KR20060108672A - 저-전력 다수-채널 완전 공핍된 양자 우물 cmos들 - Google Patents
저-전력 다수-채널 완전 공핍된 양자 우물 cmos들 Download PDFInfo
- Publication number
- KR20060108672A KR20060108672A KR1020067009128A KR20067009128A KR20060108672A KR 20060108672 A KR20060108672 A KR 20060108672A KR 1020067009128 A KR1020067009128 A KR 1020067009128A KR 20067009128 A KR20067009128 A KR 20067009128A KR 20060108672 A KR20060108672 A KR 20060108672A
- Authority
- KR
- South Korea
- Prior art keywords
- gate electrode
- channel
- forming
- regions
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 34
- 125000006850 spacer group Chemical group 0.000 claims description 22
- 238000002513 implantation Methods 0.000 claims description 15
- 239000002019 doping agent Substances 0.000 claims description 14
- 238000001312 dry etching Methods 0.000 claims description 14
- 238000000151 deposition Methods 0.000 claims description 12
- 150000004767 nitrides Chemical class 0.000 claims description 7
- 230000000873 masking effect Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 abstract description 42
- 239000010703 silicon Substances 0.000 abstract description 42
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 34
- 239000000463 material Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000005530 etching Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 229910021332 silicide Inorganic materials 0.000 description 5
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical group [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 5
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 4
- 239000007943 implant Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical group [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6727—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having source or drain regions connected to bulk conducting substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/706,948 US7074657B2 (en) | 2003-11-14 | 2003-11-14 | Low-power multiple-channel fully depleted quantum well CMOSFETs |
| US10/706,948 | 2003-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20060108672A true KR20060108672A (ko) | 2006-10-18 |
Family
ID=34573412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067009128A Ceased KR20060108672A (ko) | 2003-11-14 | 2004-10-08 | 저-전력 다수-채널 완전 공핍된 양자 우물 cmos들 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7074657B2 (enExample) |
| EP (1) | EP1695389B1 (enExample) |
| JP (1) | JP2007511907A (enExample) |
| KR (1) | KR20060108672A (enExample) |
| CN (1) | CN100452437C (enExample) |
| DE (1) | DE602004027158D1 (enExample) |
| TW (1) | TWI360225B (enExample) |
| WO (1) | WO2005053035A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7224007B1 (en) * | 2004-01-12 | 2007-05-29 | Advanced Micro Devices, Inc. | Multi-channel transistor with tunable hot carrier effect |
| KR100549014B1 (ko) * | 2004-07-21 | 2006-02-02 | 삼성전자주식회사 | 스페이서 패턴을 갖는 반도체 장치들 및 그 형성방법들 |
| US7544572B2 (en) * | 2005-11-30 | 2009-06-09 | Advanced Micro Devices, Inc. | Multi-operational mode transistor with multiple-channel device structure |
| CN102074585B (zh) * | 2010-10-22 | 2012-07-04 | 友达光电股份有限公司 | 薄膜晶体管与显示面板 |
| JP6401977B2 (ja) * | 2013-09-06 | 2018-10-10 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| CN103872139B (zh) * | 2014-02-24 | 2016-09-07 | 北京京东方光电科技有限公司 | 薄膜晶体管及其制作方法、阵列基板和显示装置 |
| US9653287B2 (en) * | 2014-10-30 | 2017-05-16 | Samsung Electronics Co., Ltd. | S/D connection to individual channel layers in a nanosheet FET |
| US9590038B1 (en) | 2015-10-23 | 2017-03-07 | Samsung Electronics Co., Ltd. | Semiconductor device having nanowire channel |
| US9899387B2 (en) * | 2015-11-16 | 2018-02-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-gate device and method of fabrication thereof |
| KR102343470B1 (ko) | 2016-01-28 | 2021-12-24 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
