KR20070065379A - 도전성 잉크 - Google Patents

도전성 잉크 Download PDF

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Publication number
KR20070065379A
KR20070065379A KR1020077008595A KR20077008595A KR20070065379A KR 20070065379 A KR20070065379 A KR 20070065379A KR 1020077008595 A KR1020077008595 A KR 1020077008595A KR 20077008595 A KR20077008595 A KR 20077008595A KR 20070065379 A KR20070065379 A KR 20070065379A
Authority
KR
South Korea
Prior art keywords
powder
conductive ink
nickel
ink
surface tension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077008595A
Other languages
English (en)
Korean (ko)
Inventor
요이치 카미코리야먀
스미카주 오가타
케이 아나이
히로키 사와모토
Original Assignee
미쓰이 긴조꾸 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이 긴조꾸 고교 가부시키가이샤 filed Critical 미쓰이 긴조꾸 고교 가부시키가이샤
Publication of KR20070065379A publication Critical patent/KR20070065379A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
KR1020077008595A 2004-10-08 2005-10-07 도전성 잉크 Withdrawn KR20070065379A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00296987 2004-10-08
JP2004296987 2004-10-08
JPJP-P-2004-00303863 2004-10-19
JP2004303863 2004-10-19

Publications (1)

Publication Number Publication Date
KR20070065379A true KR20070065379A (ko) 2007-06-22

Family

ID=36148324

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077008595A Withdrawn KR20070065379A (ko) 2004-10-08 2005-10-07 도전성 잉크

Country Status (8)

Country Link
US (1) US20090293766A1 (https=)
EP (1) EP1835512B1 (https=)
JP (1) JPWO2006041030A1 (https=)
KR (1) KR20070065379A (https=)
AT (1) ATE467895T1 (https=)
DE (1) DE602005021251D1 (https=)
TW (2) TW200621914A (https=)
WO (1) WO2006041030A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190082852A (ko) * 2016-11-08 2019-07-10 도와 일렉트로닉스 가부시키가이샤 은 입자 분산액 및 그의 제조 방법 그리고 그 은 입자 분산액을 사용한 도전막의 제조 방법
KR20240084317A (ko) * 2022-12-06 2024-06-13 주식회사 티엘비 인쇄회로기판의 제조방법
KR20240084333A (ko) * 2022-12-06 2024-06-13 주식회사 티엘비 인쇄회로기판의 제조방법

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JP2007257869A (ja) * 2006-03-20 2007-10-04 Mitsui Mining & Smelting Co Ltd 導電性インキ
JP5065613B2 (ja) * 2006-04-10 2012-11-07 三井金属鉱業株式会社 ニッケルインク
KR100768706B1 (ko) * 2006-06-08 2007-10-19 삼성전기주식회사 잉크젯용 금속 잉크 조성물
KR100777662B1 (ko) * 2006-06-14 2007-11-29 삼성전기주식회사 잉크젯용 전도성 잉크 조성물
CN101501864B (zh) * 2006-06-19 2012-08-08 卡伯特公司 光伏导电部件及其形成方法
US20100096647A1 (en) * 2007-04-03 2010-04-22 Koninklijke Philips Electronics N.V. Light output device
JP2009096962A (ja) * 2007-10-19 2009-05-07 Jsr Corp インクジェット印刷用インクおよび電極の製造方法
JP2009227825A (ja) * 2008-03-24 2009-10-08 Jsr Corp インクジェット印刷用インク、およびこれを用いたフラットパネルディスプレイ用電極の製造方法
WO2009051200A1 (ja) * 2007-10-19 2009-04-23 Jsr Corporation インクジェット印刷用インクおよび電極の製造方法
JP5024014B2 (ja) * 2007-12-10 2012-09-12 セイコーエプソン株式会社 導体パターン形成用インク、導体パターンおよび配線基板
JP2011529125A (ja) * 2008-07-25 2011-12-01 メソード・エレクトロニクス・インコーポレーテッド 金属ナノ粒子のインク組成物
TW201114876A (en) * 2009-10-29 2011-05-01 Giga Solar Materials Corp Conductive paste with surfactants
CN101818008B (zh) * 2010-03-19 2012-05-23 西安理工大学 一种用于刮开式票据的银浆油墨及其制备方法
KR101803956B1 (ko) * 2010-05-06 2017-12-01 주식회사 동진쎄미켐 대기압에서 소성 가능한 구리 나노입자의 제조방법
CN101935480A (zh) * 2010-09-29 2011-01-05 彩虹集团公司 一种导电油墨及其制备方法
JP5576843B2 (ja) * 2010-12-15 2014-08-20 日本特殊陶業株式会社 導体パターン印刷用インク
JP5304812B2 (ja) * 2011-02-16 2013-10-02 信越化学工業株式会社 導電性パターン形成用組成物及び導電性パターンの形成方法
JP5624915B2 (ja) * 2011-03-03 2014-11-12 株式会社アルバック 金属ナノ粒子分散液
JP5857766B2 (ja) 2012-02-01 2016-02-10 セイコーエプソン株式会社 紫外線硬化型インクジェット用組成物および記録物
JP2015110683A (ja) * 2012-03-22 2015-06-18 旭硝子株式会社 導電インク、導体付き基材及び導体付き基材の製造方法
KR101765706B1 (ko) * 2012-05-18 2017-08-07 가부시키가이샤 무라타 세이사쿠쇼 잉크젯용 잉크, 인쇄방법 및 세라믹 전자부품
US9305854B2 (en) 2012-08-21 2016-04-05 Stats Chippac, Ltd. Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package
US9331007B2 (en) 2012-10-16 2016-05-03 Stats Chippac, Ltd. Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages
CN104870578B (zh) 2012-12-28 2021-01-12 印制能源技术有限公司 导电墨水及其制造方法
US9799421B2 (en) 2013-06-07 2017-10-24 Heraeus Precious Metals North America Conshohocken Llc Thick print copper pastes for aluminum nitride substrates
EP2822000B1 (en) * 2013-07-03 2020-10-21 Heraeus Precious Metals North America Conshohocken LLC Thick print copper pastes for aluminium nitride substrates
KR101716549B1 (ko) * 2014-11-19 2017-03-15 삼성에스디아이 주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
US10636540B2 (en) 2015-03-27 2020-04-28 Heraeus Deutschland GmbH & Co. KG Electro-conductive pastes comprising an oxide additive
EP3076401A1 (en) 2015-03-27 2016-10-05 Heraeus Deutschland GmbH & Co. KG Electro-conductive pastes comprising a metal compound
EP3374194B1 (en) * 2015-11-13 2019-08-14 Exatec, LLC. Methods of printing with conductive paste
JPWO2017094166A1 (ja) * 2015-12-03 2018-09-20 ハリマ化成株式会社 導電性ペーストの製造方法
KR102609024B1 (ko) 2017-03-01 2023-12-04 비아비 솔루션즈 아이엔씨. 안료를 제조하는 방법
CN107148154A (zh) * 2017-07-12 2017-09-08 江南大学 一种基于喷墨打印的导电线路印刷工艺
US10843262B2 (en) * 2018-08-02 2020-11-24 Xerox Corporation Compositions comprising eutectic metal alloy nanoparticles
JP7655311B2 (ja) * 2020-04-13 2025-04-02 昭栄化学工業株式会社 Ｎｉペーストおよび積層セラミックコンデンサ
JP7834502B2 (ja) * 2022-02-22 2026-03-24 ノリタケ株式会社 導電性インクジェットインク
WO2025154696A1 (ja) * 2024-01-18 2025-07-24 富士フイルム株式会社 積層体、積層体の製造方法

