CN106987213A - 高致密散热用双面贴膜 - Google Patents

高致密散热用双面贴膜 Download PDF

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CN106987213A
CN106987213A CN201710052642.XA CN201710052642A CN106987213A CN 106987213 A CN106987213 A CN 106987213A CN 201710052642 A CN201710052642 A CN 201710052642A CN 106987213 A CN106987213 A CN 106987213A
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金闯
梁豪
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Jiangsu Stick New Materials Polytron Technologies Inc
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Abstract

本发明公开一种高致密散热用双面贴膜，其离型材料层贴合于导热胶粘层与石墨层相背的表面；石墨层通过以下工艺方法获得：在聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜，所述石墨改性剂的粘度为30000~48000CP；将处理后的聚酰亚胺薄膜从室温升至1180~1250℃后冷却，从而获得预烧制的碳化膜；采用压延机压延所述步骤四的预烧制的碳化膜；升温至2850~2950℃从而获得主烧制的石墨膜；然后步骤四所得的主烧制的石墨膜进行压延从而获得所述石墨层。本发明避免了褶皱和石墨化烧结过程中的体积收缩，提高了致密性和结晶度，进一步提高了在垂直方向和水平方向的导热性能。

Description

高致密散热用双面贴膜
技术领域
本发明涉及一种高致密散热用双面贴膜，属于石墨片技术领域。
背景技术
随着现代微电子技术高速发展，电子设备（如笔记本电脑、手机、平板电脑等）日益变得超薄、轻便，这种结构使得电子设备内部功率密度明显提高，运行中所产生的热量不易排出、易于迅速积累而形成高温。另一方面，高温会降低电子设备的性能、可靠性和使用寿命。因此，当前电子行业对于作为热控系统核心部件的散热材料提出越来越高的要求，迫切需要一种高效导热、轻便的材料迅速将热量传递出去，保障电子设备正常运行。
现有技术中聚酰亚胺薄膜大多用于柔性电路板，虽然有采用聚酰亚胺薄膜烧结获得石墨散热片，从而贴覆在热源上，但是受限于聚酰亚胺薄膜的产品质量和性能的良莠不齐，影响到了散热双面贴膜散热性能的发挥，存在以下技术问题：散热不均匀，易出现胶带局部过热，提高了产品的散热性能不稳定、可靠性性能差，不利于产品质量管控，影响产品的竞争力。
发明内容
本发明发明目的是提供一种高致密散热用双面贴膜，该高致密散热用双面贴膜在垂直方向和水平方向均提高了导热性能，避免局部过热，实现了导热性能的均匀性的同时，提高了产品的散热性能稳定性、可靠性，大大降低了产品的成本。
为达到上述发明目的，本发明采用的技术方案是：一种高致密散热用双面贴膜，所述高致密散热用双面贴膜贴合于发热部件表面，所述高致密散热用双面贴膜包括石墨层、位于石墨层表面的导热胶粘层和离型材料层，此离型材料层贴合于导热胶粘层与石墨层相背的表面；所述石墨层通过以下工艺方法获得，此工艺方法包括以下步骤：
步骤一、在聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜，所述石墨改性剂的粘度为30000~48000CP；
所述石墨改性剂由以下重量份的组分组成：二苯甲酮四酸二酐21份、均苯四甲酸二酐14份、二氨基二苯甲烷20份、二甲基甲酰胺23份、N-甲基吡咯烷酮8份、乙二醇2.5份、聚二甲基硅氧烷3份；
步骤二、 将处理后的聚酰亚胺薄膜从室温升至240~260℃，保温后升温至480~520℃，保温后升温至790~810℃，再升温至1180~1250℃后冷却，从而获得预烧制的碳化膜；
步骤三、采用压延机压延所述步骤四的预烧制的碳化膜；
步骤四、升温至2350~2450℃，保温后升温至2850~2950℃，保温后冷却，从而获得主烧制的石墨膜；
步骤五、然后步骤四所得的主烧制的石墨膜进行压延从而获得所述石墨层。
上述技术方案中进一步改进的方案如下：
1、上述方案中，所述石墨层通过以下工艺方法获得，此工艺方法包括以下步骤：
步骤一、在聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜；
