WO2018110255A1 - 転写シート - Google Patents
転写シート Download PDFInfo
- Publication number
- WO2018110255A1 WO2018110255A1 PCT/JP2017/042328 JP2017042328W WO2018110255A1 WO 2018110255 A1 WO2018110255 A1 WO 2018110255A1 JP 2017042328 W JP2017042328 W JP 2017042328W WO 2018110255 A1 WO2018110255 A1 WO 2018110255A1
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- WO
- WIPO (PCT)
- Prior art keywords
- transfer sheet
- adhesive layer
- layer
- heat
- conductive material
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
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- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/12—Ceramic
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- C09J2429/00—Presence of polyvinyl alcohol
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- C09J2459/00—Presence of polyacetal
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Definitions
- the present invention relates to a transfer sheet and a heat radiating member using the same.
- a typical heat spot countermeasure is the installation of a heat dissipation member. Heat dissipation from the heat generating member is promoted through the heat radiating member, and the temperature inside the electronic device is made uniform.
- a heat radiating member provided in a thin and small electronic device, a heat radiating sheet obtained by processing a material having high heat conductivity into a sheet shape is used.
- carbon material represented by graphite, carbon or Carbon materials such as graphite and fillers such as alumina and silica are used.
- graphite exhibits excellent thermal conductivity, but on the other hand, it has low adhesion to other materials such as metal and plastic, and other materials have durability against friction and pressing force and workability at the time of punching and cutting. Therefore, the graphite sheet is used as a heat radiating member in a form in which it is laminated with an adhesive layer and a protective layer.
- Patent Document 1 describes a heat dissipation component including a sheet made of a graphite material and an adhesive layer having a thickness of 100 microns or less provided on the surface of the sheet. Acrylic liquid paste is used for this adhesive layer.
- the thickness of the adhesive layer is in the range of 20 microns to 100 microns, the adhesive strength between the graphite and the heating element and thermal diffusion are good. Met.
- such a heat-dissipating sheet having a pressure-sensitive adhesive layer having a thickness exceeding 20 microns cannot be adapted to recent fine electronic component shapes. Further, as long as the adhesive strength can be ensured, a further reduction in thermal resistance can be expected by further reducing the thickness of the adhesive layer.
- Patent Document 2 describes that graphite having a resin coating film is produced by applying a solution-like resin on one or both surfaces of a graphite sheet. Although such a resin coating film improves the flexibility of the graphite sheet and suppresses the detachment of the graphite powder, Patent Document 2 discloses the improvement in the adhesion between the graphite sheet and the heating element and the heat dissipation effect of the graphite sheet. Not mentioned at all.
- Patent Document 3 describes a heat conductive sheet comprising an expanded graphite sheet, a coating layer made of a thermosetting resin formed on the upper surface of the expanded graphite sheet, and an adhesive layer formed on the lower surface of the expanded graphite sheet. ing.
- This heat conductive sheet is excellent in heat dissipation characteristics with no powder falling off of graphite, but an adhesive film with an overall thickness of about 15 ⁇ m is used as the adhesive layer, which is improved in terms of balance between thinning of the entire heat dissipation sheet and adhesive strength. There is room for.
- Patent Document 4 describes an adhesive film for protecting a graphite sheet. Laminated sheets with this adhesive film affixed to a graphite sheet have excellent workability in punching and cutting processes. However, when such laminated sheets are used as heat radiating members, the manufacturing process of the heat radiating members is complicated, and heat dissipation There is a drawback that the thickness of the entire member increases. Further, Patent Document 4 does not describe the adhesiveness and heat dissipation performance of such a laminated sheet with a heating element.
- the object of the present invention is to use a carbon material as a heat dissipation material, and to have a heat dissipation that combines all of the ultra-thin shape, good adhesion to a member including a heat source, and excellent workability, which can cope with the miniaturization of electronic equipment and electronic components.
- a heat-dissipating body made of a heat-conducting material such as graphite and a member including a heat source are found to be firmly bonded without impairing the heat conductivity and workability of the heat-dissipating body. That is not being done.
- the present inventors searched for an adhesive suitable for bonding between a heat radiator made of a heat conductive material such as graphite and a member including a heat source.
- a heat conductive material layer such as graphite
- an adhesive layer containing polyvinyl formal and firmly adhere to the surface of another member with a simple operation to promote thermal diffusion.
- the laminated film which can do was examined.
- the present inventors provided an adhesive layer made of vinyl formal resin on both surfaces of a heat conductive material layer made of a carbon-based material such as graphite, and a release layer on the surface of one adhesive layer.
- a laminated film was found.
- a protective layer can be optionally provided on the surface of the other adhesive layer of the laminated film.
- Such a laminated film can be wound or stored in a flat sheet shape. If the release layer is removed and the adhesive layer is adhered to another member, the heat conductive material layer can be easily transferred onto the surface of the other member.
- the present invention is as follows. [1] A release layer made of a peelable film, a first adhesive layer containing a polyvinyl formal resin, a heat conductive material layer made of a carbon material, and a second adhesive layer containing a polyvinyl formal resin are laminated in this order. Transfer sheet.
- the structural units A, B, and C are randomly bonded, and the content of the structural unit A is 80 to 82% by weight based on the total of the structural units A, B, and C.
- [7] The method for producing a transfer sheet according to any one of [1] to [6], wherein the following steps 1, 2, and 3 are performed in this order.
- Process 1 The process of forming the 1st adhesive bond layer containing polyvinyl formal resin on the surface which the heat conductive material layer which consists of carbon materials formed on the support
- Step 2 A step of forming a release layer made of a peelable film on the open surface of the first adhesive layer and removing the carrier film from the thermally conductive material layer.
- Step 3) A step of forming a second adhesive layer containing a polyvinyl formal resin on the open surface of the heat conductive material layer.
- Step 4 A step of forming a protective layer on the open surface of the second adhesive layer.
- Step 5 A step of thermocompression bonding the outermost surface of the second adhesive layer constituting the transfer sheet to the article.
- Step 6) A step of removing the release layer constituting the transfer sheet.
- Step 7) A step of thermocompression bonding the outermost surface of the first adhesive layer constituting the transfer sheet to another article.
- the heat conductive material layer can be transferred to the heat source by a simple operation.
- the transferred heat conductive material layer is firmly adhered to the heat source through an extremely thin adhesive layer, and exhibits excellent heat dissipation.
- an ultrathin heat dissipation sheet having excellent heat dissipation performance can be firmly adhered to the heat source in a simple process.
- FIG. 1 is a schematic cross-sectional view of a first example of a transfer sheet of the present invention. Sectional schematic of the 2nd example of the transfer sheet of this invention. Schematic which shows the process 1 of the manufacturing method of the transfer sheet of this invention. Schematic which shows the process 2 of the manufacturing method of the transfer sheet of this invention. Schematic which shows the process 3 of the manufacturing method of the transfer sheet of this invention. Schematic which shows the process 4 which may be provided in the manufacturing method of the transfer sheet of this invention. Schematic which shows the process 5 of the formation method of the heat radiating member using the transfer sheet of this invention. Schematic which shows the process 6 of the formation method of the heat radiating member using the transfer sheet of this invention.
