KR20090021333A - 분류 땜납조 - Google Patents
분류 땜납조 Download PDFInfo
- Publication number
- KR20090021333A KR20090021333A KR1020087026892A KR20087026892A KR20090021333A KR 20090021333 A KR20090021333 A KR 20090021333A KR 1020087026892 A KR1020087026892 A KR 1020087026892A KR 20087026892 A KR20087026892 A KR 20087026892A KR 20090021333 A KR20090021333 A KR 20090021333A
- Authority
- KR
- South Korea
- Prior art keywords
- casing
- screw pump
- solder
- pump
- duct
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
Description
Claims (2)
- 땜납조 내에 설치된 덕트의 일단에는 원통형의 케이싱이 형성되어 있고, 덕트의 타단에는 분류 노즐이 형성되어 있어 그 케이싱 내에 스크루 펌프가 배치된 분류 땜납조에 있어서, 케이싱의 하부에는 스크루 펌프의 직경보다 소직경인 유입 구멍이 천공되어 있는 것을 특징으로 하는 분류 땜납조.
- 땜납조 내에 설치된 덕트의 일단에는 원통형의 케이싱이 형성되어 있고, 덕트의 타단에는 분류 노즐이 형성되어 있어 그 케이싱 내에 스크루 펌프가 배치된 분류 땜납조에 있어서, 케이싱의 하부에는 스크루 펌프의 직경보다 소직경인 유입 구멍이 천공되어 있고, 게다가 케이싱의 상부는 일부가 덕트 방향을 향한 원호형의 유출구로 되어 있음과 함께, 그 유출구의 양측에는 가이드벽이 끝이 넓어지는 형상으로 형성되어 있는 것을 특징으로 하는 분류 땜납조.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006103736 | 2006-04-05 | ||
JPJP-P-2006-103736 | 2006-04-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090021333A true KR20090021333A (ko) | 2009-03-03 |
KR101076645B1 KR101076645B1 (ko) | 2011-10-27 |
Family
ID=38581143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020087026892A KR101076645B1 (ko) | 2006-04-05 | 2007-04-02 | 분류 땜납조 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7959055B2 (ko) |
EP (1) | EP2022590B1 (ko) |
JP (1) | JP4893738B2 (ko) |
KR (1) | KR101076645B1 (ko) |
CN (1) | CN101454108B (ko) |
AT (1) | ATE524266T1 (ko) |
PL (1) | PL2022590T3 (ko) |
WO (1) | WO2007116853A1 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101044582B1 (ko) * | 2006-04-26 | 2011-06-29 | 센주긴조쿠고교 가부시키가이샤 | 분류 땜납조 |
GB2483265B (en) * | 2010-09-01 | 2018-03-28 | Pillarhouse Int Ltd | Soldering nozzle |
JP5601342B2 (ja) | 2012-04-27 | 2014-10-08 | 千住金属工業株式会社 | 偏流板及び噴流装置 |
KR20150016970A (ko) * | 2012-06-05 | 2015-02-13 | 머핀 인코포레이티드 | 세포 치료요법에 유용한 카테터 시스템 및 방법 |
US10321946B2 (en) * | 2012-08-24 | 2019-06-18 | Boston Scientific Scimed, Inc. | Renal nerve modulation devices with weeping RF ablation balloons |
EP4230162A1 (en) | 2012-11-02 | 2023-08-23 | Neurotronic, Inc. | Chemical ablation formulations and methods of treatments for various diseases |
US20190366460A1 (en) * | 2018-06-01 | 2019-12-05 | Progress Y&Y Corp. | Soldering apparatus and solder nozzle module thereof |
CN109794683B (zh) * | 2019-01-25 | 2020-12-22 | 山东钧策科技服务有限公司 | 一种长焊缝高精度激光焊接工艺 |
CN109794681B (zh) * | 2019-01-25 | 2020-11-10 | 上海中巽科技股份有限公司 | 一种长焊缝高精度激光焊接设备 |
JP6590232B1 (ja) * | 2019-04-22 | 2019-10-16 | 千住金属工業株式会社 | はんだ付け装置及びはんだ付け方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4819425Y1 (ko) | 1969-12-16 | 1973-06-02 | ||
JPS4855025U (ko) | 1971-10-15 | 1973-07-14 | ||
JPS5122859B2 (ko) | 1971-11-11 | 1976-07-13 | ||
JPS4898520U (ko) | 1972-02-25 | 1973-11-21 | ||
JPS521771B2 (ko) | 1972-03-25 | 1977-01-18 | ||
DE2515437A1 (de) | 1974-04-16 | 1975-11-20 | Ici Ltd | Verfahren zur kristallisation von bis(4-chlorphenyl)sulfon |
JPS5334345Y2 (ko) | 1974-05-28 | 1978-08-23 | ||
JPS513632U (ko) | 1974-06-26 | 1976-01-12 | ||
JPS513632A (ja) | 1974-06-28 | 1976-01-13 | Kenkoo Kk | Ingayakitsukeho |
US4011980A (en) * | 1976-03-25 | 1977-03-15 | Western Electric Company, Inc. | Flow-over mass soldering |
JPS5623371A (en) * | 1979-07-31 | 1981-03-05 | Koki:Kk | Soldering device |
EP0212911B1 (en) * | 1985-08-09 | 1991-07-31 | Dolphin Machinery Limited | Soldering apparatus |
JPS62259665A (ja) | 1986-01-20 | 1987-11-12 | Asahi Chem Res Lab Ltd | 溶融半田の噴流方法及び装置 |
JP2505172B2 (ja) * | 1986-09-30 | 1996-06-05 | 日立マクセル株式会社 | Icカ−ド |
JPS6387293U (ko) * | 1986-11-28 | 1988-06-07 | ||
JPH01114165A (ja) * | 1987-10-27 | 1989-05-02 | Mitsubishi Electric Corp | 垂直偏向回路 |
JPH0641722Y2 (ja) * | 1988-01-29 | 1994-11-02 | 千住金属工業株式会社 | 噴流はんだ槽 |
JPH0619968A (ja) | 1991-09-13 | 1994-01-28 | Oki Electric Ind Co Ltd | 専門用語自動抽出装置 |
JPH0619968U (ja) * | 1992-08-20 | 1994-03-15 | 株式会社コウキテクノ | 噴流式半田槽 |
JPH06246433A (ja) | 1993-03-03 | 1994-09-06 | Murata Mfg Co Ltd | 噴流式半田付装置 |
JPH1126926A (ja) * | 1997-06-30 | 1999-01-29 | Ando Electric Co Ltd | 噴流式はんだ付け装置及び方法 |
JP2004009127A (ja) * | 2002-06-11 | 2004-01-15 | Senju Metal Ind Co Ltd | 噴流はんだ槽 |
JP4136887B2 (ja) | 2003-06-17 | 2008-08-20 | 千住システムテクノロジー株式会社 | 半田槽用ポンプ及びそれを使用する半田槽 |
PL1676662T3 (pl) * | 2003-10-10 | 2010-10-29 | Senju Metal Industry Co | Dyszowy zbiornik dla lutowia |
WO2005120141A1 (ja) * | 2004-06-03 | 2005-12-15 | Andes Electric Co., Ltd. | 半田噴流装置,半田噴流装置の製造方法及び電子部品の半田付け方法 |
-
2007
- 2007-04-02 PL PL07740811T patent/PL2022590T3/pl unknown
- 2007-04-02 KR KR1020087026892A patent/KR101076645B1/ko active IP Right Grant
- 2007-04-02 WO PCT/JP2007/057375 patent/WO2007116853A1/ja active Search and Examination
- 2007-04-02 AT AT07740811T patent/ATE524266T1/de not_active IP Right Cessation
- 2007-04-02 JP JP2008509832A patent/JP4893738B2/ja active Active
- 2007-04-02 US US12/225,925 patent/US7959055B2/en active Active
- 2007-04-02 CN CN2007800192391A patent/CN101454108B/zh active Active
- 2007-04-02 EP EP07740811A patent/EP2022590B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2007116853A1 (ja) | 2009-08-20 |
KR101076645B1 (ko) | 2011-10-27 |
PL2022590T3 (pl) | 2011-12-30 |
CN101454108A (zh) | 2009-06-10 |
EP2022590A4 (en) | 2009-06-10 |
US20100001047A1 (en) | 2010-01-07 |
EP2022590B1 (en) | 2011-09-14 |
WO2007116853A1 (ja) | 2007-10-18 |
US7959055B2 (en) | 2011-06-14 |
EP2022590A1 (en) | 2009-02-11 |
CN101454108B (zh) | 2012-09-05 |
JP4893738B2 (ja) | 2012-03-07 |
ATE524266T1 (de) | 2011-09-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101076645B1 (ko) | 분류 땜납조 | |
JP4720905B2 (ja) | 噴流はんだ槽 | |
JP4941289B2 (ja) | 噴流はんだ槽 | |
CN101454109A (zh) | 焊接设备 | |
US6431431B2 (en) | Apparatus and methods for wave soldering | |
KR101524993B1 (ko) | 편류판 및 분류 장치 | |
JP4962197B2 (ja) | 噴流はんだ槽 | |
JP2011146638A (ja) | フローはんだ付けノズル、はんだ付け装置およびはんだ付け方法 | |
JP2008260028A (ja) | 整流ノズル、はんだ付け装置、コーティング装置及び射出成型装置 | |
JP2009039748A (ja) | 噴流はんだ槽 | |
JP6852710B2 (ja) | 噴流式はんだ付け装置 | |
JP5458854B2 (ja) | 噴流はんだ槽 | |
CN110303215A (zh) | 钎焊装置 | |
JP4644079B2 (ja) | 噴流はんだ槽 | |
JP2007095919A (ja) | Alip型電子部品実装用噴流波形成装置 | |
JP2001119134A (ja) | はんだ付け装置 | |
JP2006114555A (ja) | 噴流はんだ槽 | |
JP2014003067A (ja) | 流動装置および電子部品の取り外し装置 | |
JP2010120063A (ja) | はんだ付け噴流波形成装置 | |
JP5614518B1 (ja) | 偏流板及び噴流装置 | |
JP2021030256A (ja) | はんだ付け装置 | |
JP2004228227A (ja) | はんだ付け装置 | |
JPH0742598U (ja) | はんだ付け装置の不活性ガス雰囲気形成装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20141001 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20150918 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20160921 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20170919 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20180918 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20190917 Year of fee payment: 9 |