KR20080076965A - 정전기 발생이 적고 폴리에테르이미드 중합체로 만들어진고온 내열성 접착 테이프 - Google Patents
정전기 발생이 적고 폴리에테르이미드 중합체로 만들어진고온 내열성 접착 테이프 Download PDFInfo
- Publication number
- KR20080076965A KR20080076965A KR1020087014917A KR20087014917A KR20080076965A KR 20080076965 A KR20080076965 A KR 20080076965A KR 1020087014917 A KR1020087014917 A KR 1020087014917A KR 20087014917 A KR20087014917 A KR 20087014917A KR 20080076965 A KR20080076965 A KR 20080076965A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive
- tape
- film
- polymer film
- polyetherimide polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004697 Polyetherimide Substances 0.000 title claims abstract description 47
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74307605P | 2005-12-23 | 2005-12-23 | |
| US60/743,076 | 2005-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080076965A true KR20080076965A (ko) | 2008-08-20 |
Family
ID=38218317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087014917A Ceased KR20080076965A (ko) | 2005-12-23 | 2006-12-19 | 정전기 발생이 적고 폴리에테르이미드 중합체로 만들어진고온 내열성 접착 테이프 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20080268206A1 (enExample) |
| EP (1) | EP1969081A4 (enExample) |
| JP (1) | JP2009521561A (enExample) |
| KR (1) | KR20080076965A (enExample) |
| CN (1) | CN101341226B (enExample) |
| MX (1) | MXPA06010596A (enExample) |
| WO (1) | WO2007075716A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5517162B2 (ja) | 2010-09-22 | 2014-06-11 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 文書情報の機密ラベルを判定する方法、コンピュータ・プログラム、装置、及びシステム |
| US8673462B2 (en) | 2011-09-02 | 2014-03-18 | International Business Machines Corporation | Low viscosity electrostatic discharge (ESD) dissipating adhesive substantially free of agglomerates |
| EP2639278A1 (en) * | 2012-03-13 | 2013-09-18 | Nitto Denko Corporation | Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape |
| JP6106232B2 (ja) * | 2015-09-07 | 2017-03-29 | 日東電工株式会社 | グラファイトシート用粘着シート |
| US10501252B1 (en) * | 2017-07-27 | 2019-12-10 | Amazon Technologies, Inc. | Packaging material having patterns of microsphere adhesive members that allow for bending around objects |
| WO2019078290A1 (ja) * | 2017-10-19 | 2019-04-25 | デンカ株式会社 | 単層フィルム及びそれを用いた耐熱粘着テープ |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3475196A (en) * | 1965-12-27 | 1969-10-28 | Borden Inc | Pressure-sensitive tape coated with a release agent |
| US3728150A (en) * | 1971-07-12 | 1973-04-17 | Du Pont | Bondable adhesive coated polyimide film |
| JPH0620087B2 (ja) * | 1989-07-10 | 1994-03-16 | 株式会社巴川製紙所 | リードフレーム用接着テープ |
| IE67319B1 (en) * | 1989-10-11 | 1996-03-20 | Waterford Res & Dev Ltd | Antistatic adhesive tape |
| US5273798A (en) * | 1991-08-01 | 1993-12-28 | Watson Label Products, Corp. | Heat and solvent resistant pressure-sensitive label |
| JP3368927B2 (ja) * | 1992-12-28 | 2003-01-20 | 大倉工業株式会社 | 導電性粘着テープ用基材フィルムの製造方法 |
| US5508107A (en) * | 1993-07-28 | 1996-04-16 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive tapes for electronics applications |
| US5478880A (en) * | 1994-02-01 | 1995-12-26 | Moore Business Forms, Inc. | Printable release |
| JP3473701B2 (ja) * | 1994-05-06 | 2003-12-08 | ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー | 高温耐性を有する帯電防止性感圧接着テープ |
| US5589246A (en) * | 1994-10-17 | 1996-12-31 | Minnesota Mining And Manufacturing Company | Heat-activatable adhesive article |
| US5807507A (en) * | 1996-08-28 | 1998-09-15 | Fuji Polymer Industries Co., Ltd. | Self-fusing conductive silicone rubber composition |
| JP3347026B2 (ja) * | 1997-07-23 | 2002-11-20 | 株式会社巴川製紙所 | 電子部品用接着テープ |
| US5958537A (en) * | 1997-09-25 | 1999-09-28 | Brady Usa, Inc. | Static dissipative label |
| JP5105655B2 (ja) * | 1999-03-11 | 2012-12-26 | 日東電工株式会社 | 粘着テープ又はシート用プライマー組成物、及び粘着テープ又はシート |
| US20030039822A1 (en) * | 2001-08-17 | 2003-02-27 | 3M Innovative Properties Company | Contaminant removal tape assembly, a roll of contaminant removal tape, and methods of removing contaminants from a surface |
| TWI341859B (en) * | 2003-05-09 | 2011-05-11 | Mitsubishi Gas Chemical Co | Adhesive and adhesive film |
| JP2005150630A (ja) * | 2003-11-19 | 2005-06-09 | Nitto Denko Corp | 半導体装置製造用接着フィルム |
| US8252407B2 (en) * | 2005-01-12 | 2012-08-28 | Avery Dennison Corporation | Adhesive article having improved application properties |
| US20060194070A1 (en) * | 2005-02-25 | 2006-08-31 | Joshua Croll | Polyetherimide film and multilayer structure |
-
2006
- 2006-09-15 MX MXPA06010596A patent/MXPA06010596A/es unknown
- 2006-12-19 US US12/096,249 patent/US20080268206A1/en not_active Abandoned
- 2006-12-19 KR KR1020087014917A patent/KR20080076965A/ko not_active Ceased
- 2006-12-19 JP JP2008547452A patent/JP2009521561A/ja not_active Withdrawn
- 2006-12-19 WO PCT/US2006/048476 patent/WO2007075716A1/en not_active Ceased
- 2006-12-19 CN CN2006800482686A patent/CN101341226B/zh not_active Expired - Fee Related
- 2006-12-19 EP EP06839436A patent/EP1969081A4/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| CN101341226B (zh) | 2013-03-20 |
| WO2007075716A1 (en) | 2007-07-05 |
| EP1969081A4 (en) | 2012-08-08 |
| EP1969081A1 (en) | 2008-09-17 |
| JP2009521561A (ja) | 2009-06-04 |
| US20080268206A1 (en) | 2008-10-30 |
| CN101341226A (zh) | 2009-01-07 |
| MXPA06010596A (es) | 2007-06-22 |
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