- the transfer sheet of the present invention is a member for transferring a layer made of a heat conductive material to another member having a heat generating portion, and takes the form of a laminate.
- the transfer sheet of the present invention a release layer made of a peelable film, a first adhesive layer containing a polyvinyl formal resin, a heat conductive material layer made of a carbon material, and a second adhesive layer containing a polyvinyl formal resin in this order. It has a laminated structure (for example, the structure shown in FIG. 1).
- the transfer sheet of the present invention may further be provided with a protective layer (for example, shown in FIG. 2).
- the transfer sheet of the present invention has a structure in which the heat conductive material layer is sandwiched between two adhesive layers each containing an extremely thin polyvinyl formal resin.
- the heat conductive material layer can be easily attached to the other member via the adhesive layer. Can be transferred to the surface.
- the adhesive layer is extremely thin, the heat conductive material layer is firmly fixed to the surface of another member via the adhesive layer.
- the other member has a heat generating portion, heat is conducted from the other member to the adhesive layer and the heat conductive material layer.
- the heat conduction layer thus transferred constitutes a heat radiating member together with the adhesive layer.
- the heat conductive material layer constituting the transfer sheet of the present invention is made of a carbon material. Any carbon material can be used as long as it can be processed into a thin layer. As such a carbon material, graphite, graphene, carbon nanotube, or the like can be used. Among these, graphite is preferable from the viewpoint of price and workability. As the graphite, a commercially available graphite sheet can be used without limitation. In the present invention, graphite produced by the method described in JP-A-61-275117 or JP-A-11-21117 can also be used.
- Examples of the commercially available products include eGRAF SPREADERSHIELD SS series (manufactured by GrafTECH International), graphicnity (manufactured by Kaneka Corporation), PGS graphite sheet (manufactured by Panasonic Corporation), and the like as artificial graphite sheets manufactured from synthetic resin sheets.
- Examples of the natural graphite sheet produced from natural graphite include eGRAF SPREADERSHIELD SS-500 (manufactured by GrafTECH International).
- the thickness of the heat conductive material layer made of graphite is not particularly limited.
- the heat conductive material layer is preferably a thick layer.
- the thickness of the heat conductive material layer is determined from the balance between the adhesion of the transferred heat conductive material layer and the heat dissipation effect. Is preferably 15 to 600 ⁇ m, more preferably 15 to 500 ⁇ m, and particularly preferably 20 to 300 ⁇ m.
- the first adhesive layer and the second adhesive layer constituting the transfer sheet of the present invention are made of a polybilyl formal resin.
- Polyvinyl formal resin is also known by the general term “vinylon”.
- a polyvinyl formal resin is a resin obtained by acetalization by reacting formaldehyde with polyvinyl alcohol in the presence of an acid catalyst. In this reaction, formalization occurs in the 1,3-diol portion of the polyvinyl alcohol to form a cyclic 1,3-dioxane structure, and a small amount of hydroxyl groups remain unreacted.
- the polyvinyl formal resin used in the adhesive layer of the present invention preferably contains the following structural units A, B and C.
- the total of the structural units A, B and C is preferably 80 to 100% by weight with respect to all the structural units of the polyvinyl formal resin.
- the structural units A, B and C are randomly bonded, and the structural unit A is 80 to 82% by weight based on the total of the structural units A, B and C. It contains 9 to 13% by weight of B and 5 to 7% by weight of the structural unit C.
- the weight average molecular weight of the polyvinyl formal resin preferably used in the present invention is in the range of 30,000 to 150,000, preferably 40,000 to 60,000.
- the polyvinyl formal resin containing the above structural units A, B, and C in the above specific ratio and having the above specific molecular weight is more tensile than other resins called vinylon, for example, resins called vinyl butyral resin. Excellent mechanical properties such as strength, bending strength and impact resistance. Further, even when used in a semiconductor element having a high glass transition temperature and a softening point and an operating temperature in recent years, the adhesiveness can be maintained. When such a polyvinyl formal resin is used as an adhesive, the article can be firmly bonded with a very small amount of use, and the adhesive portion through the article also exhibits high strength, durability and stability.
- the heat conductive material layer is held through an extremely thin adhesive layer, and the heat conductive material layer can be accurately removed with a simple operation.
- the heat conductive material layer can be firmly bonded to another member.
- Vinyl (registered trademark) manufactured by JNC Corporation can be used as the polyvinyl formal resin.
- each of the first and second adhesive layers in the transfer sheet of the present invention is in the range of 1 to 20 ⁇ m, preferably 1 to 10 ⁇ m.
- the thickness of the adhesive layer is set to a minimum thickness that can fill both the surface roughness of the adherend and the surface roughness of the carbon material. This is preferable in terms of minimizing thermal resistance.
- a heat conductive filler may be blended in the first and / or second adhesive layer.
- the heat conductive filler is not limited, but generally contains metal or metal compound such as metal powder, metal oxide powder, metal nitride powder, metal hydroxide powder, metal oxynitride powder and metal carbide powder. Fillers and fillers containing carbon materials are used.
- Examples of the metal powder include powders made of metals such as gold, silver, copper, aluminum, nickel, and alloys containing these metals.
- Examples of the metal oxide powder include aluminum oxide powder, zinc oxide powder, magnesium oxide powder, silicon oxide powder, and silicate powder.
- Examples of the metal nitride powder include aluminum nitride powder, boron nitride powder, and silicon nitride powder.
- Examples of the metal hydroxide powder include aluminum hydroxide powder and magnesium hydroxide powder.
- Examples of the metal oxynitride include aluminum oxynitride powder, and examples of the metal carbide powder include silicon carbide powder and tungsten carbide powder.
- aluminum nitride powder, aluminum oxide powder, zinc oxide powder, magnesium oxide powder, silicon carbide powder and tungsten carbide powder are preferable from the viewpoint of thermal conductivity and availability.
- a filler containing the same type of metal as the metal to which the heat conductive material layer is transferred is used as the pre-heat conductive filler. Is preferred.
- a local battery is formed between the metal to which the heat conductive material layer is transferred and the pre-heat conductive filler. The metal layer or filler may corrode.
- the shape of the metal or metal compound-containing filler is not particularly limited, but may be in the form of particles (including spheres and ellipsoids), flat shapes, columnar shapes, needle shapes (including tetrapot shapes and dendritic shapes), and irregular shapes. Can be mentioned. These shapes can be confirmed using a laser diffraction / scattering particle size distribution measuring device or SEM (scanning electron microscope).
- the metal or metal compound-containing filler it is preferable to use aluminum nitride powder, aluminum oxide powder, and needle-shaped (particularly tetrapot-shaped) zinc oxide powder.
- Zinc oxide has a lower thermal conductivity than aluminum nitride, but when a tetrapot-shaped zinc oxide powder is used, a heat radiating member having better heat dissipation characteristics than when using a particulate zinc oxide powder is obtained. Also, when tetrapot-shaped zinc oxide powder is used as the metal or metal compound-containing filler, delamination between the metal layer and the graphite layer occurs due to the anchor effect caused by the needle-like portion sticking into the carbon material. Can be reduced.
- Aluminum oxide has lower thermal conductivity than aluminum nitride and zinc oxide, but is chemically stable and does not react or dissolve in water or acid, so it has high weather resistance.
- the heat radiating member which has can be obtained.
- aluminum nitride powder is used as the metal or metal compound-containing filler, a heat radiating member having better heat radiating properties can be obtained.
- the average diameter of the heat conductive filler is generally 0.001 to 30 ⁇ m, and typically 0.01 to 20 ⁇ m.
- the said average diameter points out the average length of the tube or fiber used as a heat conductive filler.
- This average diameter is appropriately selected according to the size of the intended heat dissipation member, the thickness of the adhesive layer, and the like. From the viewpoint of the thermal conductivity of the adhesive layer in the stacking direction of the laminate, the average diameter is set smaller than the thickness of the adhesive layer.
- the average diameter of a metal or metal compound containing filler can be confirmed using a laser diffraction / scattering type particle size distribution measuring apparatus, SEM (scanning electron microscope), or the like.
- Examples of the filler containing the carbon material include graphite powder (natural graphite, artificial graphite, expanded graphite, ketjen black), carbon nanotube, diamond powder, carbon fiber, and fullerene. Among these, heat conductivity is excellent. From this point, graphite powder, carbon nanotube, and diamond powder are preferable.
- the thermally conductive filler may be a commercially available product having an average diameter or shape in a desired range, or a product obtained by pulverizing, classifying, heating, or the like so that the average diameter or shape is in a desired range. It may be used.
- the average diameter and shape of the said heat conductive filler may change in the manufacture process of the heat radiating member of this invention, what is necessary is just to mix
- thermally conductive filler a commercially available product subjected to surface treatment such as dispersion treatment or waterproof treatment may be used as it is, or a product obtained by removing the surface treatment agent from the commercially available product may be used. Moreover, you may use the surface-treated commercial item which is not surface-treated. In particular, since aluminum nitride and magnesium oxide are easily deteriorated by moisture in the air, it is desirable to use a waterproofed one. As said heat conductive filler, the above-mentioned filler may be used independently and 2 or more types may be used together.
- the blending amount of the heat conductive filler is preferably 1 to 80% by volume, more preferably 2 to 40% by volume, and further preferably 2 to 30% by volume with respect to 100% by volume of the adhesive layer. It is preferable that the thermal conductive filler is contained in the adhesive layer in the amount because the thermal conductivity of the adhesive layer is improved while maintaining the adhesiveness.
- the blending amount of the thermally conductive filler is not more than the upper limit of the range, an adhesive layer having high adhesive strength to the metal layer or the graphite layer is obtained, and the blending amount of the thermally conductive filler is not less than the lower limit of the range. If it exists, since an adhesive bond layer with high heat conductivity is obtained, it is preferable.
- the transfer sheet of the present invention having the first and / or second adhesive layer containing such a thermally conductive filler suppresses troubles caused by heat generation even at an electronic device that can be reduced in weight and reduced in size and at a high energy density. It is particularly useful for forming a heat dissipation sheet on a battery or the like.
- thermosetting resin such as an antioxidant, a silane coupling agent, and an epoxy resin, a curing agent, a crosslinking agent, a copper damage preventing agent, and a metal inertness are formed on the first and / or second adhesive layers.
- Conventional additives such as an agent, a rust inhibitor, a tackifier, an anti-aging agent, an antifoaming agent, an antistatic agent, and a weathering agent can also be blended.
- the resin forming the adhesive layer deteriorates due to contact with a metal
- a copper damage inhibitor or a metal deactivator as disclosed in JP-A-5-48265
- heat conduction The addition of a silane coupling agent is preferred to improve the adhesion between the conductive filler and the polyvinyl acetal resin, and the addition of an epoxy resin is preferred to improve the heat resistance (glass transition temperature) of the adhesive layer.
- silane coupling agent a silane coupling agent (trade names S330, S510, S520, S530) manufactured by JNC Corporation is preferable.
- the addition amount of the silane coupling agent is preferably 1 to 100 parts by weight with respect to the total amount of the resin contained in the adhesive layer from the viewpoint that the adhesiveness of the adhesive layer to the metal layer can be improved. 10 parts by weight.
- a crosslinking agent having a plurality of oxazoline groups or oxetane groups it is preferable to add a crosslinking agent having a plurality of oxazoline groups or oxetane groups.
- a compound having an oxazoline group tends to hardly generate by-products such as water when it reacts with a polyvinyl acetal resin, so that the compound is used by adding it to the adhesive layer of the present invention.
- Such a cross-linking agent having an oxazoline group is available, for example, as Epochros K series, Epocros WS series, or Epocros RPS manufactured by Nippon Shokubai Co., Ltd.
- Epochros K series Epochros K series
- Epocros WS series Epochros WS series
- Epocros RPS Epochros RPS-1005
- 2,2 '-(1,3-phenylene) bis (2-oxazoline) manufactured by Mikuni Pharmaceutical Co., Ltd. which is a commercially available low molecular compound having an oxazoline group, can also be used.
- the polyvinyl formal resin constituting the adhesive layer is added to the structural units A, B and C described above.
- the structural unit D is generally 0.1 to 50% by weight based on the total of the structural units A, B, and C. , Preferably 1 to 30% by weight.
- the said polyvinyl formal resin contains the said structural unit D in such a ratio, a bridge
- the polyvinyl formal resin constituting the adhesive layer of the present invention has been used for enameled wires for a long time, and is a resin that is hardly deteriorated by being brought into contact with a metal or hardly deteriorated.
- a copper damage inhibitor or a metal deactivator is added to the adhesive layer. It may be added.
- the amount of the copper damage preventing agent added is preferably 0.1 relative to 100 parts by weight of the total amount of the resin contained in the adhesive layer from the viewpoint of preventing the deterioration of the resin in the portion in contact with the metal of the adhesive layer. 1 to 3 parts by weight.
- a peelable film As the release layer constituting the transfer sheet of the present invention, a peelable film is used without limitation.
- a plastic film such as polyethylene terephthalate, polypropylene, and polyester film, paper, foamed sheet, metal foil, and a laminate composed of layers selected from these materials can be used.
- a plastic film such as polyethylene terephthalate is preferable because of excellent surface smoothness.
- a release agent can also be applied to the surface of these peelable films.
- a known and commonly used release agent such as a silicon-based, fluorine-based, long-chain alkyl-based or fatty acid amide-based release agent can be used without limitation.
- ⁇ Antistatic treatment may be applied to the release layer.
