KR20090088793A - 도전성 접착 필름, 도전성 접착 필름의 제조 방법, 도전성 접착 필름을 사용한 전자 기기, 도전성 접착 필름을 사용한전자 기기의 제조 방법 - Google Patents

도전성 접착 필름, 도전성 접착 필름의 제조 방법, 도전성 접착 필름을 사용한 전자 기기, 도전성 접착 필름을 사용한전자 기기의 제조 방법 Download PDF

Info

Publication number
KR20090088793A
KR20090088793A KR1020090005936A KR20090005936A KR20090088793A KR 20090088793 A KR20090088793 A KR 20090088793A KR 1020090005936 A KR1020090005936 A KR 1020090005936A KR 20090005936 A KR20090005936 A KR 20090005936A KR 20090088793 A KR20090088793 A KR 20090088793A
Authority
KR
South Korea
Prior art keywords
terminal
adhesive film
electroconductive
electroconductive particle
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020090005936A
Other languages
English (en)
Korean (ko)
Inventor
무네히데 사이멘
Original Assignee
세이코 엡슨 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세이코 엡슨 가부시키가이샤 filed Critical 세이코 엡슨 가부시키가이샤
Publication of KR20090088793A publication Critical patent/KR20090088793A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020090005936A 2008-02-15 2009-01-23 도전성 접착 필름, 도전성 접착 필름의 제조 방법, 도전성 접착 필름을 사용한 전자 기기, 도전성 접착 필름을 사용한전자 기기의 제조 방법 Withdrawn KR20090088793A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008034119A JP2009191185A (ja) 2008-02-15 2008-02-15 導電性接着フィルム、導電性接着フィルムの製造方法、導電性接着フィルムを用いた電子機器、導電性接着フィルムを用いた電子機器の製造方法
JPJP-P-2008-034119 2008-02-15

Publications (1)

Publication Number Publication Date
KR20090088793A true KR20090088793A (ko) 2009-08-20

Family

ID=40955381

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090005936A Withdrawn KR20090088793A (ko) 2008-02-15 2009-01-23 도전성 접착 필름, 도전성 접착 필름의 제조 방법, 도전성 접착 필름을 사용한 전자 기기, 도전성 접착 필름을 사용한전자 기기의 제조 방법

Country Status (4)

Country Link
US (1) US20090208731A1 (https=)
JP (1) JP2009191185A (https=)
KR (1) KR20090088793A (https=)
CN (1) CN101508873A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101533304B1 (ko) * 2013-11-01 2015-07-02 에이큐 주식회사 단자부와 안테나 패턴부를 연결하는 장치

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009186707A (ja) * 2008-02-06 2009-08-20 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置
JP5543267B2 (ja) * 2010-05-07 2014-07-09 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法、並びに実装体及びその製造方法
CN102097342B (zh) * 2010-11-29 2013-04-17 南通富士通微电子股份有限公司 封装系统及装片胶厚度控制方法
JP2013037843A (ja) * 2011-08-05 2013-02-21 Sekisui Chem Co Ltd 接続構造体及び接続構造体の製造方法
TWI748856B (zh) * 2021-01-29 2021-12-01 錼創顯示科技股份有限公司 微型發光二極體及顯示面板
WO2023092509A1 (zh) * 2021-11-26 2023-06-01 京东方科技集团股份有限公司 导电胶膜及其制作方法、电子设备及其制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362411A (ja) * 1989-07-31 1991-03-18 Canon Inc 異方性導電フィルムの製造方法
JPH07115260A (ja) * 1993-10-19 1995-05-02 Ricoh Co Ltd 電子部品の接続構造
US5808874A (en) * 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
CN1139840C (zh) * 1997-06-13 2004-02-25 积水化学株式会社 安排微粒的方法、液晶显示器和各向异性导电膜
JPH11219982A (ja) * 1998-02-04 1999-08-10 Sony Chem Corp 導電粒子及びそれを用いた異方性導電接着剤
JP3622665B2 (ja) * 1999-12-10 2005-02-23 セイコーエプソン株式会社 接続構造、電気光学装置および電子機器
JP3816717B2 (ja) * 2000-03-10 2006-08-30 セイコーエプソン株式会社 液晶装置及びその製造方法
JP3454223B2 (ja) * 2000-03-27 2003-10-06 ソニーケミカル株式会社 半導体装置の製造方法
JP4865144B2 (ja) * 2001-05-08 2012-02-01 旭化成株式会社 接着剤層への粒子の配置方法
JP2003051661A (ja) * 2001-08-03 2003-02-21 Sekisui Chem Co Ltd 導電接続構造体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101533304B1 (ko) * 2013-11-01 2015-07-02 에이큐 주식회사 단자부와 안테나 패턴부를 연결하는 장치

Also Published As

Publication number Publication date
CN101508873A (zh) 2009-08-19
US20090208731A1 (en) 2009-08-20
JP2009191185A (ja) 2009-08-27

Similar Documents

Publication Publication Date Title
KR102417922B1 (ko) 측면 배선이 형성된 글라스 기판을 구비한 디스플레이 모듈 및 디스플레이 모듈 제조 방법
US8016181B2 (en) Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device
KR101195688B1 (ko) 플렉시블 기판 및 전기 회로 구조체
US8497432B2 (en) Electronic component mounting structure
US20190245283A1 (en) Display device
KR20090088793A (ko) 도전성 접착 필름, 도전성 접착 필름의 제조 방법, 도전성 접착 필름을 사용한 전자 기기, 도전성 접착 필름을 사용한전자 기기의 제조 방법
KR20170139217A (ko) 표시장치 및 이의 제조방법
CN101297340A (zh) 显示装置
KR20090058987A (ko) 액정표시장치의 제조방법 및 액정표시장치의 필름 캐리어테이프 제조방법
KR100622170B1 (ko) 전자 부품의 실장 방법, 전자 부품의 실장 구조, 전자부품 모듈 및 전자 기기
KR100673278B1 (ko) 영상 장치 및 그 제조 방법
JP4240111B2 (ja) 電気光学装置の製造方法
JP4740662B2 (ja) 表示装置及びその製造方法
TWI338354B (https=)
US11410966B2 (en) Display device and method of manufacturing the same
JP3853822B2 (ja) 実装部品およびこれを使用した液晶表示パネル、並びにこの液晶表示パネルの製造方法
JP5332219B2 (ja) 電気光学装置の製造方法
KR20200080166A (ko) 표시 장치 및 표시 장치의 제조 방법
JP2009186706A (ja) 電気光学装置の製造方法、電気光学装置
JP3598902B2 (ja) 基板接続構造及び電気光学装置
JP3911931B2 (ja) 液晶装置、液晶装置の製造方法及び電子機器
JP2005167274A (ja) 半導体装置、半導体装置の製造方法並びに液晶表示装置
JP2009186541A (ja) 電気光学装置の製造方法、電気光学装置
KR20130040639A (ko) 반도체 패키지
JP2008134380A (ja) 吸着テーブル

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20090123

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid