh) 一种高Tg值可降解的热固性复合材料及其制备的可降解井下封堵工具
HK1151810B (en) Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20091208

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20130417

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20140626

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20140923

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20140626

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I