- the method of the antistatic treatment there is no limitation on the method of the antistatic treatment, and any of known methods such as application of an antistatic agent to the release layer, kneading into the peelable film material, and vapor deposition on the release layer can be used.
- the thickness of the release layer of the present invention is generally 20 to 100 ⁇ m, preferably 30 to 75 ⁇ m.
- a protective layer can be further provided on the second adhesive layer of the transfer sheet of the present invention. With this protective layer, it is possible to improve the oxidation resistance of the second adhesive layer of the transfer sheet of the present invention, and to prevent scratches and damages that lower the adhesiveness.
- the protective layer used in the present invention is preferably a resin film.
- a resin film a film made of a heat-resistant resin such as polypropylene or polyester is suitable, and among them, a self-adhesive polypropylene stretched film or a masking film in which a self-adhesive layer is laminated on a polyethylene terephthalate substrate is suitable. It is.
- the protective layer can be peeled from the second adhesive layer.
- coating the said coating material to the peelable film which comprises the above-mentioned peeling layer can be used as a protective layer.
- the transfer sheet of the present invention when used, the portion excluding both the release layer and the protective layer adheres to the other article, and as a result, the heat conductive material layer is transferred to the other article.
- the transfer sheet of the present invention can be produced by performing the following steps 1, 2, and 3 in this order.
- Process 1 The process of forming the 1st adhesive bond layer containing polyvinyl formal resin on the surface which the heat conductive material layer which consists of carbon materials formed on the support
- Step 2 A step of forming a release layer made of a peelable film on the open surface of the first adhesive layer and removing the carrier film from the thermally conductive material layer.
- Step 3) A step of forming a second adhesive layer containing a polyvinyl formal resin on the open surface of the heat conductive material layer.
- Step 4 A step of forming a protective layer on the open surface of the second adhesive layer.
- Step 1 An outline of the above step 1 is shown in FIG.
- a heat conductive material layer is overlaid on the carrier film.
- the carrier film used here any film can be used without limitation as long as the heat conductive material layer stably adheres while the first adhesive layer is formed on the surface of the heat conductive material layer.
- Such a carrier film may be the same as the above-described peelable film that is a material of the peelable layer constituting the transfer sheet of the present invention.
- the carrier film used in step 1 is removed before completion of the transfer sheet of the present invention, that is, in step 2 described later.
- step 1 of the present invention next, a solution containing polyvinyl formal resin is applied to the open surface of the heat conductive material layer, and the solution surface is heated and dried to form a first adhesive layer containing polyvinyl formal resin.
- the above-mentioned solution can contain the above-mentioned heat conductive filler and / or additive.
- the solution for diluting the polyvinyl formal resin for example, alcohols such as methanol, ethanol, n-propanol, iso-propanol, n-butanol, sec-butanol, n-octanol, diacetone alcohol, benzyl alcohol, etc.
- alcohols such as methanol, ethanol, n-propanol, iso-propanol, n-butanol, sec-butanol, n-octanol, diacetone alcohol, benzyl alcohol, etc.
- Solvent such as methyl cellosolve, ethyl cellosolve, butyl cellosolve; ketone solvent such as acetone, methyl ethyl ketone, cyclohexanone, cyclopentanone, isophorone; N, N-dimethylacetamide, N, N-dimethylformamide, 1-methyl- Amide solvents such as 2-pyrrolidone; ester solvents such as methyl acetate and ethyl acetate; ether solvents such as dioxane and tetrahydrofuran; dichloromethane, methylene chloride, chloro Chlorinated hydrocarbon solvents such as rum; Aromatic solvents such as toluene and pyridine; Dimethyl sulfoxide; Acetic acid; Terpineol; Butyl carbitol; Butyl carbitol acetate, etc., and a mixed solvent of two or more selected from these solvents Is used.
- the coating method is not particularly limited, but it is preferable to use a wet coating method capable of uniformly coating a polyvinyl formal resin solution.
- a spin coating method capable of forming a simple and uniform film is preferable.
- gravure coating, die coating, bar coating, reverse coating, roll coating, slit coating, spray coating, kiss coating, reverse kiss coating, air knife coating, curtain A coating method, a lot coating method and the like are preferable.
- Applicators and doctor blades can also be used to paint with a uniform thickness.
- the amount of the polyvinyl formal resin solution to be applied is adjusted so that the final thickness of the first adhesive layer is in the range of 1 to 20 ⁇ m, preferably 2 to 10 ⁇ m.
- the coated surface is dried.
- the means for drying is not limited. It may be allowed to stand for 1 to 7 days at room temperature and dried, or may be dried by heating at a temperature higher than the boiling point of the solvent and lower than the softening point of the polyvinyl formal resin.
- the atmosphere for heating and drying may be any of air, an inert gas atmosphere such as nitrogen or a rare gas, and any of atmospheric pressure, reduced pressure, and reduced pressure.
- Step 2 An outline of Step 2 is shown in FIG.
- a release layer is formed by bringing a peelable film into close contact with the open surface of the first adhesive layer formed in step 1 above, and the carrier film is removed from the thermally conductive material layer.
- a known means can be used without limitation.
- Step 3 An outline of the step 3 is shown in FIG.
- a second adhesive layer is further formed on the sheet obtained by laminating the release layer, the first adhesive layer, and the heat conductive material layer obtained in step 2 in this order. That is, in step 3, a second adhesive layer containing a polyvinyl formal resin is formed on the open surface of the heat conductive material layer by a method similar to the method for forming the first adhesive layer described above. Thus, the transfer sheet of the present invention is completed.
- Step 4 of the present invention is a step optionally performed after the above step 3.
- the above-mentioned protective layer is adhered to the outer surface of the second adhesive layer formed in step 3.
- a protective layer that is permanently adhered to the surface on the second adhesive layer or can be peeled off is formed.
- the transfer sheet of the present invention having a protective layer is completed.
- the transfer sheet of the present invention does not have a protective layer and may be wound so that the release layer is on the outside, or has a protective layer, and the release layer and the protective layer are the outermost layers. It may be in the form of a flat sheet.
- the thermal conductive material layer is used after being cut into various shapes according to the size and shape of the article to be transferred. It is done.
- the transfer sheet of the present invention the heat conductive material layer can be firmly fixed between the two kinds of articles through the extremely thin first and second adhesive layers without drilling or high-pressure treatment. it can.
- the fixed heat conductive material layer functions as a heat radiator. Therefore, a heat radiating member can be formed by transferring a heat conductive material layer using the transfer sheet of this invention.
- a method for forming a heat radiation member using such a transfer sheet is typically a method in which the following steps 5, 6, and 7 are performed in this order.
- Step 5 A step of thermocompression bonding the outermost surface of the second adhesive layer constituting the transfer sheet to the article.
- Step 6) A step of removing the release layer constituting the transfer sheet.
- Step 7) A step of thermocompression bonding the outermost surface of the first adhesive layer constituting the transfer sheet to another article.
- Step 5 An outline of the step 5 is shown in FIG.
