KR20090015067A - 저 수축 에폭시-양이온 경화성 조성물 - Google Patents

저 수축 에폭시-양이온 경화성 조성물 Download PDF

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Publication number
KR20090015067A
KR20090015067A KR1020087028242A KR20087028242A KR20090015067A KR 20090015067 A KR20090015067 A KR 20090015067A KR 1020087028242 A KR1020087028242 A KR 1020087028242A KR 20087028242 A KR20087028242 A KR 20087028242A KR 20090015067 A KR20090015067 A KR 20090015067A
Authority
KR
South Korea
Prior art keywords
group
aromatic
carbon atoms
substituted
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020087028242A
Other languages
English (en)
Korean (ko)
Inventor
아츠시 스도
다케시 엔도
아카네 스즈키
Original Assignee
헨켈 아게 운트 코. 카게아아
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 헨켈 아게 운트 코. 카게아아 filed Critical 헨켈 아게 운트 코. 카게아아
Publication of KR20090015067A publication Critical patent/KR20090015067A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processing Of Solid Wastes (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
KR1020087028242A 2006-05-22 2007-05-18 저 수축 에폭시-양이온 경화성 조성물 Abandoned KR20090015067A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06010525 2006-05-22
EP06010525.1 2006-05-22

Publications (1)

Publication Number Publication Date
KR20090015067A true KR20090015067A (ko) 2009-02-11

Family

ID=38190610

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087028242A Abandoned KR20090015067A (ko) 2006-05-22 2007-05-18 저 수축 에폭시-양이온 경화성 조성물

Country Status (8)

Country Link
US (1) US7740734B2 (https=)
EP (1) EP2021394B1 (https=)
JP (1) JP5190055B2 (https=)
KR (1) KR20090015067A (https=)
CN (1) CN101448868B (https=)
AT (1) ATE482986T1 (https=)
DE (1) DE602007009519D1 (https=)
WO (1) WO2007135094A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6147103B2 (ja) * 2013-06-07 2017-06-14 日東電工株式会社 アンダーフィル材、積層シート及び半導体装置の製造方法
CN108164706A (zh) * 2016-04-29 2018-06-15 宁波高新区夏远科技有限公司 一种发光装置的环氧硅氧烷树脂密封料及其制备方法
DE102019129517A1 (de) 2019-10-31 2021-05-06 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch feuchteinduziert härtbare Masse, Verwendung der Masse sowie Verfahren zum Fügen, Vergießen und Beschichten von Substraten
JP7807211B2 (ja) * 2021-10-27 2026-01-27 旭化成株式会社 エポキシ系樹脂の収縮抑制剤及びその使用
EP4286488A1 (en) 2022-05-31 2023-12-06 Henkel AG & Co. KGaA Snap-cure flexible electrically conductive one-component (1k) epoxy adhesive composition

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149924A (ja) 1982-09-28 1984-08-28 Toshiba Corp 低収縮性熱硬化性樹脂組成物
JPS59199712A (ja) 1983-04-27 1984-11-12 Mitsui Toatsu Chem Inc 硬化性樹脂組成物
US4701513A (en) * 1986-12-15 1987-10-20 W. R. Grace & Co. Novel epoxy hardeners
WO1990003373A1 (fr) * 1988-09-20 1990-04-05 Hisamitsu Pharmaceutical Co., Inc. NOUVEAUX DERIVES DE DIBENZ[b,e]OXEPINE
DE4439485C2 (de) * 1994-10-26 1998-04-09 Ivoclar Ag Bicycloaliphatische 2-Methylen-1,3-dioxepane und deren Verwendung
JPH09194565A (ja) * 1996-01-24 1997-07-29 Sumitomo Bakelite Co Ltd 環状カーボナート樹脂組成物及びその硬化物
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Ｊｓｒ株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
JP4662094B2 (ja) * 2000-10-25 2011-03-30 日立化成工業株式会社 スピロケタール化合物、アルキンジオール化合物及びこのアルキンジオール化合物を用いたスピロケタール化合物の製造法
JP2002322268A (ja) * 2001-04-27 2002-11-08 Toagosei Co Ltd 多官能オキセタン化合物と環状カルボン酸無水物からなるオキセタン樹脂の製造方法
KR100502993B1 (ko) * 2002-03-08 2005-07-25 주식회사 루밴틱스 광통신부품용 광학접착제
JP4820629B2 (ja) * 2004-11-25 2011-11-24 株式会社トクヤマ 硬化性組成物
WO2006087111A1 (en) * 2005-02-18 2006-08-24 Henkel Kommanditgesellschaft Auf Aktien Low shrinkage amine-curing epoxy resin compositions comprising a lactone

Also Published As

Publication number Publication date
US20090087571A1 (en) 2009-04-02
JP5190055B2 (ja) 2013-04-24
CN101448868B (zh) 2011-08-31
JP2009537684A (ja) 2009-10-29
DE602007009519D1 (de) 2010-11-11
CN101448868A (zh) 2009-06-03
EP2021394A1 (en) 2009-02-11
ATE482986T1 (de) 2010-10-15
EP2021394B1 (en) 2010-09-29
US7740734B2 (en) 2010-06-22
WO2007135094A1 (en) 2007-11-29

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Patent event date: 20081119

Patent event code: PA01051R01D

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Patent event code: PA02012R01D

Patent event date: 20120514

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Patent event date: 20130925

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

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Patent event date: 20131213

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PC1904 Unpaid initial registration fee