KR20080093221A - 광원 장치 및 이를 이용한 디스플레이 장치 - Google Patents
광원 장치 및 이를 이용한 디스플레이 장치 Download PDFInfo
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- KR20080093221A KR20080093221A KR1020070036855A KR20070036855A KR20080093221A KR 20080093221 A KR20080093221 A KR 20080093221A KR 1020070036855 A KR1020070036855 A KR 1020070036855A KR 20070036855 A KR20070036855 A KR 20070036855A KR 20080093221 A KR20080093221 A KR 20080093221A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Liquid Crystal (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (22)
- 하나 이상의 발광소자;상기 발광소자가 탑재된 하나 이상의 발광소자기판;상기 발광소자기판에 접속되는 제 1 및 제 2커넥터를 포함하는 광원 장치.
- 제 1항에 있어서,상기 제 1 또는 제 2커넥터는 발광소자기판의 양단부에 접속되며, 다른 기판과 커넥터 방식으로 접속되는 광원 장치.
- 제 1항에 있어서,하나 이상의 발광소자기판 중에서 첫 번째 발광소자기판의 제 1커넥터에 접속되는 제 2커넥터를 갖는 제 1서브기판을 포함하는 광원 장치.
- 제 3항에 있어서,상기 제 1서브기판에는 제 2커넥터와 LED 드라이버를 연결해 주는 외부 연결 커넥터를 포함하는 광원 장치.
- 제 1항에 있어서,하나 이상의 발광소자기판 중에서 마지막 발광소자기판의 제 2커넥터에 접속 되는 제 1커넥터를 갖는 제 2서브기판을 포함하는 광원 장치.
- 제 5항에 있어서,상기 제 2서브기판에는 상기 제 1커넥터에 연결되고, 마지막 발광소자기판의 종단 회로를 폐 루프로 만들어주는 폐 루프 패턴을 포함하는 광원 장치.
- 제 1항, 제 3항 및 제 5항 중 어느 한 항에 있어서,상기 기판에는 커넥터의 핀이 관통되는 핀 구멍 및 상기 핀 구멍에 형성된 리드 패턴을 포함하는 광원 장치.
- 제 1항, 제 3항 및 제 5항 중 어느 한 항에 있어서,상기 제 1 커넥터는 암 커넥터로 구성되며,상기 제 2커넥터는 수 커넥터로 구성되는 광원 장치.
- 제 1항, 제 3항 및 제 5항 중 어느 한 항에 있어서,상기 제 1커넥터에는 후크 돌기가 형성되며,상기 제 2커넥터에는 상기 후크 돌기에 대응되는 후크 홈이 형성되는 광원 장치.
- 제 1항, 제 4항 및 제 5항 중 어느 한 항에 있어서,상기 제 1 또는 제 2커넥터는 기판의 아래에 접속되는 광원 장치.
- 제 1항에 있어서,상기 발광소자는 하나 이상의 LED 칩을 포함하는 것을 특징으로 하는 광원 장치.
- 제 1항 또는 제 11항에 있어서,상기 발광소자는 Red LED 칩, Green LED 칩 및 blue LED 칩을 포함하는 것을 특징으로 하는 광원 장치.
- 제 1항에 있어서,상기 발광소자는 발광소자기판 위에 1열 이상으로 배열된 것을 특징으로 하는 광원 장치.
- 제 1항에 있어서,복수의 발광소자기판이 서로 연결되는 하나 이상의 LED 바;상기 LED 바의 일단부에 LED 드라이버와의 연결을 위한 제 1서브기판;상기 LED 바의 타단부에 종단 회로의 폐 루프를 형성해 주는 제 2서브기판을 포함하는 광원 장치.
- 하나 이상의 발광소자, 상기 발광소자가 탑재된 하나 이상의 발광소자기판, 상기 발광소자기판에 접속되는 제 1 및 제 2커넥터를 포함하는 광원 장치;상기 광원 장치가 수납되는 바텀 커버;상기 바텀 커버 위에 배치된 한 장 이상의 광학 시트;상기 광학 시트 위에 배치된 표시 패널을 포함하는 디스플레이 장치.