- the graphite sheet is another heat conductive material layer and the aluminum plate is another article
- the same operation as in this example is performed.
- the open surface of the second adhesive layer constituting the transfer sheet of the present invention is brought into close contact with the aluminum plate and heated while applying an appropriate pressing force from the outer surface of the release layer.
- the second adhesive layer and the aluminum plate are bonded together.
- FIG. 7 shows a state of pressing by the roll (7).
- the arrow attached to the lower side of the roll (7) indicates the reciprocating motion of the roll (7).
- the pressurizing temperature is higher than the softening point of the polyvinyl formal resin, and is a temperature at which the thermal deterioration of the material constituting the pressed transfer sheet is minimized, and is generally 150 to 200 ° C., preferably 155 to 180 ° C. It is.
- Step 6 An outline of the step 6 is shown in FIG. In step 6 described above, the release layer constituting the transfer sheet of the present invention is removed from the first adhesive layer. As a result, one side of the first adhesive layer constituting the transfer sheet of the present invention is in an open state.
- Step 7 The outline of the step 7 is shown in FIG.
- step 7 above another aluminum plate is further stacked on the open surface of the first adhesive layer, and, as in the case of step 5 described above, an appropriate pressure is applied from the outer surface of the newly stacked aluminum plate.
- the first adhesive layer and the aluminum plate are bonded by heating while applying pressure.
- FIG. 9 shows a state of pressing by the roll (7).
- the arrow attached to the lower side of the roll (7) indicates the reciprocating movement of the roll (7).
- the graphite sheet is fixed between the two aluminum plates via the adhesive layer made of polyvinyl formal resin. Since the two aluminum plates, the adhesive layer, and the graphite sheet are integrated and have high thermal conductivity, they integrally function as a heat radiating member.
- FIG. 10 shows a state in which one side of the graphite sheet is bonded to the aluminum plate on which the semiconductor chip is mounted in the step 5, and the other side of the graphite sheet is bonded to a large heat radiator in the step 7.
- the graphite sheet as the heat conductive material layer is firmly fixed between the aluminum plate on which the semiconductor chip is mounted and the large heat sink through the extremely thin first and second adhesive layers.
- a heat radiating member including a new graphite sheet is formed between the aluminum plate and the large heat radiating body.
- a double-sided tape made of acrylic resin or the like is attached to both sides of a graphite sheet, and the outermost surface of the double-sided tape is in close contact with each of an aluminum plate and a large radiator. .
- the thermal conductivity of the double-sided tape portion is low, heat cannot be sufficiently radiated from the semiconductor chip as the heat source.
- Adhesive tape NeoFix5 (thickness: 5 ⁇ m) manufactured by NHI Corporation
- Adhesive tape NeoFix 10 (thickness: 10 ⁇ m) manufactured by Nichiei Kako Co., Ltd.
- the comparative pressure-sensitive adhesive tape is a general member used when adhering a graphite sheet and various electronic devices.
- Step 2 A peelable PET film “Purex A55” was manually pasted on the first adhesive layer formed in Step 1 to form a release layer. On the other hand, the carrier film was removed from the graphite sheet.
- Step 3 A solution of polyvinyl formal resin “Vinyleck K” was applied on the surface of the graphite sheet opened after finishing Step 2 above using a Baker-type applicator, and the solution surface was kept in a thermostatic bath maintained at 90 ° C. Dried. Thus, a second adhesive layer having a thickness of 5 ⁇ m was formed on the graphite sheet.
- Step 4 On the surface of the second adhesive layer formed in the above step 3, a protective layer made of the protective film “FSA-010B” was formed by hand bonding.
- the transfer sheet 1 of the present invention in which the protective layer, the second adhesive layer, the graphite sheet, the first adhesive layer, and the release layer were laminated in this order was obtained.
- the obtained transfer sheet 1 was subjected to the following steps 5, 6, and 7 in this order to produce a heat radiating member.
- Step 5 The protective layer formed in Step 4 was peeled off by hand, and the exposed second adhesive layer and the aluminum plate (A5052) were adhered.
- the aluminum plate, the second adhesive layer, the graphite sheet, the first adhesive layer, and the release layer are all heated to 175 ° C. and pressed from the outer surface of the release layer with a 2 kg heavy roll, and the aluminum plate and the graphite sheet. Were bonded through a second adhesive layer.
- Step 6 The release layer was removed from the transfer sheet after Step 5 above to expose the first adhesive layer.
- Step 7 The first adhesive layer exposed after finishing Step 6 and the aluminum plate (A5052) were adhered to each other.
- the entire aluminum plate, first adhesive layer, graphite sheet, second adhesive layer, and aluminum plate are heated to 175 ° C., and the roll is 2 kg heavy from the outer surface of the aluminum plate in contact with the first adhesive layer.
- the aluminum plate and the graphite sheet were bonded to each other through the first adhesive layer while pressing.
- the heat radiating member 1 in which the aluminum plate, the first adhesive layer, the graphite sheet, the second adhesive layer, and the aluminum plate were laminated in this order was obtained.
- Examples 2 to 9 As shown in Table 1, the transfer sheets 2 to 9 of the present invention were changed by changing the material used in Example 1 or changing the amount of the polyvinyl formal resin applied in Step 1 and Step 3 of Example 1. Manufactured. The transfer sheets 2 to 9 were subjected to Steps 5, 6 and 7 in the same manner as in Example 1 to produce heat radiating members 2 to 9. Table 1 shows the materials and layer structures of the obtained transfer sheets 1 to 9 and heat dissipation members 1 to 9.
- the release layer of the transfer sheet when the release layer of the transfer sheet was peeled off in step 6, the release layer had good peelability. That is, since the adhesive force between the release layer and the first adhesive layer was weak, the release layer and the first adhesive layer could be separated without resistance.
- a heat radiating member can be fixed to a heat generating body by easy operation.
- Comparative heat radiating members 1, 4, and 7 were manufactured without using an adhesive layer. That is, the aluminum plate, graphite sheet, and aluminum plate shown in Table 2 were superposed in this order.
- Comparative heat-radiating members 2, 3, 5, 6, 8, 9 were manufactured using an adhesive tape for the adhesive layer. That is, using the materials shown in Table 2, an aluminum plate, an adhesive tape, a graphite sheet, an adhesive tape, and an aluminum plate were laminated in this order.
- the heat radiating members 1 to 9 of the present invention and the comparative heat radiating members 1 to 9 were evaluated in the following points. The results are shown in Tables 1 and 2.
- the aluminum plate was peeled off from the obtained heat radiating member by hand, and the exposed surface state of the aluminum plate was visually observed. From the observed surface state, the adhesion between the aluminum plate and the graphite sheet was determined according to the following criteria.
