Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
  • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
  • C09J7/22—Plastics; Metallised plastics
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
  • C09J7/22—Plastics; Metallised plastics
  • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J7/38—Pressure-sensitive adhesives [PSA]
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/02—Elements
  • C08K3/04—Carbon
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
  • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
  • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2433/00—Presence of (meth)acrylic polymer
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2479/00—Presence of polyamine or polyimide
  • C09J2479/08—Presence of polyamine or polyimide polyimide
  • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2483/00—Presence of polysiloxane
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/10—Methods of surface bonding and/or assembly therefor
  • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
  • Y10T428/24612—Composite web or sheet
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Definitions

• This invention is related to construction of an adhesive tape with a composition that enables it to resist high temperature treatments and maintain a low electrostatic level when removed from a polymer or metal surface, through a combination of a polyetherimide polymer film and an adhesive of an acrylic or silicone type, which may be added to conductive materials of an organic polymer nature, organic or inorganic metallic salts, organic salts of organic compounds such as aniline, activated carbon or micronized carbon black.
• This invention also involves a system whereby the aforementioned additives are added to the adhesive, as well as the equipment systems for applying the former to the polyetherimide polymer film.
• This type of procedure is known as masking or temporary protection, which is the most common procedure recommended for electric circuits, as insulating masking films; or in electronic circuits as gold fingers.
• tape 5563 made by 3M Company, which uses an acrylic adhesive that remains stable at temperature of up to 220 0 C and has a polyimide film. This tape also has the ability to reduce the electrostatic charge when unwound from a master roll or when friction is produced against a metal surface during removal.
• This invention provides an alternative for high temperature heat-resistant films, even though it does not take into account an adhesive or mechanism to reduce the electrostatic charge generated by the friction caused by the film itself, or with a different material.
• an adhesive tape resistant to organic solvents and to high temperatures which is formed from a base solution that is placed on semiconductor materials as a thin film.
• This film is mentioned in Patent JP634O847 belonging to Ikeda et al., which also indicates the use of treatment prior to placement and represents additional energy consumption.
• Patent JP6212134 belonging to Inagaki and Hara has a polyimide resin adhesive, an epoxy resin and an inorganic additive. This type of construction offers good resistance to chemicals and high temperatures, but construction is highly complex, which has limitations in temporary applications, in which the tape must be removed after a few minutes.
• Patent EP0369408 belonging to Eguchi and Kuroda shows a polyimide film on which a very thin metal film, such as copper for example, is placed in such a way that the result is a flexible circuit that may be printed.
• This invention takes advantage of the high resistance of the polyimide polymer to manufacture circuits, but it does not have properties to reduce electrostatics.
• Patent BE801115 belonging to Dupont which consists of a polyimide film used to make laminates with an acrylic adhesive that makes it suitable for permanent fixture on metal surfaces.
• Patent WO9620983 belonging to Gutman and Yau describes a tape focused more specifically toward use in electronics. It is comprised of a silicone adhesive tape that has conductive material resting on a polyimide film in the form of a thin coat. This construction makes the tape heat resistant and, in addition, reduces the electrostatics caused by friction against itself or against a surface made of a different material. This construction is used as a base for manufacturing tapes that are applied to electronic or electric circuits by taking advantage of the properties of the polyimide polymer, even when the later represents a material with limited supplies.
• Patent JP2004136625 A product is described in Patent JP2004136625, in which a tape is built based on a combination of conductive materials and resins that is able to act as a means of transport for electronic chips, transport of electronic circuits or bedding for printed electronic circuits.
• Patent JP20022069395 belonging to Miyako and Taima there is an adhesive tape through placement of a coating of a conducting material over any material acting as a substrate, which might be a polyolefin. This application is especially important in cases where reduction of electrostatics is such that the tape must become a semiconductor.
• Patent JP2001152105 belonging to Ito and Kawada describes a conductive adhesive tape, but this time one that has three coats of material, including a melamine, a polyolefin and a fluoroalkylsilane, which makes it a product specifically for conducting electricity and limits it to non-temporary uses.
• Patent JPl 0120904 belonging to Hirano et al. describes an adhesive with a silicone base to which a boron compound is added.
• This type of adhesive eliminates the need to use a polyolefin or polyimide film or one of any other compound to reduce electrostatics. Nonetheless, its design does not allow it to maintain resistance to physical deformations or damages from direct blows.
• One version of a tape reduces electrostatics using a conduction system through small conductive strands on the very thin coat of adhesive protected by a paper or polyolefin film containing a low surface energy or anti-adherent agent. Although it is highly effective for conducting static electricity, this tape has limitations when a low-cost solution is required for protecting surfaces for a short period of time.
• an objective of certain embodiments of this invention is to build an adhesive tape that uses different adhesive compositions and a polyetherimide polymer film providing protection and insulation in electronic and electric applications, as well as in applications in which protection is needed for surfaces at the time they are subjected to high temperatures.
• Another objective of certain embodiments of this invention is to offer various alternatives for designing construction of a protective adhesive tape that also reduces electrostatics.
• Another goal of certain embodiments of the invention is to present manufacturing systems for producing the high temperature heat resistant adhesive tape.
• the new invention can prevent mechanical damages to the adhesive and the covered surface due to the fact that the polyetherimide polymer film offers a barrier that is highly resistant to tension and the mechanical stress from the cut-die.
• it provides a silicone or acrylic adhesive tape with the advantage that conducting materials may be added as transition metals, micronized carbon black or boron salts, which may easily be blended with a silicone-base adhesive to achieve a very thin coat on a polyetherimide polymer film.
• the micronized carbon refers to one carbon black used as powder and having a particle distribution between 1 and 50 microns, while the transition metals or boron salts present a particle size of 150 to 200 microns.
• the polyetherimide is resistant to the mechanical stress encountered during its use as temporary protection for electronic and electric circuits; in addition to insulating the surface covered by the adhesive tape, thereby limiting contact with the outside environment, preventing propagation of static electricity and/or limiting contact with materials conducting electricity that might cause a short circuit.
• This invention also includes the method for manufacturing the new adhesive tape in a simpler way, which shortens production time and ensures uniformity in the final characteristics.
• a tape is obtained that uses a polyetherimide polymer, eliminating the use of polyimide and its derivatives; and an adhesive containing dispersed particles that contribute to reducing the electrostatic charge generated by friction between surfaces.
• its measurements and chemical structure remain stable under high temperature conditions.
• the present invention comprises a film or backing, an adhesive, a low adhesion or anti-adherent agent (also known as LAB for Low-Adhesion-Backing), and agents that can modify electrostatic build-up.
• a low adhesion or anti-adherent agent also known as LAB for Low-Adhesion-Backing
• agents that can modify electrostatic build-up also known as LAB for Low-Adhesion-Backing
• the invention may include a primer or Corona treatment of the film or backing.
• the invention may include a system for applying the adhesive on the film or backing.
• the chemical composition may be altered, depending on the final application in which the product is to be used.
• the composition includes a polyetherimide polymer.
• Another option is to place a polyolefin or die-cut sheet of paper coated with a low adhesion compound over the adhesive in such as way that the adhesive takes on the geometrical shape of the die-cut or raised portions when the film or sheet is removed. This ensures that only a minimum of air remains between the adhesive and substrate material, and makes the adhesion contact more effective.
• the adhesive used in these cases is preferably a silicone derivative that is modified so that it constitutes a pressure-sensitive adhesive.
• Some of the aforementioned products also add electricity conduction materials to the adhesive, in the form of fine particles such as metallic salts that include silver, gold, copper, tin, zinc, iron or vanadium.
• This invention also involves construction of an adhesive tape using the new polyetherimide polymer and a silicone or acrylic base adhesive. It is processed through a simple pumping manufacturing system and the fact that it lowers production costs makes it feasible for use in simple, temporary applications, with resistance to temperatures up to
• a primer or Corona treatment is needed to keep the adhesive on the film or backing, in order to improve the interaction between the film or backing itself and the adhesive.
• the theory regarding operation of the Corona treatment and primer has been widely analyzed and is well known among persons with an understanding of the art.
• the product of this invention also includes a low adhesion agent or LAB (low-adhesion-backing) on the other side of the film or backing, which prevents the adhesive from sticking or losing its adhesive quality.
• LAB low-adhesion-backing
• This agent has many different compositions but for this invention silicone or silicone and urea compounds are satisfactory.
• Processes for manufacturing adhesive tapes or folios may be used to place the adhesive over the film or backing.
• the processes include those that use systems for melting an adhesive without organic solvent and those with systems for applying adhesives dissolved in organic solvents (toluene, heptane, ethyl acetate, etc.) or water.
• organic solvents toluene, heptane, ethyl acetate, etc.
• water water
• Manufacture of the product of this invention includes, but is not limited in its description or sequence to, the following:
• Scotch Grip Components marketed under the brand name Scotch Grip, manufactured by 3M Company, are found within this type, and they include products made with the technology presented by Scotch Grip 2353, Scotch Grip 2510, Precote 85, Precote 80 and Precote 30.
• Figure 1 shows the different geometrical shapes and distributions of the cut-die or raised portions on the film or backing of this invention. These examples in shapes Ia, Ib, Ic, Id, Ie, If and Ig are not the only ones possible; and they may include other geometrical shapes that construct a final product of the invention.
• Figure 2 shows the main thicknesses in the film or backing used: the total thickness of the film or backing on the raised portions (H) and the thickness of the base of same (h).
• Figure 3 shows the angle (i) that the die-cut or raised portions might have in the film or backing.
• Figure 4 shows a diagram of the finished protective adhesive film, comprised of an upper coat of adhesive (ii), a lower coat of adhesive (iii) and a film or backing with a die-cut or raised portions (iv).
• Figure 5 shows an example of the geometrical shapes in a film or backing with a die-cut or raised portions, and the span (v) that exists between them in order to obtain channels.
• Figure 6 shows a graph with the levels of electrostatics formed under conditions with 25°C and 50% relative humidity when micronized carbon black and copper salts are added to the adhesive.
• Figure 7 shows the effect on the adhesion to steel, of additives to reduce electrostatics.
• Figure 8 shows a graph with the levels of electrostatics formed when micronized carbon and regular carbon black are added, in the extrusion of the polyetherimide film.
• the following conditions were used for Figures 6 through 8: 25°C, 50% relative humidity, a conditioning time of 24 hours, detachment speed of 12 inches per minute and the Hewlett Packard static energy reader Mod. 2639, as gauging equipment for electrostatics.
• This invention consists of a film or backing composed of polyetherimide, which may or may not have a die-cut or raised portions of different size or shape and maintains a thin coat of adhesive on its surface.
• the film or backing may have various geometrical shapes on its cut-die or raised portions, as shown in Figures Ia, Ib, Ic, Id, Ie, If and Ig. Likewise, the measurements of this die-cut may vary; although the ideal sizes, though not the only ones, are those shown in table 1 :
• the die-cut or raised portions have dimensions that make it possible to place the adhesive on its surface, in various thicknesses that include a size similar to that of the die-cut or raised proportion itself. It is preferable for the dry adhesive to have the dimensions shown in Table 2 below, the objective of which is to show examples of recommended sizes although they are not the only ones applicable to the invention:
• the thickness of the adhesive may range between about 0.0002 and about 0.002 inches (0.00508 and 0.0508 millimeters) for the product of this invention.
• the preferable amount is about 0.001 inches (0.0254 millimeters), or an amount equal to between about 3 and 35 grams per square meter based on the contents of the solids in the adhesive itself.
• the adhesive compound in the product of this invention is a pressure-sensitive adhesive (PSA), a composition that is comprised mainly of a silicone-based polymer, preferably a solution containing polydimethylsiloxane and polysiloxane resin rubbers. Adhesives of an acrylic type may also be used, including blends with isooctylacrylate or
• a conductive material may be added to the polyetherimide film forming extrusion process.
• the film with the properties shown in Table 3 in particular is an option for reducing electrostatics and maintaining good resistance to temperatures of up to 220°C.
• Table 3 Properties of a polyetherimide film with a thickness of 0.001 to 0.002 inches.
• One important characteristic of the film die-cut or raised proportion is the angle at which the geometrical form may be constructed on the surface. This angle may range between 0° and 70° compared to the perpendicular of the film or backing base. ,This is shown in Figure 3 and it demonstrates in a way that is easy to understand for persons familiar with the technique that the angle Q) may be altered in combinations with the depth of the die-cut or raised proportion shown in the different Figures Ia, Ib, Ic, Id, Ie, If and
• the adhesion properties of the final product are affected by the type of adhesive, the contact surface and the geometrical shape selected for the backing or film.
• a larger contact surface with an adhesive with a high instantaneous adhesive power can keep the product on glass, ceramic or steel surfaces.
• the contact surface of the film or backing that comes into contact with the adhesive and, in turn, the surface that is positioned over the protected surface also determines the power with which the product of the invention will stay firmly in place.
• the compositions of the adhesives used will help to reinforce the affinity and adhesion of the product on the reinforced surface. It is also important to point out that the type of adhesive must be selected according to the manufacturing process in which the film acting as reinforcement will be used. In cases in which the material to be reinforced drifts at high speeds, an adhesive with a high instant adhesive power will make it possible to rapidly join the surface in movement. Any combination of adhesive with an application process is valid, in accordance with the specific needs of the user. *
• the span between the geometrical shapes must be such that even after placing the adhesive, the gases, vapors or liquids can escape through the channels or ducts.
• the impurities that are also mixed with the gases, vapors or liquids will have an escape route.
• the span between the geometrical shapes of the film or backing will vary in order to keep flaws to a minimum in the protection application chosen.
• the adhesive or film backing has a die-cut or raised proportion
• An adhesive thickness that equals the depth of the die-cut or raised proportion in the film or backing will eliminate the channels or ducts through which the gases, vapors or liquids can escape.
• a geometrical shape in which the space of the channels or ducts of the film borders are reduced, will also have a significant impact on the effectiveness of eliminating gases, vapors or liquids in the section formed by the adhesive and the substrate material.
• the speed with which the gases, vapors or liquids are eliminated must determine the size of the channels or ducts used in the finished product.
• materials with the capacity to reduce electrostatics directly to the adhesive include silver, boron, gold, copper, tin, zinc, iron and vanadium salts and activated carbon with particle sizes ranging from about 150 and 200 microns in a concentration of 1 to 5% w/w, or micronized carbon black with particle size of about 1 to 50 microns in a concentration of 1 to 5% w/w.
• micronized carbon black' refers to carbon particles having a particle size of about 1 to 50 microns, and it is maintained for all references in this document. The latter materials are able to conduct electricity and distribute it throughout an area of the adhesive film, reducing its concentration in the surface treated.
• the electrostatic reduction level becomes nearly constant with the increase in the micronized carbon black. This phenomenon is observed when concentrations of materials exceed 1.5% w/w.
• the amount of additives to reduce electrostatics have to take into consideration the reduction in the adhesion of the adhesive solution that is prepared to make the tape. As seen in Figure 7, raising the amount of additive causes a reduction in adhesion seen on stainless steel panel. The proper combination of electrostatic reduction and adhesion on a surface will have to select the amount of additives that will provide a convenient low electrostatic level and a sufficient adhesion performance.
• a material such as vanadium pentoxide can reduce the electrostatics to an even greater extent, even though it shows the same tendency to reach a constant level at levels of approximately 1.5% w/w. It is possible to add this material to the adhesive or to the low adhesion agent; thus it is an alternative for reducing the electrostatics to values of 200 volts or below.
• the electrostatics formed by friction of the adhesive when it is unfastened from a section of the polyetherimide film surface by adding the same materials as those used for the adhesive, but now placed through the low adhesion agent.
• the low adhesion agent is placed in order to be able to peel several layers of the adhesive film, one over the other, to make it easier to. unfasten them.
• the components used to reduce the electrostatics are mixed in with the low adhesion agent in such a way that they are deposited in a very thin coat over the outside of the polyetherimide polymer film, so that they distribute the electrostatics formed by friction of the adhesive when it is unfastened from the film.
• the ingredients are blended in the same way as that described for the adhesive of this invention.
• Conductive acrylic adhesives made up of molecules with carboxyl groups that permit electron conduction, such as acrylate, ethylhexyl and acrilamide derivatives, constitute another alternative.
• Yet another option is to add particles of the conductive materials listed above directly to the reaction of the formation of the polyetherimide polymer, in a concentration of between 0.5 and 1% w/w.
• Organic solvent-based adhesives toluene, heptane, etc.
• water-based medium-low speeds (up to 80 m/min)
• Roll coating systems with a gravure roll, 95 QCH stainless steel and diameter of 20-30 centimeters, at a speed of 20 meters per minute, may also be used to apply the adhesive.
• the polyetherimide film with die-cut or raised proportion used in this invention can be manufactured with different mechanisms. It is also feasible to find them on the market, such as those offered by General Electric Polymers, Bloomer Plastics Company, 3M Company, Mitsubishi Polymers and Dupont Company, among others.
• the various compositions and physical properties make it possible to construct a wide range of protective films.
• the thickness and type of the film used to reinforce the materials are a very important factor in this invention.
• the chemical nature of the film will be defined by the environmental conditions under which it will be used during reinforcement.
• a regular polyolef ⁇ n film may be made more resistant to shearing or tearing when polyolefin, carbon or fiberglass fibers are placed in its structure.
• the thickness of a film backing for this invention may range between 0.001- and 0.01 inches (0.0254 to 0.254 mm, but preferably 0.0254 mm) in order to achieve the protection, resistance and electrostatic reduction performance described. Its use will depend on the conditions under which it will be operating and the customer's needs with regard to cost and effectiveness. Any person familiar with the technique knows that an increase in the thickness of the film backing will depend on the resistance level and type of application sought. Thus, thickness of the polyetherimide film will permit to have better resistance to high temperatures by the adhesive tape made out if it, as seen in Table 6.
• Selection of the Corona treatment may vary up to 60 kilowatts on a width of 1.2 meters, or the equivalent in order to achieve a surface energy equal to 35 dynes; while the primer may be chosen from among a group of compounds that include acrylic products, ureas and natural or synthetic rubber derivatives (available from a number of companies, such as Dupont Company and 3M Company, among others).
• An adhesive made of isooctyl acrylate and acrylamide compounds in a proportion of 90%/l 0% was placed on a polyetherimide polymer film that had a 1 millimeter circular raised portion, and a span of 0.5 millimeters between each circle.
• the amount of acrylic adhesive placed was sufficient to keep the adhesive at a thickness of approximately
• the adhesive was coated with a font die, which was fed with a peristaltic pump at a rate of 10-15 kilograms per minute.
• the adhesive solution had a viscosity of 3000 to 5000 centipoises and total solids of 40%. Construction was completed with placement of a low adhesion agent, RDl 530 at 2% total solids from 3M Company, on the other side of the backing or film.
• the adhesive was coated with a drop die with a lips gap of 0.02 to 0.03 inches, made of stainless steel and fed with a peristaltic pump at a rate of 20-25 kilograms per minute, to provide a continuous flow of adhesive in a gap of 0.01 to 0.015 inches from the surface of the polyetherimide film.
• Construction was completed with placement of a low adhesion agent, RD 1530 at 2% total solids from 3M Company, on the other side of the backing or film, as in example 1.
