CN101341226B - 用聚醚酰亚胺聚合物制成的产生低静电的耐高温热粘合带 - Google Patents

用聚醚酰亚胺聚合物制成的产生低静电的耐高温热粘合带 Download PDF

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Publication number
CN101341226B
CN101341226B CN2006800482686A CN200680048268A CN101341226B CN 101341226 B CN101341226 B CN 101341226B CN 2006800482686 A CN2006800482686 A CN 2006800482686A CN 200680048268 A CN200680048268 A CN 200680048268A CN 101341226 B CN101341226 B CN 101341226B
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China
Prior art keywords
adhesive
film
polymer film
polyetherimide polymer
band according
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Expired - Fee Related
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CN2006800482686A
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English (en)
Chinese (zh)
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CN101341226A (zh
Inventor
劳尔·马尔多纳多·阿利拉诺
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
CN2006800482686A 2005-12-23 2006-12-19 用聚醚酰亚胺聚合物制成的产生低静电的耐高温热粘合带 Expired - Fee Related CN101341226B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74307605P 2005-12-23 2005-12-23
US60/743,076 2005-12-23
PCT/US2006/048476 WO2007075716A1 (en) 2005-12-23 2006-12-19 High temperature heat resistant adhesive tape, with low electrostatic generation, made with a polyetherimide polymer

Publications (2)

Publication Number Publication Date
CN101341226A CN101341226A (zh) 2009-01-07
CN101341226B true CN101341226B (zh) 2013-03-20

Family

ID=38218317

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800482686A Expired - Fee Related CN101341226B (zh) 2005-12-23 2006-12-19 用聚醚酰亚胺聚合物制成的产生低静电的耐高温热粘合带

Country Status (7)

Country Link
US (1) US20080268206A1 (enExample)
EP (1) EP1969081A4 (enExample)
JP (1) JP2009521561A (enExample)
KR (1) KR20080076965A (enExample)
CN (1) CN101341226B (enExample)
MX (1) MXPA06010596A (enExample)
WO (1) WO2007075716A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5517162B2 (ja) 2010-09-22 2014-06-11 インターナショナル・ビジネス・マシーンズ・コーポレーション 文書情報の機密ラベルを判定する方法、コンピュータ・プログラム、装置、及びシステム
US8673462B2 (en) 2011-09-02 2014-03-18 International Business Machines Corporation Low viscosity electrostatic discharge (ESD) dissipating adhesive substantially free of agglomerates
EP2639278A1 (en) * 2012-03-13 2013-09-18 Nitto Denko Corporation Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape
JP6106232B2 (ja) * 2015-09-07 2017-03-29 日東電工株式会社 グラファイトシート用粘着シート
US10501252B1 (en) * 2017-07-27 2019-12-10 Amazon Technologies, Inc. Packaging material having patterns of microsphere adhesive members that allow for bending around objects
JP7204658B2 (ja) * 2017-10-19 2023-01-16 デンカ株式会社 単層フィルム及びそれを用いた耐熱粘着テープ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6395391B1 (en) * 1997-07-23 2002-05-28 Tomoegawa Paper Co., Ltd. Adhesive tape for electronic parts
CN1551715A (zh) * 2003-05-09 2004-12-01 三菱瓦斯化学株式会社 粘接剂和粘接性薄膜

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475196A (en) * 1965-12-27 1969-10-28 Borden Inc Pressure-sensitive tape coated with a release agent
US3728150A (en) * 1971-07-12 1973-04-17 Du Pont Bondable adhesive coated polyimide film
JPH0620087B2 (ja) * 1989-07-10 1994-03-16 株式会社巴川製紙所 リードフレーム用接着テープ
IE67319B1 (en) * 1989-10-11 1996-03-20 Waterford Res & Dev Ltd Antistatic adhesive tape
US5273798A (en) * 1991-08-01 1993-12-28 Watson Label Products, Corp. Heat and solvent resistant pressure-sensitive label
JP3368927B2 (ja) * 1992-12-28 2003-01-20 大倉工業株式会社 導電性粘着テープ用基材フィルムの製造方法
US5508107A (en) * 1993-07-28 1996-04-16 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive tapes for electronics applications
US5478880A (en) * 1994-02-01 1995-12-26 Moore Business Forms, Inc. Printable release
JP3473701B2 (ja) * 1994-05-06 2003-12-08 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー 高温耐性を有する帯電防止性感圧接着テープ
US5589246A (en) * 1994-10-17 1996-12-31 Minnesota Mining And Manufacturing Company Heat-activatable adhesive article
US5807507A (en) * 1996-08-28 1998-09-15 Fuji Polymer Industries Co., Ltd. Self-fusing conductive silicone rubber composition
US5958537A (en) * 1997-09-25 1999-09-28 Brady Usa, Inc. Static dissipative label
JP5105655B2 (ja) * 1999-03-11 2012-12-26 日東電工株式会社 粘着テープ又はシート用プライマー組成物、及び粘着テープ又はシート
US20030039822A1 (en) * 2001-08-17 2003-02-27 3M Innovative Properties Company Contaminant removal tape assembly, a roll of contaminant removal tape, and methods of removing contaminants from a surface
JP2005150630A (ja) * 2003-11-19 2005-06-09 Nitto Denko Corp 半導体装置製造用接着フィルム
US8252407B2 (en) * 2005-01-12 2012-08-28 Avery Dennison Corporation Adhesive article having improved application properties
US20060194070A1 (en) * 2005-02-25 2006-08-31 Joshua Croll Polyetherimide film and multilayer structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6395391B1 (en) * 1997-07-23 2002-05-28 Tomoegawa Paper Co., Ltd. Adhesive tape for electronic parts
CN1551715A (zh) * 2003-05-09 2004-12-01 三菱瓦斯化学株式会社 粘接剂和粘接性薄膜

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP平3-41743A 1991.02.22
JP特开2000-265134A 2000.09.26
JP特开平11-5957A 1999.01.12
JP特开平6-198703A 1994.07.19

Also Published As

Publication number Publication date
JP2009521561A (ja) 2009-06-04
CN101341226A (zh) 2009-01-07
EP1969081A4 (en) 2012-08-08
EP1969081A1 (en) 2008-09-17
WO2007075716A1 (en) 2007-07-05
US20080268206A1 (en) 2008-10-30
MXPA06010596A (es) 2007-06-22
KR20080076965A (ko) 2008-08-20

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Granted publication date: 20130320

Termination date: 20171219