- the thermal resistance (Kcm 2 / W) of the obtained heat radiating member was measured using a thermal resistance measuring machine TCM1000 manufactured by RHESCA. At the time of measurement, silicon grease was thinly applied to the aluminum surface of the heat radiating member, and the cartridge and the application surface were rubbed together so that the grease was blended. Grease was thinly applied to the lower surface of the heating block body and the upper surface of the cooling block body, and set in the apparatus. Measurement was performed at a heating block temperature of 100 ° C., a cooling block temperature of 20 ° C., and a load of 100 N.
- the heat dissipating members 1, 5, 8 obtained from the transfer sheets 1, 5, 8 of the present invention are obtained by adhering both surfaces of a graphite sheet to an aluminum plate with an adhesive layer having a thickness of 5 ⁇ m.
- the heat radiating members 2, 5 and 8 for comparison are obtained by bonding both surfaces of a graphite sheet to an aluminum plate with an adhesive tape having a thickness of 5 ⁇ m.
- the thickness of the layer between the graphite sheet and the aluminum plate is the same in the heat radiating members 1, 5, 8 and the comparative heat radiating members 2, 5, 8, but the heat radiating members 1, 5, 8 are the heat radiating members 2, 5,
- the thermal resistance is smaller than 8, and the heat dissipation function is excellent.
- the heat dissipating members 3, 6, and 9 obtained from the transfer sheets 3, 6, and 9 of the present invention are obtained by adhering both surfaces of a graphite sheet to an aluminum plate with an adhesive layer having a thickness of 10 ⁇ m.
- the heat radiating members 3, 6, and 9 for comparison are obtained by bonding both surfaces of a graphite sheet to an aluminum plate with an adhesive tape having a thickness of 10 ⁇ m.
- the thickness of the layer between the graphite sheet and the aluminum plate is the same between the heat radiating members 3, 6, 9 and the comparative heat radiating members 3, 6, 9, but the heat radiating members 3, 6, 9 are the heat radiating members 3, 6, 9
- the thermal resistance is smaller than 9, and the heat dissipation function is excellent.
- the heat dissipating members 2, 4, and 7 obtained from the transfer sheet of the present invention are obtained by adhering both surfaces of a graphite sheet to an aluminum plate with an adhesive layer having a thickness of 1 ⁇ m. Despite the extremely thin adhesive layers of the heat dissipating members 2, 4, and 7, the aluminum plate and the graphite sheet are firmly adhered. In the heat radiating members 2, 4, and 7, a low thermal resistance comparable to that of the comparative heat radiating members 1, 4, and 7 in which the aluminum plate and the graphite sheet are in direct contact is achieved by interposing such an extremely thin adhesive layer. Yes.
- a heat radiating member which is thinner and smaller than the conventional one and which has an excellent heat radiating function can be fixed to the heating element.
- the transfer sheet of the present invention By using the transfer sheet of the present invention, it is possible to attach a smaller and higher performance heat dissipating member to a heating element having an electronic device or an electronic component by a simple process.
- the transfer sheet of the present invention and the method for generating a heat dissipation member using the transfer sheet contribute to the manufacture of smaller and more precise electronic devices.
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Abstract
Description
[1] 剥離性フィルムからなる剥離層、ポリビニルホルマール樹脂を含む第一の接着剤層、炭素材料からなる熱伝導材料層、ポリビニルホルマール樹脂を含む第二の接着剤層がこの順で積層されてなる、転写シート。
(工程1)担体フィルム上に形成された、炭素材料からなる熱伝導材料層の開放した面上に、ポリビニルホルマール樹脂を含む第一の接着剤層を形成する工程。
(工程2)上記第一の接着剤層の開放した面上に剥離性フィルムからなる剥離層を形成すると共に、上記熱伝導材料層から担体フィルムを除去する工程。
