TWI372766B - Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof - Google Patents

Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof

Info

Publication number
TWI372766B
TWI372766B TW097115210A TW97115210A TWI372766B TW I372766 B TWI372766 B TW I372766B TW 097115210 A TW097115210 A TW 097115210A TW 97115210 A TW97115210 A TW 97115210A TW I372766 B TWI372766 B TW I372766B
Authority
TW
Taiwan
Prior art keywords
preparation
epoxy
excess
epoxy resin
thermoset compositions
Prior art date
Application number
TW097115210A
Other languages
English (en)
Chinese (zh)
Other versions
TW200914482A (en
Inventor
Maurice Joel Marks
Courtney Lawrence Sherman
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of TW200914482A publication Critical patent/TW200914482A/zh
Application granted granted Critical
Publication of TWI372766B publication Critical patent/TWI372766B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW097115210A 2007-05-09 2008-04-25 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof TWI372766B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92848207P 2007-05-09 2007-05-09

Publications (2)

Publication Number Publication Date
TW200914482A TW200914482A (en) 2009-04-01
TWI372766B true TWI372766B (en) 2012-09-21

Family

ID=39673147

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097115210A TWI372766B (en) 2007-05-09 2008-04-25 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof

Country Status (8)

Country Link
US (1) US20100144965A1 (enExample)
EP (1) EP2147034B1 (enExample)
JP (1) JP2010526907A (enExample)
KR (1) KR20100017712A (enExample)
CN (2) CN103059267A (enExample)
BR (1) BRPI0810290A2 (enExample)
TW (1) TWI372766B (enExample)
WO (1) WO2008140906A1 (enExample)

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JP6008958B2 (ja) 2011-06-30 2016-10-19 ダウ グローバル テクノロジーズ エルエルシー アミン硬化剤の混合物及び過剰のエポキシ基を含む硬化性エポキシ樹脂系
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WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
JP6320403B2 (ja) 2012-11-13 2018-05-09 ダウ グローバル テクノロジーズ エルエルシー 樹脂移送成形プロセスのためのポリエチレンテトラアミンおよびトリエチレンジアミン触媒を含有するエポキシ樹脂系
WO2014078219A1 (en) * 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
BR112015015018B1 (pt) 2012-12-21 2021-09-21 Dow Global Technologies Llc Processo para formar um polímero elastomérico e polímero elastomérico
WO2014100242A1 (en) 2012-12-21 2014-06-26 Dow Global Technologies Llc Non-isocyanate sealant for electrical cable joining
EP2935390A2 (en) 2012-12-21 2015-10-28 Dow Global Technologies LLC Thiol-cured elastomeric epoxy resins
DK3046943T3 (da) 2013-09-16 2020-04-27 Dow Global Technologies Llc Polyurethanelastomer til anvendelse til isolering af undersøiske rørledninger
CA2933688C (en) 2013-12-18 2022-01-18 Dow Global Technologies Llc Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents
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EP3102622B1 (en) 2014-02-07 2019-01-09 Dow Global Technologies Llc Fast curing high glass transition temperature epoxy resin system
KR102322526B1 (ko) 2014-03-18 2021-11-08 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지 시스템
EP3134448B1 (en) 2014-04-22 2018-09-26 Dow Global Technologies LLC Polyurethane-acrylate epoxy adhesive
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US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
WO2016077095A1 (en) 2014-11-11 2016-05-19 Dow Global Technologies Llc Fast curing high glass transition temperature epoxy resin system
US20170369635A1 (en) 2014-12-24 2017-12-28 Dow Global Technologies Llc Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system
CN107743503B (zh) 2015-06-25 2020-03-31 陶氏环球技术有限责任公司 用于制造碳纤维复合材料的新型环氧树脂体系
WO2017007650A1 (en) 2015-07-07 2017-01-12 Dow Global Technologies Llc Stable high glass transition temperature epoxy resin system for making composites
KR102716321B1 (ko) 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
WO2018034856A1 (en) 2016-08-19 2018-02-22 Dow Global Technologies Llc Epoxy resin compositions containing an internal mold release agent
US11261289B2 (en) * 2016-10-17 2022-03-01 Warren Environmental & Coating, Llc Method of lining a pipeline with a delayed curing resin composition
US20200181361A1 (en) 2017-03-09 2020-06-11 Dow Global Technologies Llc Stable epoxy/internal mold release agent blends for the manufacture of composite articles
EP3596182B1 (en) 2017-03-17 2021-06-30 Dow Global Technologies LLC Epoxy-acrylic hybrid adhesive
EP3642256A1 (en) 2017-06-20 2020-04-29 Dow Global Technologies LLC Epoxy resin system for making fiber reinforced composites
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
WO2020033037A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033036A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
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Also Published As

Publication number Publication date
CN103059267A (zh) 2013-04-24
CN101679603A (zh) 2010-03-24
EP2147034B1 (en) 2014-12-17
US20100144965A1 (en) 2010-06-10
BRPI0810290A2 (pt) 2014-11-04
EP2147034A1 (en) 2010-01-27
WO2008140906A1 (en) 2008-11-20
KR20100017712A (ko) 2010-02-16
TW200914482A (en) 2009-04-01
JP2010526907A (ja) 2010-08-05

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees