KR20090075740A - 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 - Google Patents
접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 Download PDFInfo
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Abstract
Description
항목 | 시료1 | 시료2 | 시료3 | 시료4 | |
상용성 | 비상용 | 비상용 | 비상용 | 비상용 | |
접착 필름 | 1 | 2 | 3 | 4 | |
S/(V1/2) | 3.55 | 3.55 | 3.55 | 3.55 | |
휘발 분량 (중량%) | 열판:140℃ | 0 | 0 | 0.55 | 0.48 |
열판:160℃ | 0.02 | 0.05 | 0.64 | 0.59 | |
열판:180℃ | 0.07 | 0.09 | 0.90 | 0.84 | |
열판:230℃ | 0.30 | 0.42 | 1.34 | 1.29 | |
열판:250℃ | 0.52 | 0.56 | 1.85 | 1.77 | |
열판:270℃ | 0.80 | 0.90 | 2.60 | 2.51 | |
내열성 | 내리플로우 크랙 | O | O | O | X |
내온도 사이클 | O | O | O | X | |
내습성 | O | O | O | O |
항목 | 시료5 | 시료6 | 시료7 | 시료8 | 시료9 | 시료10 | |
상용성 | 비상용 | 비상용 | 비상용 | 비상용 | 비상용 | 비상용 | |
접착 필름 | F-1 | F-2 | F-3 | F-4 | F-5 | F-6 | |
휘발 분량 (중량%) | 열판:140℃ | 0 | 0 | 0 | 0.55 | 0.48 | 0 |
열판:160℃ | 0 | 0 | 0 | 0.64 | 0.59 | 0 | |
열판:180℃ | 0.01 | 0 | 0 | 0.90 | 0.84 | 0.08 | |
열판:230℃ | 0.05 | 0.01 | 0.02 | 1.34 | 1.29 | 0.09 | |
열판:250℃ | 0.09 | 0.04 | 0.10 | 1.85 | 1.77 | 0.13 | |
열판:270℃ | 0.27 | 0.24 | 0.25 | 2.60 | 2.51 | 0.30 |
항목 | 시료5 | 시료6 | 시료7 | 시료8 | 시료9 | 시료10 | |
접착 필름 | F-1 | F-2 | F-3 | F-4 | F-5 | F-6 | |
내열성 | 내리플로우 크랙 | O | O | O | O | O | X |
내온도 사이클 | O | O | O | O | O | X | |
내습성 | O | O | O | O | O | O |
평가 항목 | 시료11 | 시료12 | 시료13 | 시료14 | 비교 시료1 | |
박리 강도(N/m) | 240℃ | 108 | 74 | 110 | 42 | 11 |
탄성률(MPa) | 240℃ | 2.9 | 3.6 | 2.8 | 2.4 | 3.8 |
땜납 내열성 | 240℃ | O | O | O | O | X |
260℃ | O | O | O | △ | X | |
280℃ | O | △ | O | △ | X | |
내PCT성 | O | O | O | X | X | |
상용성 | 비상용 | 비상용 | 비상용 | 비상용 | 상용 | |
VA/VB | 1.1 | 1.0 | 1.1 | 1.1 | 1.1 | |
S/V1/2 | 3.7 | 3.8 | 3.8 | 3.8 | 3.7 | |
에폭시 수지의 연화점(℃) | 80 | 90 | 80 | 80 | 20 내지 40 | |
페놀 수지 흡수율(%) | 1.8 | 1.8 | 1.6 | 4.4 | 1.8 | |
중량 감소율(350℃)% | 4 | 4 | 4 | 18 | 4 | |
내리플로우성 | 245℃ | O | O | O | O | X |
260℃ | O | O | O | X | X | |
265℃ | O | O | O | X | X |
시료15 | 시료16 | 시료17 | 시료18 | 시료19 | 시료20 | |
상용성 | 비상용 | 비상용 | 비상용 | 비상용 | 비상용 | 비상용 |
흡습 땜납 내열 시험 | ◎ | ◎ | ◎ | ◎ | ◎ | O |
PCT 100hr | O | O | O | O | O | O |
PCT 200hr | O | O | O | O | O | O |
PCT 300hr | O | O | O | O | O | O |
PCT 400hr | O | O | X | X | X | X |
시료21 | 시료22 | |
상용성 | 비상용 | 비상용 |
흡습 땜납 내열 시험 | ◎ | O |
PCT 100hr | O | O |
PCT 200hr | O | O |
PCT 300hr | O | X |
PCT 400hr | X | X |
시료23 | 시료24 | 시료25 | 시료26 | 비교시료2 | |
상용성 | 비상용 | 비상용 | 비상용 | 비상용 | 비상용 |
필러와 물의 접촉각(°):a | 43.2 | 43.2 | 96.5 | 41.7 | 128.0 |
수지계 경화물과 물의 접촉각(°):b | 144.0 | 128.0 | 144.0 | 144.0 | 144.0 |
접촉각 비(a/b) | 0.30 | 0.33 | 0.67 | 0.29 | 0.88 |
0.01 내지 2.0㎛의 공극의 존재 | 있음 | 있음 | 있음 | 있음 | 있음 |
공극의 체적 함유율(vol%) | 2.8 | 1.9 | 2.4 | 3.6 | 0.01 |
흡습 땜납 내열 시험 | ◎ | ◎ | O | O | X |
PCT 100hr | O | O | O | O | O |
PCT 200hr | O | O | O | O | X |
PCT 300hr | O | O | O | O | X |
PCT 400hr | O | O | O | O | X |
PCT 500hr | O | O | X | X | X |
Claims (5)
- (1) 반도체 웨이퍼에 접착 필름 및 다이싱 테이프를 라미네이트 하는 공정,(2) 웨이퍼 및 접착 필름을 칩으로 절단하는 공정, 및(3) (a) 회로 부착 기판 또는 회로 부착 필름과 (b) 칩을 접착 필름을 개재하여 접착하는 공정을 포함하는 반도체 장치의 제조 방법이며,상기 접착 필름이(a) 에폭시 수지,(b) 경화제, 및(c) 에폭시기 함유 아크릴 공중합체를 함유하고,상기 (b) 경화제가 수산기 당량 150g/eq 이상의 페놀 수지인,반도체 장치의 제조 방법.
- 접착제층이 지지체 필름 상에 형성되어 있는 접착 필름이며,상기 접착제층은(a) 에폭시 수지,(b) 경화제, 및(c) 에폭시기 함유 아크릴 공중합체를 함유하고,상기 (b) 경화제가 수산기 당량 150g/eq 이상의 페놀 수지인,접착 필름.
- 제2항에 있어서, 상기 지지체 필름이 폴리테트라플루오로에틸렌 필름, 폴리에틸렌테레프탈레이트 필름, 폴리에틸렌 필름, 폴리프로필렌 필름, 폴리메틸펜텐 필름, 폴리이미드 필름으로 이루어지는 군으로부터 선택되는 플라스틱 필름인 접착 필름.
- 제2항에 있어서, 상기 지지체 필름의 표면이 이형처리된 것인 접착 필름.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000041346 | 2000-02-15 | ||
JPJP-P-2000-041346 | 2000-02-15 | ||
JP2000349739 | 2000-11-16 | ||
JPJP-P-2000-349739 | 2000-11-16 | ||
JP2000349737 | 2000-11-16 | ||
JPJP-P-2000-349737 | 2000-11-16 | ||
PCT/JP2001/001065 WO2001060938A1 (en) | 2000-02-15 | 2001-02-15 | Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
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KR1020087020763A KR20080081373A (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020117022047A KR101237137B1 (ko) | 2000-02-15 | 2001-02-15 | 반도체 장치 |
KR1020087020759A KR100928104B1 (ko) | 2000-02-15 | 2001-02-15 | 접착 필름 |
KR1020107029697A KR101289924B1 (ko) | 2000-02-15 | 2001-02-15 | 반도체 장치 |
KR1020097010697A KR100931745B1 (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020087020764A KR20080087046A (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020087020766A KR101032227B1 (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020127001240A KR101319171B1 (ko) | 2000-02-15 | 2001-02-15 | 접착 필름 및 반도체 장치의 제조 방법 |
KR1020087020760A KR20080087045A (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
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KR1020137008594A KR101312197B1 (ko) | 2000-02-15 | 2001-02-15 | 반도체 장치 |
KR1020097010672A KR20090075736A (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
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KR1020087020763A KR20080081373A (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020117022047A KR101237137B1 (ko) | 2000-02-15 | 2001-02-15 | 반도체 장치 |
KR1020087020759A KR100928104B1 (ko) | 2000-02-15 | 2001-02-15 | 접착 필름 |
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KR1020087020766A KR101032227B1 (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020127001240A KR101319171B1 (ko) | 2000-02-15 | 2001-02-15 | 접착 필름 및 반도체 장치의 제조 방법 |
KR1020087020760A KR20080087045A (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020087020765A KR101032257B1 (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020137008594A KR101312197B1 (ko) | 2000-02-15 | 2001-02-15 | 반도체 장치 |
KR1020097010672A KR20090075736A (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020097010696A KR100931744B1 (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020097010695A KR100931743B1 (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
KR1020087020761A KR100931742B1 (ko) | 2000-02-15 | 2001-02-15 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
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US (9) | US20030069331A1 (ko) |
JP (8) | JP2008208367A (ko) |
KR (16) | KR100889101B1 (ko) |
CN (1) | CN1208418C (ko) |
AU (1) | AU2001232298A1 (ko) |
TW (1) | TWI299748B (ko) |
WO (1) | WO2001060938A1 (ko) |
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- 2001-02-15 KR KR1020117022047A patent/KR101237137B1/ko active IP Right Grant
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