(工程3)上記熱伝導材料層の開放した面上にポリビニルホルマール樹脂を含む第二の接着剤層を形成する工程。
(工程5)転写シートを構成する第二の接着剤層の最外面を物品に熱圧着する工程。
(工程6)転写シートを構成する剥離層を除去する工程。
(工程7)転写シートを構成する第一の接着剤層の最外面を他の物品に熱圧着する工程。
本発明の転写シートは発熱部位を有する他の部材に熱伝導材料からなる層を転写するための部材であり、積層体の形態をとる。本発明の転写シート、剥離性フィルムからなる剥離層、ポリビニルホルマール樹脂を含む第一の接着剤層、炭素材料からなる熱伝導材料層、ポリビニルホルマール樹脂を含む第二の接着剤層がこの順で積層した構造(例えば図1に示される構造)を有する。本発明の転写シートにはさらに保護層(例えば図2に示される)が設けられていてもよい。
本発明の転写シートを構成する熱伝導材料層は炭素材料からなる。炭素材料としては、薄層に加工できるものであれば制限なく用いることができる。このような炭素材料としてはグラファイト、グラフェン、カーボンナノチューブなどを使用することができる。これら中でグラファイトが価格や加工性から見て好ましい。グラファイトとしては市販品のグラファイトシートを制限なく使用することができる。また本発明では特開昭61-275117号公報または特開平11-21117号公報に記載の方法で製造したグラファイトも使用することができる。
本発明の転写シートを構成する第一の接着剤層と第二の接着剤層はポリビリルホルマール樹脂からなる。ポリビニルホルマール樹脂は「ビニロン」の総称でも知られている。ポリビニルホルマール樹脂は、ポリビニルアルコールに酸触媒の存在下でホルムアルデヒドを反応させてアセタール化した樹脂である。この反応ではさらにポリビニルアルコールの1,3-ジオール部でホルマール化が起こり、環状の1,3-ジオキサン構造が生成されると共に、少量のヒドロキシル基が未反応のまま残る。
本発明では、第一および/または第二の接着剤層に熱伝導性フィラーを配合してもよい。上記熱伝導性フィラーに制限はないが、一般的には金属粉、金属酸化物粉、金属窒化物粉、金属水酸化物粉、金属酸窒化物粉および金属炭化物粉などの金属または金属化合物含有フィラー、ならびに炭素材料を含むフィラー等が使用される。
本発明の転写シートでは、第一及び/第二の接着剤層に酸化防止剤、シランカップリング剤、エポキシ樹脂などの熱硬化性樹脂、硬化剤、架橋剤、銅害防止剤、金属不活性化剤、防錆剤、粘着性付与剤、老化防止剤、消泡剤、帯電防止剤、耐候剤などの慣用添加剤を配合することもできる。
本発明の転写シートを構成する剥離層としては、剥離性フィルムが制限なく使用される。このような剥離性フィルムとしてはポリエチレンテレフタレート、ポリプロピレン、ポリエステルフィルムなどのプラスチックフィルム、紙、発泡シート、金属箔、およびこれらの材料から選ばれる層からなる積層体などを用いることができる。このような剥離性フィルムとしてはポリエチレンテレフタレートなどのプラスチックフィルムが表面平滑性に優れるため、好ましい。これらの剥離性フィルムの表面に離型剤を塗布することもできる。離型剤としてはシリコン系、フッ素系、長鎖アルキル系もしくは脂肪酸アミド系の離型剤など公知慣用の離型剤を制限なく使用することができる。
本発明の転写シートの第二の接着剤層上に、さらに保護層を設けることができる。この保護層によって本発明の転写シートの第二の接着剤層の耐酸化性を向上させたり、接着性を低下させる傷や損傷を防止したりすることができる。本発明で用いる保護層としては樹脂製フィルムが好ましい。このような樹脂製フィルムとしては、ポリプロピレンやポリエステルなどの耐熱性樹脂からなるフィルムが適しており、中でも自己粘着性ポリプロピレンの延伸フィルムやポリエチレンテレフタレート基材に自己粘着層が積層されたマスキングフィルムが好適である。
以下の工程1、2、3をこの順で行って本発明の転写シートを製造することができる。
(工程1)担体フィルム上に形成された、炭素材料からなる熱伝導材料層の開放した面上に、ポリビニルホルマール樹脂を含む第一の接着剤層を形成する工程。
(工程2)上記第一の接着剤層の開放した面上に剥離性フィルムからなる剥離層を形成すると共に、上記熱伝導材料層から担体フィルムを除去する工程。
(工程3)上記熱伝導材料層の開放した面上にポリビニルホルマール樹脂を含む第二の接着剤層を形成する工程。
(工程4)上記第二の接着剤層の開放した面上に保護層を形成する工程。
[工程1]
上記工程1の概略を図3に示す。上記工程1では、まず、担体フィルム上に熱伝導材料層を重ねる。ここで用いる担体フィルムとしては、熱伝導材料層の表面に第一の接着剤層が形成される間、上記熱伝導材料層が安定して密着するフィルムであれば制限なく使用される。そのような担体フィルムは、本発明の転写シートを構成する剥離層の材料である先述の剥離性フィルムと同じであってよい。ただし、工程1で用いた担体フィルムは、本発明の転写シートの完成前に、すなわち後述の工程2で除去される。
上記工程2の概略を図4に示す。本発明の工程2では、上記工程1で形成した第一の接着剤層の開放した面に剥離性フィルムを密着させることによって剥離層を形成し、上記熱伝導材料層から担体フィルムを除去する。上記工程1で形成した第一の接着剤層の表面に上記剥離性フィルムを貼り合わせる方法としては公知の手段を制限なく使用することができる。工程2で単体フィルムが除去されることによって、剥離層、第一の接着剤層、熱伝導材料層がこの順で積層したシートが得られる。
上記工程3の概略を図5に示す。本発明の工程3では、工程2で得られた、剥離層、第一の接着剤層、熱伝導材料層がこの順で積層したシートにさらに第二の接着剤層が形成される。すなわち工程3では上述の第一の接着剤層の形成方法と同様の方法で、上記熱伝導材料層の開放した面にポリビニルホルマール樹脂を含む第二の接着剤層が形成される。こうして本発明の転写シートが完成する。
上記工程4の概略を図6に示す。本発明の工程4は上記工程3の後に任意に行う工程である。工程4では工程3で形成した第二の接着剤層の外表面に上述の保護層を密着させる。こうして第二の接着剤層上の表面に恒久的に密着するか、あるいは剥離可能な保護層が形成される。こうして保護層を有する本発明の転写シートが完成する。
本発明の転写シートは引張強度、曲げ強度、伸び、弾性、耐衝撃性をバランスよく備えるため、熱伝導材料層を転写しようとする物品の大きさと形状や合わせて様々な形状に切断されて用いられる。本発明の転写シートを用いると、穴あけや高圧処理をすることなく、極薄い第一および第二の接着剤層を介して熱伝導材料層を2種の物品の間に強固に固定することができる。上記物品の少なくとも1つが発熱部を備える場合には、固定された熱伝導材料層が放熱体として機能する。したがって本発明の転写シートを用いて熱伝導材料層を転写することによって放熱部材を形成することができる。
(工程5)転写シートを構成する第二の接着剤層の最外面を物品に熱圧着する工程。
(工程6)転写シートを構成する剥離層を除去する工程。
(工程7)転写シートを構成する第一の接着剤層の最外面を他の物品に熱圧着する工程。
以下、上記工程5、6、7について説明する。
上記工程5の概略を図7に示す。以下、転写シートを用いてグラファイトシートを2枚のアルミニウム板に挿入固定する例を説明する。グラファイトシートが他の熱伝導材料層である場合、アルミニウム板が他の物品である場合も、この例と同様の操作を行う。図7に示されるように、本発明の転写シートを構成する第二の接着剤層の開放した面上をアルミニウム板に密着させ、剥離層の外表面から適度な押圧力を加えながら加熱して、上記第二の接着剤層とアルミニウム板とを接着する。図7ではロール(7)によって押圧する様子を示している。ロール(7)の下側につけた矢印はロール(7)の往復動を示す。加圧温度はポリビニルホルマール樹脂の軟化点より高く、押圧される転写シートを構成する材料の熱劣化が最小限に抑えられる温度であり、一般的には150~200℃、好ましくは155~180℃である。
上記工程6の概略を図8に示す。上記工程6では、本発明の転写シートを構成する剥離層を第一の接着剤層から除去する。その結果、本発明の転写シートを構成する第一の接着剤層の片面が開放した状態となる。
上記工程7の概略を図9に示す。上記工程7では、第一の接着剤層の開放した面上にさらにもう一枚のアルミニウム板を重ね、上述の工程5の例と同様に、新たに重ねたアルミニウム板の外表面から適度な押圧力を加えながら加熱して、上記第一の接着剤層とアルミニウム板とを接着する。図9ではロール(7)によって押圧する様子を示している。ロール(7)の下側につけた矢印はロール(7)の往復移動を示す。こうして2枚のアルミニウム板の間にポリビニルホルマール樹脂からなる接着剤層を介してグラファイトシートが固定される。上記2枚のアルミニウム板と上記接着剤層、上記グラファイトシートは一体で高い熱伝導性を有するから、これらは一体で放熱部材として機能する。