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Publication number Priority date Publication date Assignee Title
JP3911928B2 (ja) * 1999-10-19 2007-05-09 コニカミノルタホールディングス株式会社 インクジェット記録ヘッド用保存液
JP2002356602A (ja) * 2000-07-28 2002-12-13 Sekisui Chem Co Ltd 着色樹脂エマルジョン、インクジェット印刷用インク、電着液及びカラーフィルター
JP2002109957A (ja) * 2000-09-29 2002-04-12 Jsr Corp 導電性ペースト組成物
TW522062B (en) * 2001-02-15 2003-03-01 Mitsui Mining & Smelting Co Aqueous nickel slurry, method for preparing the same and conductive paste
US7566360B2 (en) * 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
JP2005531679A (ja) * 2002-07-03 2005-10-20 ナノパウダーズ インダストリーズ リミテッド 低温焼結導電性ナノインク及びその製造方法
JP4334204B2 (ja) * 2002-11-21 2009-09-30 メルク株式会社 高輝度高彩度虹彩顔料およびその製造方法
JP2004256757A (ja) * 2003-02-27 2004-09-16 Asahi Glass Co Ltd インクジェットプリンタ用の導電性インクおよび製造方法
JP2004277507A (ja) * 2003-03-13 2004-10-07 Jsr Corp 顔料内包ポリマー粒子の水系分散体とその製造方法および水系インク

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190082852A (ko) * 2016-11-08 2019-07-10 도와 일렉트로닉스 가부시키가이샤 은 입자 분산액 및 그의 제조 방법 그리고 그 은 입자 분산액을 사용한 도전막의 제조 방법
KR20240084317A (ko) * 2022-12-06 2024-06-13 주식회사 티엘비 인쇄회로기판의 제조방법
KR20240084333A (ko) * 2022-12-06 2024-06-13 주식회사 티엘비 인쇄회로기판의 제조방법

Also Published As

Publication number Publication date
EP1835512B1 (en) 2010-05-12
EP1835512A1 (en) 2007-09-19
ATE467895T1 (de) 2010-05-15
TWI308347B (https=) 2009-04-01
TWI308172B (https=) 2009-04-01
EP1835512A4 (en) 2008-02-20
TW200902647A (en) 2009-01-16
JPWO2006041030A1 (ja) 2008-05-15
WO2006041030A1 (ja) 2006-04-20
US20090293766A1 (en) 2009-12-03
DE602005021251D1 (de) 2010-06-24
TW200621914A (en) 2006-07-01

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