JP2021030256A - はんだ付け装置 - Google Patents
はんだ付け装置 Download PDFInfo
- Publication number
- JP2021030256A JP2021030256A JP2019151376A JP2019151376A JP2021030256A JP 2021030256 A JP2021030256 A JP 2021030256A JP 2019151376 A JP2019151376 A JP 2019151376A JP 2019151376 A JP2019151376 A JP 2019151376A JP 2021030256 A JP2021030256 A JP 2021030256A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- solder
- space
- plate member
- tapered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 75
- 238000005192 partition Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 description 28
- 238000011010 flushing procedure Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
10 ノズル
20 内部空間
101 外周部
102 テーパ部
103 板部材
104 基部
120 噴出口
121 流入口
210 第1空間
220 第2空間
300 隙間
Claims (5)
- はんだが通る内部空間の一部が先端に向かって先細りとなるようなテーパ状の外周部を有するノズルと、
先細りとなる前記内部空間を、前記テーパ状の部位に対応する第1空間と、前記ノズルにおける噴出口の大きさに対応する第2空間とに区切る板部材と
を備えることを特徴とするはんだ付け装置。 - 前記板部材は、
前記噴出口側の端部が前記ノズルと当接していること
を特徴とする請求項1に記載のはんだ付け装置。 - 前記板部材と前記ノズルとの当接位置は、
前記テーパ状の部位の端部であること
を特徴とする請求項2に記載のはんだ付け装置。 - 前記板部材は、
前記ノズルの高さ方向と直交する幅方向の両端が前記ノズルから離れていること
を特徴とする請求項1〜3のいずれか1つに記載のはんだ付け装置。 - 前記板部材は、
前記ノズルの流入口のうち、前記第1空間に対応する開口を部分的に塞いでいること
を特徴とする請求項1〜4のいずれか1つに記載のはんだ付け装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019151376A JP7340388B2 (ja) | 2019-08-21 | 2019-08-21 | はんだ付け装置 |
CN202010834385.7A CN112404633B (zh) | 2019-08-21 | 2020-08-18 | 焊接装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019151376A JP7340388B2 (ja) | 2019-08-21 | 2019-08-21 | はんだ付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021030256A true JP2021030256A (ja) | 2021-03-01 |
JP7340388B2 JP7340388B2 (ja) | 2023-09-07 |
Family
ID=74674634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019151376A Active JP7340388B2 (ja) | 2019-08-21 | 2019-08-21 | はんだ付け装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7340388B2 (ja) |
CN (1) | CN112404633B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6024464U (ja) * | 1983-07-28 | 1985-02-19 | 関西日本電気株式会社 | 半田装置 |
JPH0263678A (ja) * | 1988-08-31 | 1990-03-02 | Matsushita Electric Ind Co Ltd | 噴流式自動半田付装置 |
JPH05185210A (ja) * | 1991-10-15 | 1993-07-27 | Matsushita Electric Ind Co Ltd | 半田付け方法と半田付け装置とプリント配線基板と電子機器 |
JPH06561U (ja) * | 1992-06-01 | 1994-01-11 | 奥原電気株式会社 | 噴流浴型ハンダ溶融装置の噴流装置 |
US20020110636A1 (en) * | 2001-01-10 | 2002-08-15 | Michael Tombs | Nozzle for soldering apparatus |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB191514014A (en) * | 1915-10-04 | 1919-03-20 | James Morris | Improvements in Nozzles for Discharging Liquids. |
DE19807696C2 (de) * | 1998-02-24 | 2001-09-06 | Manfred Fehrenbach | Verfahren zum Tauchlöten |
JP3602031B2 (ja) * | 1999-05-27 | 2004-12-15 | 松下電器産業株式会社 | はんだ噴流装置およびはんだ付け方法 |
JP4473534B2 (ja) * | 2003-07-02 | 2010-06-02 | 株式会社タムラ製作所 | 噴流式はんだ付け装置 |
JP4473566B2 (ja) * | 2003-12-22 | 2010-06-02 | 株式会社タムラ製作所 | 噴流式はんだ付け装置 |
JP2006080439A (ja) * | 2004-09-13 | 2006-03-23 | Koki Tec Corp | 半田噴流ノズル |
JP2010120031A (ja) * | 2008-11-18 | 2010-06-03 | Panasonic Corp | 部分はんだ付け用はんだ槽ノズル |
JP5506991B1 (ja) * | 2013-07-31 | 2014-05-28 | 富士通テン株式会社 | ノズル装置 |
JP5910784B1 (ja) * | 2015-09-11 | 2016-04-27 | 千住金属工業株式会社 | 噴流ノズル及び噴流はんだ付け装置 |
CN206169471U (zh) * | 2016-09-29 | 2017-05-17 | 成都真火科技有限公司 | 一种等离子切割机喷嘴 |
JP6849471B2 (ja) * | 2017-02-15 | 2021-03-24 | 株式会社デンソーテン | 圧送圧力調整装置および圧送圧力調整方法 |
CN208679490U (zh) * | 2018-05-30 | 2019-04-02 | 机械工业第四设计研究院有限公司 | 一种带导流板的干冰清洗喷嘴 |
-
2019
- 2019-08-21 JP JP2019151376A patent/JP7340388B2/ja active Active
-
2020
- 2020-08-18 CN CN202010834385.7A patent/CN112404633B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6024464U (ja) * | 1983-07-28 | 1985-02-19 | 関西日本電気株式会社 | 半田装置 |
JPH0263678A (ja) * | 1988-08-31 | 1990-03-02 | Matsushita Electric Ind Co Ltd | 噴流式自動半田付装置 |
JPH05185210A (ja) * | 1991-10-15 | 1993-07-27 | Matsushita Electric Ind Co Ltd | 半田付け方法と半田付け装置とプリント配線基板と電子機器 |
JPH06561U (ja) * | 1992-06-01 | 1994-01-11 | 奥原電気株式会社 | 噴流浴型ハンダ溶融装置の噴流装置 |
US20020110636A1 (en) * | 2001-01-10 | 2002-08-15 | Michael Tombs | Nozzle for soldering apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN112404633A (zh) | 2021-02-26 |
CN112404633B (zh) | 2023-02-28 |
JP7340388B2 (ja) | 2023-09-07 |
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