上記工程5においてグラファイトシートの片面と半導体チップを搭載したアルミニウム板とを接着し、上記工程7においてグラファイトシートのもう一方の面を大型の放熱体に接着した状態を、図10に示す。この方法により、極薄い第一及び第二の接着剤層を介して、熱伝導材料層としてのグラファイトシートを、半導体チップを搭載したアルミニウム板と大型の放熱体との間に強固に固定することができる。その結果、上記アルミニウム板と大型の放熱体との間に新たなグラファイトシートを含む放熱部材が形成される。
本発明の転写シート及び比較用積層シートの各層には以下の材料を用いた。
・帝人デュポン株式会社製 剥離性ポリエチレンテレフタレート(PET)フィルム商品「ピューレックスA55」(表1には「A55」と表示する)
(接着剤層)
・JNC株式会社製 ポリビニルホルマール樹脂商品「ビニレックK」。構成単位A,B、Cの合計に対して構成単位Aを81.1重量%、構成単位Bを11.0重量%、構成単位Cを7.9重量%含有する。重量平均分子量45,000。
・和光純薬工業株式会社製 N-メチルピロリドン(溶剤)
・(比較用)日栄化工株式会社製粘着テープ NeoFix5(厚み:5μm)
・(比較用)日栄化工株式会社製粘着テープ NeoFix10(厚み:10μm)
なお上記比較用粘着テープはグラファイトシートと各種電子機器とを接着する際に用いられる一般的な部材である。
・GrafTECH International製グラファイトシート商品「SS1500」(厚み:25μm)
・GrafTECH International製グラファイトシート商品「HT1205」(厚み:127μm)
・GrafTECH International製グラファイトシート商品「SS500」(厚み:76μm)
(保護層)
・フタムラ化学株式会社製 自己粘着二軸延伸ポリプロピレンフィルム商品「FSA-010B」(表1の「FSA」)
(アルミニウム板)
・耐食アルミニウム板A5052(厚み:0.4mm)
[実施例1]
以下の工程1、2、3、4をこの順に行って本発明の転写シートを製造した。
(工程1)担体フィルム「ピューレックスA55」上にグラファイトシート「SS1500」を重ねた。このグラファイトシートの開放した面上にポリビニルホルマール樹脂「ビニレックK」の溶液をベーカー式アプリケーターによって塗布し、温度が90℃に保たれた恒温槽内で溶液面を乾燥した。こうしてグラファイトシート上に厚さ5μmの第一の接着剤層が形成された。
表1に示すように、実施例1で用いた材料を変更して、あるいは実施例1の工程1、工程3で塗布したポリビニルホルマール樹脂の量を変更して、本発明の転写シート2~9を製造した。この転写シート2~9について実施例1と同様に工程5、6、7を行って放熱部材2~9を製造した。得られた転写シート1~9、放熱部材1~9の材料、層構造を表1に示す。
[比較例1、4、7]
接着剤層を用いずに比較用放熱部材1、4、7を製造した。すなわち表2に示すアルミニウム板、グラファイトシート、アルミニウム板をこの順で重ね合わせた。
接着剤層に粘着テープを使用して比較用放熱部材2、3、5、6、8、9を製造した。すなわち表2に示す材料を用いて、アルミニウム板、粘着テープ、グラファイトシート、粘着テープ、アルミニウム板をこの順で積層した。
得られた放熱部材からアルミニウム板を手で剥がし、露出したアルミニウム板の表面状態を目視観察した。観察された表面状態からアルミニウム板とグラファイトシートの密着性を以下の基準で判定した。
RHESCA社製熱抵抗測定機TCM1000を用いて、得られた放熱部材の熱抵抗(Kcm2/W)を測定した。測定に際して、放熱部材のアルミ表面にシリコングリースを薄く塗布し、カートリッジと塗布面を摺り合わせてグリスをなじませ、接触面でのボイド発生を抑えながら、カートリッジと塗布面とを密着させた。加熱ブロック体下面、冷却ブロック体上面にグリスを薄く塗布し、装置にセットした。加熱ブロック温度100℃、冷却ブロック温度20℃、100N荷重で測定した。
2:第一の接着剤層
3:熱伝導材料層
4:第二の接着剤層
5:保護層
6:担体フィルム
7:ロール
8:アルミニウム板
9:半導体チップ
10:アルミニウム板
11:グラファイトシート
12:大型の放熱体
13:ボルト
14:両面テープ
Claims (10)
- 剥離性フィルムからなる剥離層、ポリビニルホルマール樹脂を含む第一の接着剤層、炭素材料からなる熱伝導材料層、ポリビニルホルマール樹脂を含む第二の接着剤層がこの順で積層されてなる、転写シート。
- 上記ポリビニルホルマール樹脂において上記構成単位A、B、Cがランダムに結合し、上記構成単位A、B、Cの合計を基準として構成単位Aの含有割合が80~82重量%、構成単位Bの含有割合が9~13重量%、構成単位Cの含有割合が5~7重量%である、請求項2に記載の転写シート。
- 上記ポリビニルホルマール樹脂の重量平均分子量が30,000~150,000の範囲にある、請求項3に記載の転写シート。
- 熱伝導材料層がグラファイト、グラフェン、カーボンナノチューブから選ばれる炭素材料からなる、請求項1~4のいずれか1項に記載の転写シート。
- 第一および第二の接着剤層のそれぞれの厚みが1~20μmの範囲にある、請求項1~5のいずれか1項に記載の転写シート。
- 以下の工程1、2、3をこの順で行う、請求項1~6のいずれか1項に記載の転写シートの製造方法。
(工程1)担体フィルム上に形成された、炭素材料からなる熱伝導材料層の開放した面上に、ポリビニルホルマール樹脂を含む第一の接着剤層を形成する工程。
(工程2)上記第一の接着剤層の開放した面上に剥離性フィルムからなる剥離層を形成すると共に、上記熱伝導材料層から担体フィルムを除去する工程。
(工程3)上記熱伝導材料層の開放した面上にポリビニルホルマール樹脂を含む第二の接着剤層を形成する工程。 - さらに工程3の後に以下の工程4を行う、請求項7に記載の転写シートの製造方法。
(工程4)上記第二の接着剤層の開放した面に保護層を形成する工程。 - 以下の工程5、6、7をこの順で行う、請求項1~6のいずれか1項に記載の転写シートを用いた放熱部材の形成方法。
(工程5)転写シートを構成する第二の接着剤層の最外面を物品に熱圧着する工程。
(工程6)転写シートを構成する剥離層を除去する工程。
(工程7)転写シートを構成する第一の接着剤層の最外面を他の物品に熱圧着する工程。 - 上記物品の少なくとも1つが熱源としての電子部品を備える、請求項9に記載の放熱部材の形成方法。
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WO2016114317A1 (ja) * | 2015-01-16 | 2016-07-21 | Jnc株式会社 | 接着層形成用の組成物、接着層、接着層の製造方法、複合材、シート、放熱部材、電子デバイス、バッテリー、キャパシタ、自動車用部品および機械機構部品 |
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EP3831595A1 (en) | 2019-12-05 | 2021-06-09 | Fujitsu Limited | Heat dissipation sheet and method of manufacturing heat dissipation sheet |
EP4213201A4 (en) * | 2020-10-16 | 2024-03-06 | Resonac Corp | THERMALLY CONDUCTIVE SHEET SUPPORT AND METHOD FOR MANUFACTURING HEAT DISSIPATION DEVICE |
WO2023048258A1 (ja) * | 2021-09-24 | 2023-03-30 | 積水化学工業株式会社 | 炭素繊維強化複合材料及び炭素繊維強化複合材料の製造方法 |
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TW201825627A (zh) | 2018-07-16 |
KR20190094190A (ko) | 2019-08-12 |
US20200095472A1 (en) | 2020-03-26 |
CN110072958A (zh) | 2019-07-30 |
JPWO2018110255A1 (ja) | 2019-10-24 |
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