- 제 15항에 있어서,상기 바텀 커버에는 복수의 발광소자기판이 연결된 LED 바가 병렬로 배열되는 것을 특징으로 하는 디스플레이 장치.
- 제 16항에 있어서,상기 LED 바에는 발광소자기판의 제 1 또는 제 2커넥터에 접속하는 커넥터를 구비한 서브기판을 포함하는 디스플레이 장치.
- 제 17항에 있어서,상기 서브기판은 LED 바의 일단부에 커넥터 방식으로 접속되며 LED 드라이버에 연결되는 제 1서브기판과, 상기 LED 바의 타단부에 커넥터 방식으로 접속되며 LED 바의 종단 회로를 폐 루프로 형성해 주는 제 2서브기판을 포함하는 디스플레이 장치.
- 제 18항에 있어서,상기 제 1 및 제 2서브기판은 LED 바의 양단부에 하나 또는 LED 바의 개수와 동일한 개수로 접속되는 디스플레이 장치.
- 제 17항에 있어서,상기 커넥터는 각 기판의 아래에 접속되는 디스플레이 장치.
- 제 15항에 있어서,상기 바텀 커버에 발광소자기판을 체결하는 체결수단을 포함하는 디스플레이 장치.
- 제 20항에 있어서,상기 바텀 커버에는 각 기판의 커넥터가 위치하는 커넥터 구멍이 형성되는 디스플레이 장치.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070036855A KR100872696B1 (ko) | 2007-04-16 | 2007-04-16 | 광원 장치 및 이를 이용한 디스플레이 장치 |
EP08741366.2A EP2137772B8 (en) | 2007-04-16 | 2008-04-15 | Light source device and display device having the same |
CN2008800005489A CN101542761B (zh) | 2007-04-16 | 2008-04-15 | 光源装置和具有光源装置的显示器装置 |
US12/375,485 US8388162B2 (en) | 2007-04-16 | 2008-04-15 | Light source device and display device having the same |
JP2010503968A JP5318853B2 (ja) | 2007-04-16 | 2008-04-15 | 光源装置及びそれを備えた表示装置 |
PCT/KR2008/002121 WO2008127064A1 (en) | 2007-04-16 | 2008-04-15 | Light source device and display device having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070036855A KR100872696B1 (ko) | 2007-04-16 | 2007-04-16 | 광원 장치 및 이를 이용한 디스플레이 장치 |
Publications (2)
Publication Number | Publication Date |
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KR20080093221A true KR20080093221A (ko) | 2008-10-21 |
KR100872696B1 KR100872696B1 (ko) | 2008-12-10 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020070036855A KR100872696B1 (ko) | 2007-04-16 | 2007-04-16 | 광원 장치 및 이를 이용한 디스플레이 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8388162B2 (ko) |
EP (1) | EP2137772B8 (ko) |
JP (1) | JP5318853B2 (ko) |
KR (1) | KR100872696B1 (ko) |
CN (1) | CN101542761B (ko) |
WO (1) | WO2008127064A1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101039957B1 (ko) * | 2008-11-18 | 2011-06-09 | 엘지이노텍 주식회사 | 발광 장치 및 이를 구비한 디스플레이 장치 |
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KR101276576B1 (ko) * | 2012-02-16 | 2013-06-18 | 오름반도체 주식회사 | 발광 다이오드 모듈 |
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Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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IT1400651B1 (it) * | 2010-06-30 | 2013-06-28 | Ova G Bargellini S P A | Unità di alloggiamento operativo per diodi emettitori di luce, noti con il nome di diodi led |
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JP6332933B2 (ja) * | 2013-10-01 | 2018-05-30 | 三菱電機株式会社 | 発光ユニットの製造方法 |
US10288688B2 (en) | 2014-07-24 | 2019-05-14 | Schweitzer Engineering Laboratories, Inc. | Systems and methods for monitoring and protecting an electric power generator |