步骤二、 将处理后的聚酰亚胺薄膜在惰性气体保护下，以4~6度/min速度从室温升至250℃，保持0.9~1.1小时，然后以2.5~3.5度/min，升至500℃，保持1小时；然后以4~6度/min的速度升至800℃，保持0.9~1.1小时；再以9~11度/min的速度升至1200℃，保存0.9~1.1小时后冷却，从而获得预烧制的碳化膜；
步骤三、采用压延机压延所述步骤四的预烧制的碳化膜；
步骤四、以19~21度/min的速度升至2400℃，保持0.9~1.1小时，再以19~21度/min的速度升至2900℃，保持1.8~2.2小时后冷却，从而获得主烧制的石墨膜；
步骤五、然后步骤四所得的主烧制的石墨膜进行压延从而获得所述石墨层。
2、上述方案中，将所述步骤四获得石墨层进行压延处理。
由于上述技术方案运用，本发明与现有技术相比具有下列优点和效果：
1、本发明高致密散热用双面贴膜，其结构中石墨层由上、下表面均涂覆一层石墨改性剂的聚酰亚胺薄膜制备而成，提高了在垂直方向和水平方向的导热性能，避免胶带局部过热，实现了胶带导热性能的均匀性；其次，其位于聚酰亚胺薄膜表面的石墨改性剂由二苯甲酮四酸二酐、均苯四甲酸二酐、二氨基二苯甲烷、二甲基甲酰胺、乙二醇、聚二甲基硅氧烷组成，涂覆于聚酰亚胺薄膜上，填充了加热过程中的针孔，提高了结晶度同时，也克服了热收缩过大导致的不均匀，提高了石墨层双向拉伸性能。
2、本发明高致密散热用双面贴膜，其位于聚酰亚胺薄膜表面的石墨改性剂由二苯甲酮四酸二酐、均苯四甲酸二酐、二氨基二苯甲烷、二甲基甲酰胺、N-甲基吡咯烷酮、乙二醇、聚二甲基硅氧烷组成，采用二甲基甲酰胺、N-甲基吡咯烷酮降低了共沸点并且平滑的沸点区，改善了最终产品成膜的平坦性和柔韧性；其次，聚酰亚胺薄膜表面具有石墨改性剂，改善了双面贴膜中石墨层与导热胶粘层导热性能。
3、本发明高致密散热用双面贴膜，在预烧制的碳化膜和石墨化之间增加压延步骤，以及再形成导热石墨贴片后再次压延，避免了褶皱和石墨化烧结过程中的体积收缩，提高了致密性和结晶度，进一步提高了在垂直方向和水平方向的导热性能。
具体实施方式
下面结合实施例对本发明作进一步描述：
实施例：一种高致密散热用双面贴膜，所述高致密散热用双面贴膜贴合于发热部件表面，所述高致密散热用双面贴膜包括石墨层、位于石墨层表面的导热胶粘层和离型材料层，此离型材料层贴合于导热胶粘层与石墨层相背的表面；所述石墨层通过以下工艺方法获得，此工艺方法包括以下步骤：
步骤一、在聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜，所述石墨改性剂的粘度为30000~48000CP；
所述石墨改性剂由以下重量份的组分组成：二苯甲酮四酸二酐21份、均苯四甲酸二酐14份、二氨基二苯甲烷20份、二甲基甲酰胺23份、N-甲基吡咯烷酮8份、乙二醇2.5份、聚二甲基硅氧烷3份；
实施例的石墨改性剂的粘度为45000CP。
步骤二、 将处理后的聚酰亚胺薄膜在惰性气体保护下，以4~6度/min速度从室温升至250℃，保持0.9~1.1小时，然后以2.5~3.5度/min，升至500℃，保持1小时；然后以4~6度/min的速度升至800℃，保持0.9~1.1小时；再以9~11度/min的速度升至1200℃，保存0.9~1.1小时后冷却，从而获得预烧制的碳化膜；
步骤三、采用压延机压延所述步骤四的预烧制的碳化膜；
步骤四、以19~21度/min的速度升至2400℃，保持0.9~1.1小时，再以19~21度/min的速度升至2900℃，保持1.8~2.2小时后冷却，从而获得主烧制的石墨膜；
步骤五、然后步骤四所得的主烧制的石墨膜进行压延从而获得所述石墨层2。
将所述步骤五获得石墨膜进行压延处理。
采用上述高致密散热用双面贴膜时，其结构中石墨层由上、下表面均涂覆一层石墨改性剂的聚酰亚胺薄膜制备而成，提高了在垂直方向和水平方向的导热性能，避免胶带局部过热，实现了胶带导热性能的均匀性；其次，其位于聚酰亚胺薄膜表面的石墨改性剂由二苯甲酮四酸二酐、均苯四甲酸二酐、二氨基二苯甲烷、二甲基甲酰胺、乙二醇、聚二甲基硅氧烷组成，涂覆于聚酰亚胺薄膜上，填充了加热过程中的针孔，提高了结晶度同时，也克服了热收缩过大导致的不均匀，提高了石墨层双向拉伸性能，也降低了共沸点并且平滑的沸点区，改善了最终产品成膜的平坦性和柔韧性；再次，聚酰亚胺薄膜表面具有石墨改性剂，改善了双面贴膜中石墨层与导热胶粘层导热性能，且采用压延机压延所述预烧制的碳化膜，避免了褶皱和石墨化烧结过程中的体积收缩，提高了致密性和结晶度，进一步提高了在垂直方向和水平方向的导热性能。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (3)