| EP3608970B1 (en) * | 2017-10-18 | 2025-12-10 | IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) | Layer, multi-level element, method for producing multi-level element, and method for driving same |
| KR102814839B1 (ko) * | 2019-06-11 | 2025-05-30 | 삼성전자주식회사 | 반도체 소자 |
| CN112151616B (zh) * | 2020-08-20 | 2022-12-16 | 中国科学院微电子研究所 | 一种堆叠mos器件及其制备方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5153688A (en) * | 1990-04-21 | 1992-10-06 | Canon Kabushiki Kaisha | Method and device for controlling interference of electron waves by light in which a transverse magnetic wave is applied |
| JPH04179271A (ja) * | 1990-11-14 | 1992-06-25 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| TW476451U (en) * | 1991-08-23 | 2002-02-11 | Semiconductor Energy Lab | Semiconductor device |
| JPH0575125A (ja) * | 1991-09-12 | 1993-03-26 | Toshiba Corp | 薄膜トランジスタ |
| FR2703855B1 (fr) * | 1993-04-05 | 1995-05-24 | Valeo Electronique | Montage à réponse linéarisée et symétrisée, oscillateur utilisant un tel montage et émetteur de télécommande utilisant un tel oscillateur. |
| JPH06310719A (ja) * | 1993-04-19 | 1994-11-04 | Sharp Corp | Ge−SiのSOI型MOSトランジスタ及びその製造方法 |
| US5500545A (en) | 1995-02-27 | 1996-03-19 | United Microelectronics Corporation | Double switching field effect transistor and method of manufacturing it |
| KR100279264B1 (ko) * | 1998-12-26 | 2001-02-01 | 김영환 | 더블 게이트 구조를 갖는 에스·오·아이 트랜지스터 및 그의제조방법 |
| US6373112B1 (en) * | 1999-12-02 | 2002-04-16 | Intel Corporation | Polysilicon-germanium MOSFET gate electrodes |
| CN100345306C (zh) * | 2000-05-31 | 2007-10-24 | 松下电器产业株式会社 | 金属-绝缘体-半导体场效应晶体管 |
| US6432754B1 (en) * | 2001-02-20 | 2002-08-13 | International Business Machines Corporation | Double SOI device with recess etch and epitaxy |
| JP2003092400A (ja) * | 2001-07-13 | 2003-03-28 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| KR100481209B1 (ko) * | 2002-10-01 | 2005-04-08 | 삼성전자주식회사 | 다중 채널을 갖는 모스 트랜지스터 및 그 제조방법 |
| FR2853454B1 (fr) * | 2003-04-03 | 2005-07-15 | St Microelectronics Sa | Transistor mos haute densite |
| US6919250B2 (en) * | 2003-05-21 | 2005-07-19 | Advanced Micro Devices, Inc. | Multiple-gate MOS device and method for making the same |
| US6921700B2 (en) * | 2003-07-31 | 2005-07-26 | Freescale Semiconductor, Inc. | Method of forming a transistor having multiple channels |
-
2003
- 2003-11-14 US US10/706,948 patent/US7074657B2/en not_active Expired - Lifetime
-
2004
- 2004-10-08 CN CNB2004800333292A patent/CN100452437C/zh not_active Expired - Lifetime
- 2004-10-08 KR KR1020067009128A patent/KR20060108672A/ko not_active Ceased
- 2004-10-08 EP EP04794688A patent/EP1695389B1/en not_active Expired - Lifetime
- 2004-10-08 DE DE602004027158T patent/DE602004027158D1/de not_active Expired - Lifetime
- 2004-10-08 WO PCT/US2004/033413 patent/WO2005053035A1/en not_active Ceased
- 2004-10-08 JP JP2006539498A patent/JP2007511907A/ja active Pending
- 2004-10-18 TW TW093131508A patent/TWI360225B/zh not_active IP Right Cessation
-
2006
- 2006-06-02 US US11/445,345 patent/US7253484B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7074657B2 (en) | 2006-07-11 |
| WO2005053035A1 (en) | 2005-06-09 |
| TW200522356A (en) | 2005-07-01 |
| DE602004027158D1 (de) | 2010-06-24 |
| US7253484B2 (en) | 2007-08-07 |
| US20060278938A1 (en) | 2006-12-14 |
| TWI360225B (en) | 2012-03-11 |
| EP1695389A1 (en) | 2006-08-30 |
| JP2007511907A (ja) | 2007-05-10 |
| EP1695389B1 (en) | 2010-05-12 |
| CN1879224A (zh) | 2006-12-13 |
| US20050104140A1 (en) | 2005-05-19 |
| CN100452437C (zh) | 2009-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20060510 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20091007 Comment text: Request for Examination of Application |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
Patent event date: 20100920 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20110120 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20110906 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20110120 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |