JP2010525523A - 光源装置及びそれを備えた表示装置 - Google Patents
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Liquid Crystal (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】本発明に係る光源装置は、発光デバイスを含む発光モジュールと、上記発光モジュールの他端部に配置された回路終端モジュールと、上記発光モジュールの一端部及び他端部に連結された第1及び第2コネクタと、上記回路終端モジュールに連結され、上記発光モジュールの第2コネクタに接続される第4コネクタと、を含む。
【選択図】図1
Description
Claims (20)
- 発光デバイスを含む発光モジュールと、
前記発光モジュールの他端部に配置された回路終端モジュールと、
前記発光モジュールの一端部及び他端部に連結された第1及び第2コネクタと、
前記回路終端モジュールに連結され、前記発光モジュールの第2コネクタに接続される第4コネクタと、
を含むことを特徴とする光源装置。 - 前記発光モジュールの一端部に配置された外部接続モジュールと、
前記外部接続モジュールの他端部に連結され、前記発光モジュールの第1コネクタに接続される第3コネクタと、
を含むことを特徴とする請求項1に記載の光源装置。 - 前記第1及び第4コネクタは雌コネクタであり、
前記第2及び第3コネクタは雄コネクタを含むことを特徴とする請求項2に記載の光源装置。 - 前記発光モジュール、回路終端モジュール、及び外部接続モジュールの端部には、各コネクタの固定ピンが電気的に連結される複数個のピン孔を含むことを特徴とする請求項2に記載の光源装置。
- 前記第1乃至第4コネクタは、前記発光モジュール、回路終端モジュール、及び外部接続モジュールの背面端部に固定されることを特徴とする請求項2に記載の光源装置。
- 前記回路終端モジュールは前記第4コネクタに連結され、前記発光モジュールの終端回路を閉ループまたは帰還ループに連結してくれるリードパターンを含むことを特徴とする請求項1に記載の光源装置。
- 前記発光モジュール及び外部接続モジュールには、前記各コネクタに連結されたリードパターンを含むことを特徴とする請求項2に記載の光源装置。
- 前記発光デバイスは、レッドLEDチップ、グリーンLEDチップ、ブルーLEDチップ、イエローLEDチップ、及びUVLEDチップのち、少なくとも1つを含むことを特徴とする請求項1に記載の光源装置。
- 前記発光モジュールは、複数個が横方向及び/または縦方向に配置され、
前記複数個の発光モジュールの間は前記第1及び第2コネクタにより互いに接続されることを特徴とする請求項2に記載の光源装置。 - 前記複数個の発光モジュールは、少なくとも2列以上に配置され、
前記外部接続モジュールは単一個で、前記列で発光モジュールの一端部に接続されることを特徴とする請求項9に記載の光源装置。 - 前記回路終端モジュールは少なくとも1つを含み、少なくとも1列の発光モジュールの他端部に接続されることを特徴とする請求項9に記載の光源装置。
- 発光デバイスを含む発光モジュールが複数列で配置された発光モジュールアレイと、
前記発光モジュールアレイの他端部に配置された回路終端モジュールと、
前記発光モジュールの両端部に連結され、前記各列の発光モジュールの間を接続させる第1及び第2コネクタと、
前記回路終端モジュールに連結され、前記各列の終端側の前記発光モジュールの第2コネクタに接続される複数個の第4コネクタと、
を含むことを特徴とする光源装置。 - 前記発光モジュールアレイの一端部に配置された外部接続モジュールと、
前記外部接続モジュールの他端部に連結され、前記各列の始端側の前記発光モジュールの第1コネクタに各々接続される複数個の第3コネクタと、
を含むことを特徴とする請求項12に記載の光源装置。 - 前記第1乃至第4コネクタは各モジュールの背面に配置され、互いに対応する雌コネクタまたは雄コネクタからなることを特徴とする請求項13に記載の光源装置。
- 前記外部接続モジュールの一端部には、前記第3コネクタと連結され、デバイスドライバーに連結される第5コネクタを含むことを特徴とする請求項13に記載の光源装置。
- 前記回路終端モジュールは、複数個の第4コネクタの端子間を互いに連結させる共通リードパターンを含むことを特徴とする請求項12に記載の光源装置。
- 発光デバイスを含む複数個の発光モジュールと、
前記複数個の発光モジュールの下に配置されたボトムカバーと、
前記複数個の発光モジュールの一端部に配置された外部接続モジュールと、
前記複数個の発光モジュールの他端部に配置された回路終端モジュールと、
前記発光モジュールの一端部及び他端部に電気的に連結され、前記発光モジュールの間を互いに接続させる第1及び第2コネクタと、
前記回路終端モジュールに連結され、終端側の前記発光モジュールに配置された第2コネクタに接続される第4コネクタと、
を含むことを特徴とする表示装置。 - 前記複数個の発光モジュールの一端部に配置された外部接続モジュールと、
前記外部接続モジュールの他端部に連結され、始端側の前記発光モジュールに配置された第1コネクタに接続される第3コネクタと、
を含むことを特徴とする請求項17に記載の表示装置。 - 前記発光モジュールの上に配置された光学シートと、
前記光学シートの上に配置された表示パネルと、
を含むことを特徴とする請求項17に記載の表示装置。 - 前記第1乃至第4コネクタは、各モジュールの背面に配置され、
前記ボトムカバーには前記各モジュールの背面に配置されたコネクタを各々受納するコネクタ孔を含むことを特徴とする請求項18に記載の表示装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR10-2007-0036855 | 2007-04-16 | ||
KR1020070036855A KR100872696B1 (ko) | 2007-04-16 | 2007-04-16 | 광원 장치 및 이를 이용한 디스플레이 장치 |
PCT/KR2008/002121 WO2008127064A1 (en) | 2007-04-16 | 2008-04-15 | Light source device and display device having the same |
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JP2010525523A true JP2010525523A (ja) | 2010-07-22 |
JP5318853B2 JP5318853B2 (ja) | 2013-10-16 |
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JP2010503968A Active JP5318853B2 (ja) | 2007-04-16 | 2008-04-15 | 光源装置及びそれを備えた表示装置 |
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US (1) | US8388162B2 (ja) |
EP (1) | EP2137772B8 (ja) |
JP (1) | JP5318853B2 (ja) |
KR (1) | KR100872696B1 (ja) |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010128049A (ja) * | 2008-11-26 | 2010-06-10 | Hitachi Displays Ltd | 液晶表示装置 |
WO2012173065A1 (ja) * | 2011-06-17 | 2012-12-20 | シャープ株式会社 | 液晶表示装置 |
JP2013030294A (ja) * | 2011-07-27 | 2013-02-07 | Lumiotec Kk | 有機el照明装置 |
JP2015072749A (ja) * | 2013-10-01 | 2015-04-16 | 三菱電機株式会社 | 発光ユニット、照明ランプ及び照明装置並びに発光ユニットの製造方法 |
JP2019050379A (ja) * | 2012-08-31 | 2019-03-28 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101039957B1 (ko) | 2008-11-18 | 2011-06-09 | 엘지이노텍 주식회사 | 발광 장치 및 이를 구비한 디스플레이 장치 |
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JP5318853B2 (ja) | 2013-10-16 |
EP2137772A1 (en) | 2009-12-30 |
KR20080093221A (ko) | 2008-10-21 |
WO2008127064A1 (en) | 2008-10-23 |
CN101542761A (zh) | 2009-09-23 |
EP2137772B8 (en) | 2021-09-08 |
KR100872696B1 (ko) | 2008-12-10 |
US8388162B2 (en) | 2013-03-05 |
CN101542761B (zh) | 2011-11-30 |
US20090310335A1 (en) | 2009-12-17 |
EP2137772A4 (en) | 2013-09-25 |
EP2137772B1 (en) | 2021-07-28 |
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