1.一种高致密散热用双面贴膜，所述高致密散热用双面贴膜贴合于发热部件表面，所述高致密散热用双面贴膜包括石墨层、位于石墨层表面的导热胶粘层和离型材料层，此离型材料层贴合于导热胶粘层与石墨层相背的表面；其特征在于：所述石墨层通过以下工艺方法获得，此工艺方法包括以下步骤：
步骤一、在聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜，所述石墨改性剂的粘度为30000~48000CP；
所述石墨改性剂由以下重量份的组分组成：二苯甲酮四酸二酐21份、均苯四甲酸二酐14份、二氨基二苯甲烷20份、二甲基甲酰胺23份、N-甲基吡咯烷酮8份、乙二醇2.5份、聚二甲基硅氧烷3份；
步骤二、 将处理后的聚酰亚胺薄膜从室温升至240~260℃，保温后升温至480~520℃，保温后升温至790~810℃，再升温至1180~1250℃后冷却，从而获得预烧制的碳化膜；
步骤三、采用压延机压延所述步骤四的预烧制的碳化膜；
步骤四、升温至2350~2450℃，保温后升温至2850~2950℃，保温后冷却，从而获得主烧制的石墨膜；
步骤五、然后步骤四所得的主烧制的石墨膜进行压延从而获得所述石墨层4。
2.根据权利要求1所述的高致密散热用双面贴膜，其特征在于：所述石墨层通过以下工艺方法获得，此工艺方法包括以下步骤：
步骤一、在聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜；
步骤二、 将处理后的聚酰亚胺薄膜在惰性气体保护下，以4~6度/min速度从室温升至250℃，保持0.9~1.1小时，然后以2.5~3.5度/min，升至500℃，保持1小时；然后以4~6度/min的速度升至800℃，保持0.9~1.1小时；再以9~11度/min的速度升至1200℃，保存0.9~1.1小时后冷却，从而获得预烧制的碳化膜；
步骤三、采用压延机压延所述步骤四的预烧制的碳化膜；
步骤四、以19~21度/min的速度升至2400℃，保持0.9~1.1小时，再以19~21度/min的速度升至2900℃，保持1.8~2.2小时后冷却，从而获得主烧制的石墨膜；
步骤五、然后步骤四所得的主烧制的石墨膜进行压延从而获得所述石墨层。
3.根据权利要求1所述的高致密散热用双面贴膜，其特征在于：将所述步骤五获得石墨层进行压延处理。
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