DE602005021251D1 - Leitfähige tinte - Google Patents

Leitfähige tinte

Info

Publication number
DE602005021251D1
DE602005021251D1 DE602005021251T DE602005021251T DE602005021251D1 DE 602005021251 D1 DE602005021251 D1 DE 602005021251D1 DE 602005021251 T DE602005021251 T DE 602005021251T DE 602005021251 T DE602005021251 T DE 602005021251T DE 602005021251 D1 DE602005021251 D1 DE 602005021251D1
Authority
DE
Germany
Prior art keywords
coupling agent
ink
conductive ink
conductive
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005021251T
Other languages
English (en)
Inventor
Yoichi Kamikoriyama
Sumikazu Ogata
Kei Anai
Hiroki Sawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of DE602005021251D1 publication Critical patent/DE602005021251D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
DE602005021251T 2004-10-08 2005-10-07 Leitfähige tinte Active DE602005021251D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004296987 2004-10-08
JP2004303863 2004-10-19
PCT/JP2005/018631 WO2006041030A1 (ja) 2004-10-08 2005-10-07 導電性インク

Publications (1)

Publication Number Publication Date
DE602005021251D1 true DE602005021251D1 (de) 2010-06-24

Family

ID=36148324

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005021251T Active DE602005021251D1 (de) 2004-10-08 2005-10-07 Leitfähige tinte

Country Status (8)

Country Link
US (1) US20090293766A1 (de)
EP (1) EP1835512B1 (de)
JP (1) JPWO2006041030A1 (de)
KR (1) KR20070065379A (de)
AT (1) ATE467895T1 (de)
DE (1) DE602005021251D1 (de)
TW (2) TW200902647A (de)
WO (1) WO2006041030A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007257869A (ja) * 2006-03-20 2007-10-04 Mitsui Mining & Smelting Co Ltd 導電性インキ
JP5065613B2 (ja) * 2006-04-10 2012-11-07 三井金属鉱業株式会社 ニッケルインク
KR100768706B1 (ko) * 2006-06-08 2007-10-19 삼성전기주식회사 잉크젯용 금속 잉크 조성물
KR100777662B1 (ko) * 2006-06-14 2007-11-29 삼성전기주식회사 잉크젯용 전도성 잉크 조성물
WO2007149881A2 (en) * 2006-06-19 2007-12-27 Cabot Corporation Metal-containing nanoparticles, their synthesis and use
EP2142841A1 (de) * 2007-04-03 2010-01-13 Koninklijke Philips Electronics N.V. Lichtausgabevorrichtung
WO2009051200A1 (ja) * 2007-10-19 2009-04-23 Jsr Corporation インクジェット印刷用インクおよび電極の製造方法
JP2009227825A (ja) * 2008-03-24 2009-10-08 Jsr Corp インクジェット印刷用インク、およびこれを用いたフラットパネルディスプレイ用電極の製造方法
JP2009096962A (ja) * 2007-10-19 2009-05-07 Jsr Corp インクジェット印刷用インクおよび電極の製造方法
JP5024014B2 (ja) * 2007-12-10 2012-09-12 セイコーエプソン株式会社 導体パターン形成用インク、導体パターンおよび配線基板
JP2011529125A (ja) * 2008-07-25 2011-12-01 メソード・エレクトロニクス・インコーポレーテッド 金属ナノ粒子のインク組成物
TW201114876A (en) * 2009-10-29 2011-05-01 Giga Solar Materials Corp Conductive paste with surfactants
CN101818008B (zh) * 2010-03-19 2012-05-23 西安理工大学 一种用于刮开式票据的银浆油墨及其制备方法
KR101803956B1 (ko) * 2010-05-06 2017-12-01 주식회사 동진쎄미켐 대기압에서 소성 가능한 구리 나노입자의 제조방법
CN101935480A (zh) * 2010-09-29 2011-01-05 彩虹集团公司 一种导电油墨及其制备方法
JP5576843B2 (ja) * 2010-12-15 2014-08-20 日本特殊陶業株式会社 導体パターン印刷用インク
JP5304812B2 (ja) * 2011-02-16 2013-10-02 信越化学工業株式会社 導電性パターン形成用組成物及び導電性パターンの形成方法
JP5624915B2 (ja) * 2011-03-03 2014-11-12 株式会社アルバック 金属ナノ粒子分散液
JP5857766B2 (ja) 2012-02-01 2016-02-10 セイコーエプソン株式会社 紫外線硬化型インクジェット用組成物および記録物
JP2015110683A (ja) * 2012-03-22 2015-06-18 旭硝子株式会社 導電インク、導体付き基材及び導体付き基材の製造方法
KR101765706B1 (ko) * 2012-05-18 2017-08-07 가부시키가이샤 무라타 세이사쿠쇼 잉크젯용 잉크, 인쇄방법 및 세라믹 전자부품
US9305854B2 (en) 2012-08-21 2016-04-05 Stats Chippac, Ltd. Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package
US9331007B2 (en) 2012-10-16 2016-05-03 Stats Chippac, Ltd. Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages
CN104870578B (zh) 2012-12-28 2021-01-12 印制能源技术有限公司 导电墨水及其制造方法
US9799421B2 (en) 2013-06-07 2017-10-24 Heraeus Precious Metals North America Conshohocken Llc Thick print copper pastes for aluminum nitride substrates
EP2822000B1 (de) * 2013-07-03 2020-10-21 Heraeus Precious Metals North America Conshohocken LLC Dicke Kupferdruckpasten für Aluminiumnitridsubstrate
KR101716549B1 (ko) * 2014-11-19 2017-03-15 삼성에스디아이 주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
US10056508B2 (en) 2015-03-27 2018-08-21 Heraeus Deutschland GmbH & Co. KG Electro-conductive pastes comprising a metal compound
US10636540B2 (en) 2015-03-27 2020-04-28 Heraeus Deutschland GmbH & Co. KG Electro-conductive pastes comprising an oxide additive
KR20180082503A (ko) * 2015-11-13 2018-07-18 엑사테크 엘.엘.씨. 전도성 페이스트 및 이의 프린팅 방법
JPWO2017094166A1 (ja) * 2015-12-03 2018-09-20 ハリマ化成株式会社 導電性ペーストの製造方法
US11081253B2 (en) * 2016-11-08 2021-08-03 Dowa Electronics Materials Co., Ltd. Silver particle dispersing solution, method for producing same, and method for producing conductive film using silver particle dispersing solution
CA3053943C (en) * 2017-03-01 2022-04-12 Viavi Solutions Inc. Lamellar particles and methods of manufacture
CN107148154A (zh) * 2017-07-12 2017-09-08 江南大学 一种基于喷墨打印的导电线路印刷工艺
US10843262B2 (en) * 2018-08-02 2020-11-24 Xerox Corporation Compositions comprising eutectic metal alloy nanoparticles
WO2021210455A1 (ja) * 2020-04-13 2021-10-21 昭栄化学工業株式会社 Ｎｉペーストおよび積層セラミックコンデンサ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3911928B2 (ja) * 1999-10-19 2007-05-09 コニカミノルタホールディングス株式会社 インクジェット記録ヘッド用保存液
JP2002356602A (ja) * 2000-07-28 2002-12-13 Sekisui Chem Co Ltd 着色樹脂エマルジョン、インクジェット印刷用インク、電着液及びカラーフィルター
JP2002109957A (ja) * 2000-09-29 2002-04-12 Jsr Corp 導電性ペースト組成物
TW522062B (en) * 2001-02-15 2003-03-01 Mitsui Mining & Smelting Co Aqueous nickel slurry, method for preparing the same and conductive paste
US7566360B2 (en) * 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
AU2003237578A1 (en) * 2002-07-03 2004-01-23 Nanopowders Industries Ltd. Low sintering temperatures conductive nano-inks and a method for producing the same
JP4334204B2 (ja) * 2002-11-21 2009-09-30 メルク株式会社 高輝度高彩度虹彩顔料およびその製造方法
JP2004256757A (ja) * 2003-02-27 2004-09-16 Asahi Glass Co Ltd インクジェットプリンタ用の導電性インクおよび製造方法
JP2004277507A (ja) * 2003-03-13 2004-10-07 Jsr Corp 顔料内包ポリマー粒子の水系分散体とその製造方法および水系インク

Also Published As

Publication number Publication date
TWI308172B (de) 2009-04-01
TWI308347B (de) 2009-04-01
EP1835512A4 (de) 2008-02-20
TW200621914A (en) 2006-07-01
EP1835512B1 (de) 2010-05-12
EP1835512A1 (de) 2007-09-19
TW200902647A (en) 2009-01-16
JPWO2006041030A1 (ja) 2008-05-15
ATE467895T1 (de) 2010-05-15
WO2006041030A1 (ja) 2006-04-20
US20090293766A1 (en) 2009-12-03
KR20070065379A (ko) 2007-06-22

Similar Documents

Publication Publication Date Title
ATE467895T1 (de) Leitfähige tinte
WO2005018013A3 (en) Nanofilm compositions with polymeric components
DE60226871D1 (de) Tintenstrahltinte enthaltend fluorchemische tenside
DE60219841D1 (de) Überzug enthaltend teilchenförmige Metalllegierung zum Korrosionsschutz
ATE542863T1 (de) Matte thixotropische lackzusammensetzung
MX2010009275A (es) Sustratos que tienen una mayor resistencia a la transferencia de color por frotamiento.
EP1790703A3 (de) Beschichtungsflüssigkeit für Filme auf Silika-Basis mit niedriger Dielektrizitätskonstante und mit diesem Film beschichtetes Substrat
WO2004089639A8 (en) Latex-based overcoat for ink-jet printing applications
WO2007020063A3 (de) Beschichtungsmassen enthaltend mischoxid-nanopartikel bestehend aus 50-99,9 gew% al203 und 0,1-50 gew% oxiden von elementen der i. oder ii. hauptgruppe des periodensystems
AR039022A1 (es) Composicion de revestimiento que comprende silice coloidal y laminas de registro de chorro de tinta satinadas preparadas a partir de la misma
WO2006113400A3 (en) Optical coatings with narrow conductive lines
TW200624485A (en) Curable liquid composition, cured film, and antistatic laminate
EP1241193A3 (de) Kationische Kolloidale Dispersionspolymere für Tintenstrahldruck-Beschichtungen
AU2001236492A1 (en) Waterfast ink receptive coatings for ink jet printing, methods of coating substrates utilizing said coatings, and materials coated with said coatings
TWI316025B (en) Conductive paint compositions and methods of forming conductive coatings on substrates
EG23246A (en) Paint composition comprising ester of rosin and process of production thereof.
BRPI0408747A (pt) revestimentos em pó e processo para a preparação de camadas finas na fabricação de placas de circuitos impressos
MXPA04002198A (es) Material de carbamato soluble en agua y solventes organicos.
AU2003239481A1 (en) Coating of substrates prior to inkjet printing
EP1681321A4 (de) Tintenzusammensetzung für den tintenstrahldruck
DE59605593D1 (de) Verwendung eines Trägers zum Bedrucken mittels Laserdruck
WO2006018227A3 (de) Mit metallicfarbe bedruckte transparente trägerfolie
WO2005047020A3 (en) Watercolor canvas
AU2002333973A1 (en) Quick writing system for pen-based computers or electronic pens
AU2002241862A1 (en) Porous polyethyliene film with an ink jet printed surface

Legal Events

Date Code Title Description
8364 No opposition during term of opposition