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US10274180B2 (en) * | 2014-11-24 | 2019-04-30 | Jin Choi Shine | Modular lighting system |
WO2016168318A1 (en) | 2015-04-13 | 2016-10-20 | Hubbell Incorporated | Light board |
JP6688956B2 (ja) | 2015-09-01 | 2020-04-28 | パナソニックIpマネジメント株式会社 | 映像表示装置 |
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EP3346319B1 (en) * | 2015-09-01 | 2021-04-28 | Panasonic Intellectual Property Management Co., Ltd. | Video display device |
EP3346324B1 (en) | 2015-09-01 | 2020-06-03 | Panasonic Intellectual Property Management Co., Ltd. | Video display device |
US10663793B2 (en) | 2015-09-01 | 2020-05-26 | Panasonic Intellectual Property Management Co., Ltd. | Image display device |
EP3346323B1 (en) | 2015-09-01 | 2020-03-04 | Panasonic Intellectual Property Management Co., Ltd. | Image display device |
US10993347B2 (en) * | 2018-11-20 | 2021-04-27 | Innolux Corporation | Electronic device and tiled electronic system comprising the same |
US11442312B2 (en) * | 2020-05-22 | 2022-09-13 | Apple Inc. | Electronic device display with a backlight having light-emitting diodes and driver integrated circuits in an active area |
WO2023191268A1 (ko) * | 2022-03-29 | 2023-10-05 | 삼성전자주식회사 | 디스플레이 장치 및 그 광원 장치 |
EP4394492A1 (en) | 2022-03-29 | 2024-07-03 | Samsung Electronics Co., Ltd. | Display device and light source device thereof |
CN115793323B (zh) * | 2022-12-07 | 2024-03-19 | 惠科股份有限公司 | 背光模组和显示装置 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US92346A (en) * | 1869-07-06 | Benjamin nott | ||
US265051A (en) * | 1882-09-26 | Tobacco-drier | ||
US289201A (en) * | 1883-11-27 | Gas-burning puddling-furnace | ||
US5559681A (en) * | 1994-05-13 | 1996-09-24 | Cnc Automation, Inc. | Flexible, self-adhesive, modular lighting system |
DE10012734C1 (de) * | 2000-03-16 | 2001-09-27 | Bjb Gmbh & Co Kg | Illuminationsbausatz für Beleuchtungs-, Anzeige- oder Hinweiszwecke sowie Steckverbinder für einen solchen Illuminationsbausatz |
US20030112627A1 (en) * | 2000-09-28 | 2003-06-19 | Deese Raymond E. | Flexible sign illumination apparatus, system and method |
DE10051528B4 (de) * | 2000-10-17 | 2009-12-24 | Vossloh-Schwabe Deutschland Gmbh | Modulares Beleuchtungssystem |
JP2004253364A (ja) * | 2003-01-27 | 2004-09-09 | Matsushita Electric Ind Co Ltd | 照明装置 |
KR100584389B1 (ko) * | 2003-07-18 | 2006-05-26 | 삼성전자주식회사 | 복합 자동 재전송 방식을 지원하는 이동통신 시스템에서부호화 심볼 송수신 장치 및 방법 |
KR100597079B1 (ko) * | 2004-04-12 | 2006-07-07 | 빛샘전자주식회사 | 다수의 발광 다이오드 도트 라인 유닛을 구비하는디스플레이 모듈 및 이를 포함하는 디스플레이 장치 |
JP2005339881A (ja) * | 2004-05-25 | 2005-12-08 | Hitachi Displays Ltd | 照明装置、照明モジュール及び液晶表示装置 |
JP4268106B2 (ja) * | 2004-09-09 | 2009-05-27 | 豊田合成株式会社 | 発光装置 |
