DE602007009519D1 - Kationisch härtbare epoxidharzzusammensetzungen mit geringem schrumpf - Google Patents

Kationisch härtbare epoxidharzzusammensetzungen mit geringem schrumpf

Info

Publication number
DE602007009519D1
DE602007009519D1 DE602007009519T DE602007009519T DE602007009519D1 DE 602007009519 D1 DE602007009519 D1 DE 602007009519D1 DE 602007009519 T DE602007009519 T DE 602007009519T DE 602007009519 T DE602007009519 T DE 602007009519T DE 602007009519 D1 DE602007009519 D1 DE 602007009519D1
Authority
DE
Germany
Prior art keywords
epoxy resin
resin compositions
hardenable epoxy
low scrap
cationically hardenable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007009519T
Other languages
German (de)
English (en)
Inventor
Atsushi Sudo
Takeshi Endo
Akane Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of DE602007009519D1 publication Critical patent/DE602007009519D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processing Of Solid Wastes (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
DE602007009519T 2006-05-22 2007-05-18 Kationisch härtbare epoxidharzzusammensetzungen mit geringem schrumpf Active DE602007009519D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06010525 2006-05-22
PCT/EP2007/054827 WO2007135094A1 (en) 2006-05-22 2007-05-18 Low shrinkage epoxy-cationic curable compositions

Publications (1)

Publication Number Publication Date
DE602007009519D1 true DE602007009519D1 (de) 2010-11-11

Family

ID=38190610

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007009519T Active DE602007009519D1 (de) 2006-05-22 2007-05-18 Kationisch härtbare epoxidharzzusammensetzungen mit geringem schrumpf

Country Status (8)

Country Link
US (1) US7740734B2 (https=)
EP (1) EP2021394B1 (https=)
JP (1) JP5190055B2 (https=)
KR (1) KR20090015067A (https=)
CN (1) CN101448868B (https=)
AT (1) ATE482986T1 (https=)
DE (1) DE602007009519D1 (https=)
WO (1) WO2007135094A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6147103B2 (ja) * 2013-06-07 2017-06-14 日東電工株式会社 アンダーフィル材、積層シート及び半導体装置の製造方法
CN108164706A (zh) * 2016-04-29 2018-06-15 宁波高新区夏远科技有限公司 一种发光装置的环氧硅氧烷树脂密封料及其制备方法
DE102019129517A1 (de) 2019-10-31 2021-05-06 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch feuchteinduziert härtbare Masse, Verwendung der Masse sowie Verfahren zum Fügen, Vergießen und Beschichten von Substraten
JP7807211B2 (ja) * 2021-10-27 2026-01-27 旭化成株式会社 エポキシ系樹脂の収縮抑制剤及びその使用
EP4286488A1 (en) 2022-05-31 2023-12-06 Henkel AG & Co. KGaA Snap-cure flexible electrically conductive one-component (1k) epoxy adhesive composition

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149924A (ja) 1982-09-28 1984-08-28 Toshiba Corp 低収縮性熱硬化性樹脂組成物
JPS59199712A (ja) 1983-04-27 1984-11-12 Mitsui Toatsu Chem Inc 硬化性樹脂組成物
US4701513A (en) * 1986-12-15 1987-10-20 W. R. Grace & Co. Novel epoxy hardeners
WO1990003373A1 (fr) * 1988-09-20 1990-04-05 Hisamitsu Pharmaceutical Co., Inc. NOUVEAUX DERIVES DE DIBENZ[b,e]OXEPINE
DE4439485C2 (de) * 1994-10-26 1998-04-09 Ivoclar Ag Bicycloaliphatische 2-Methylen-1,3-dioxepane und deren Verwendung
JPH09194565A (ja) * 1996-01-24 1997-07-29 Sumitomo Bakelite Co Ltd 環状カーボナート樹脂組成物及びその硬化物
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Ｊｓｒ株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
JP4662094B2 (ja) * 2000-10-25 2011-03-30 日立化成工業株式会社 スピロケタール化合物、アルキンジオール化合物及びこのアルキンジオール化合物を用いたスピロケタール化合物の製造法
JP2002322268A (ja) * 2001-04-27 2002-11-08 Toagosei Co Ltd 多官能オキセタン化合物と環状カルボン酸無水物からなるオキセタン樹脂の製造方法
KR100502993B1 (ko) * 2002-03-08 2005-07-25 주식회사 루밴틱스 광통신부품용 광학접착제
JP4820629B2 (ja) * 2004-11-25 2011-11-24 株式会社トクヤマ 硬化性組成物
WO2006087111A1 (en) * 2005-02-18 2006-08-24 Henkel Kommanditgesellschaft Auf Aktien Low shrinkage amine-curing epoxy resin compositions comprising a lactone

Also Published As

Publication number Publication date
US20090087571A1 (en) 2009-04-02
JP5190055B2 (ja) 2013-04-24
CN101448868B (zh) 2011-08-31
JP2009537684A (ja) 2009-10-29
CN101448868A (zh) 2009-06-03
EP2021394A1 (en) 2009-02-11
KR20090015067A (ko) 2009-02-11
ATE482986T1 (de) 2010-10-15
EP2021394B1 (en) 2010-09-29
US7740734B2 (en) 2010-06-22
WO2007135094A1 (en) 2007-11-29

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