• Example 3 High temperature heat resistant tape with high static reduction ( ⁇ 200 volts) An adhesive composed of a silicone polymer made of siloxane polydimethyl and polysiloxane as in Example 2, was placed in a weight of 20 g/m2 over a polyetherimide polymer film that had a 0.001 inches thick (0.0254 mm) flat surface. The adhesive was added to a vanadium pentoxide solution using a surfacing or thixotropic agent such as xanthate gum in a concentration of 2% w/w, and mixing it with a marine propeller at 3000 rpm for one hour.
• a surfacing or thixotropic agent such as xanthate gum
• the adhesive was coated with a drop die with a lips gap of 0.03 to 0.045 inches, made of stainless steel and fed with a peristaltic pump at a rate of 20-25 Kg per minute, to provide a continuous flow of adhesive in a gap of 0.008 to 0.01 inches from the surface of the polyetherimide film. Construction was completed with placement of a low adhesion agent, RD 1530 at 2% total solids from 3M Company, on the other side of the backing or film, as in Example 1.
• the adhesive was added with micronized carbon black, which was made by adding these latter components and a thixotropic agent such as xanthate gum in a concentration of 2% w/w in toluene, and mixing with a marine propeller at 3000 rpm for one hour.
• the adhesive solution was coated with a font die, which was fed with a peristaltic pump at a rate of 15-20 kilograms per minute.
• the adhesive solution had a viscosity of 3000-5000 centipoises and total solids of 50%. Construction was completed with placement of a low adhesion agent, RDl 530 at 2% total solids from 3M Company, on the other side of the backing or film, as in Example 1.
• Example S High temperature heat resistant tape with micro-replicated acrylic adhesive
• the adhesive was diluted with ethyl acetate to place it on a piece of 0.05 mm by 0.05 mm release paper that had a micro-replicated net pattern in such a way that the net was created by squares of 0.05 mm in length and 0.05 mm in width. The pattern was then replicated throughout the adhesive surface including the 0.001 mm deep channels separating the squares in the net.
• the adhesive was coated on the release paper with a font die, which was fed with a peristaltic pump at a rate of 10 to 15 kilograms per minute.
• the adhesive solution had a viscosity of 3000-5000 centipoises and total solids of 40%.
• the coated paper was then placed onto the surface of the polyetherimide film using a winder machine running at 20 to 25 meters per minute, and which has two cylinders of
• the resultant product was a tape where the micro-replicated adhesive was transferred from the release paper to the polyetherimide film.
• the release paper is obtained from the line of products Scotch Cal®, manufactured by 3M Company, St. Paul, MN, USA.
• the adhesive film acts as a backing for one adhesive that facilitates connection to the substrate and maintains its stability, along with that of the film, under temperatures up to 220 0 C. This makes the adhesive tape an alternative for protecting or insulating surfaces such as electronic or electrical circuits.
• Compounds such as derivatives of organometallic derivatives, boron, carbon or micronized carbon black may be added to the adhesive in order to reduce the electrostatics caused by friction between the adhesive and the polyetherimide coating, either alone or with a different surface. These compounds may also be added to the film during the production process or when the low adhesion agent is placed on the film when the adhesive tape is manufactured.

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Health & Medical Sciences (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Inorganic Chemistry (AREA)
• Adhesive Tapes (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Laminated Bodies (AREA)

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• 2006
  • 2006-09-15 MX MXPA06010596A patent/MXPA06010596A/es unknown
  • 2006-12-19 JP JP2008547452A patent/JP2009521561A/ja not_active Withdrawn
  • 2006-12-19 WO PCT/US2006/048476 patent/WO2007075716A1/en not_active Ceased
  • 2006-12-19 EP EP06839436A patent/EP1969081A4/en not_active Withdrawn
  • 2006-12-19 KR KR1020087014917A patent/KR20080076965A/ko not_active Ceased
  • 2006-12-19 US US12/096,249 patent/US20080268206A1/en not_active Abandoned
  • 2006-12-19 CN CN2006800482686A patent/CN101341226B/zh not_active Expired - Fee Related

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