US7165863B1 (en) * | 2004-09-23 | 2007-01-23 | Pricilla G. Thomas | Illumination system |
KR101157233B1 (ko) | 2004-10-30 | 2012-06-15 | 엘지디스플레이 주식회사 | 발광 다이오드 백라이트 장치 및 이를 채용한 액정표시장치 |
JP2006228529A (ja) | 2005-02-16 | 2006-08-31 | Matsushita Electric Works Ltd | 照明器具 |
EP1891671B1 (en) * | 2005-05-20 | 2020-08-19 | Signify Holding B.V. | Light-emitting module |
JP4548219B2 (ja) * | 2005-05-25 | 2010-09-22 | パナソニック電工株式会社 | 電子部品用ソケット |
KR20060134375A (ko) * | 2005-06-22 | 2006-12-28 | 삼성전자주식회사 | 백라이트 어셈블리 및 이를 구비한 표시 장치 |
KR20060135203A (ko) * | 2005-06-24 | 2006-12-29 | 럭스피아 주식회사 | 발광 다이오드 모듈 및 발광 다이오드 모듈을 이용한 조명장치 |
US7926300B2 (en) * | 2005-11-18 | 2011-04-19 | Cree, Inc. | Adaptive adjustment of light output of solid state lighting panels |
US7959325B2 (en) * | 2005-11-18 | 2011-06-14 | Cree, Inc. | Solid state lighting units and methods of forming solid state lighting units |
WO2008157723A1 (en) * | 2007-06-21 | 2008-12-24 | Nila Inc. | Modular lighting arrays |
KR100875703B1 (ko) * | 2007-06-29 | 2008-12-23 | 알티전자 주식회사 | 직하형 백라이트 유닛 |
CN101430066A (zh) * | 2007-11-06 | 2009-05-13 | 富士迈半导体精密工业(上海)有限公司 | 半导体固态光源模块及半导体固态光源模组 |
-
2007
- 2007-04-16 KR KR1020070036855A patent/KR100872696B1/ko active IP Right Grant
-
2008
- 2008-04-15 US US12/375,485 patent/US8388162B2/en active Active
- 2008-04-15 CN CN2008800005489A patent/CN101542761B/zh active Active
- 2008-04-15 JP JP2010503968A patent/JP5318853B2/ja active Active
- 2008-04-15 WO PCT/KR2008/002121 patent/WO2008127064A1/en active Application Filing
- 2008-04-15 EP EP08741366.2A patent/EP2137772B8/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101039957B1 (ko) * | 2008-11-18 | 2011-06-09 | 엘지이노텍 주식회사 | 발광 장치 및 이를 구비한 디스플레이 장치 |
US8446544B2 (en) | 2008-11-18 | 2013-05-21 | Lg Innotek Co., Ltd. | Light emitting module and display device having the same |
US8670087B2 (en) | 2008-11-18 | 2014-03-11 | Lg Innotek Co., Ltd. | Light emitting module and display device having the same |
TWI394916B (zh) * | 2009-09-28 | 2013-05-01 | Hannstar Display Corp | 發光單元、背光模組及顯示器裝置 |
KR101276576B1 (ko) * | 2012-02-16 | 2013-06-18 | 오름반도체 주식회사 | 발광 다이오드 모듈 |
KR101292217B1 (ko) * | 2012-02-16 | 2013-08-02 | 주식회사엘이디파워 | Led 조명등 |
Also Published As
Publication number | Publication date |
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CN101542761B (zh) | 2011-11-30 |
EP2137772A4 (en) | 2013-09-25 |
EP2137772A1 (en) | 2009-12-30 |
WO2008127064A1 (en) | 2008-10-23 |
CN101542761A (zh) | 2009-09-23 |
US20090310335A1 (en) | 2009-12-17 |
KR100872696B1 (ko) | 2008-12-10 |
EP2137772B8 (en) | 2021-09-08 |
US8388162B2 (en) | 2013-03-05 |
JP5318853B2 (ja) | 2013-10-16 |
JP2010525523A (ja) | 2010-07-22 |
EP2137772B1 (en) | 2021-07-28 |
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