KR20060108672A - 저-전력 다수-채널 완전 공핍된 양자 우물 cmos들 - Google Patents

저-전력 다수-채널 완전 공핍된 양자 우물 cmos들 Download PDF

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Publication number
KR20060108672A
KR20060108672A KR1020067009128A KR20067009128A KR20060108672A KR 20060108672 A KR20060108672 A KR 20060108672A KR 1020067009128 A KR1020067009128 A KR 1020067009128A KR 20067009128 A KR20067009128 A KR 20067009128A KR 20060108672 A KR20060108672 A KR 20060108672A
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South Korea
Prior art keywords
gate electrode
channel
forming
regions
source
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KR1020067009128A
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English (en)
Korean (ko)
Inventor
제임스 엔. 판
존 지. 펠레그린
존 디. 치크
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
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Publication of KR20060108672A publication Critical patent/KR20060108672A/ko
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6727Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having source or drain regions connected to bulk conducting substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
KR1020067009128A 2003-11-14 2004-10-08 저-전력 다수-채널 완전 공핍된 양자 우물 cmos들 Ceased KR20060108672A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/706,948 US7074657B2 (en) 2003-11-14 2003-11-14 Low-power multiple-channel fully depleted quantum well CMOSFETs
US10/706,948 2003-11-14

Publications (1)

Publication Number Publication Date
KR20060108672A true KR20060108672A (ko) 2006-10-18

Family

ID=34573412

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067009128A Ceased KR20060108672A (ko) 2003-11-14 2004-10-08 저-전력 다수-채널 완전 공핍된 양자 우물 cmos들

Country Status (8)

Country Link
US (2) US7074657B2 (enExample)
EP (1) EP1695389B1 (enExample)
JP (1) JP2007511907A (enExample)
KR (1) KR20060108672A (enExample)
CN (1) CN100452437C (enExample)
DE (1) DE602004027158D1 (enExample)
TW (1) TWI360225B (enExample)
WO (1) WO2005053035A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7224007B1 (en) * 2004-01-12 2007-05-29 Advanced Micro Devices, Inc. Multi-channel transistor with tunable hot carrier effect
KR100549014B1 (ko) * 2004-07-21 2006-02-02 삼성전자주식회사 스페이서 패턴을 갖는 반도체 장치들 및 그 형성방법들
US7544572B2 (en) * 2005-11-30 2009-06-09 Advanced Micro Devices, Inc. Multi-operational mode transistor with multiple-channel device structure
CN102074585B (zh) * 2010-10-22 2012-07-04 友达光电股份有限公司 薄膜晶体管与显示面板
JP6401977B2 (ja) * 2013-09-06 2018-10-10 株式会社半導体エネルギー研究所 半導体装置
CN103872139B (zh) * 2014-02-24 2016-09-07 北京京东方光电科技有限公司 薄膜晶体管及其制作方法、阵列基板和显示装置
US9653287B2 (en) * 2014-10-30 2017-05-16 Samsung Electronics Co., Ltd. S/D connection to individual channel layers in a nanosheet FET
US9590038B1 (en) 2015-10-23 2017-03-07 Samsung Electronics Co., Ltd. Semiconductor device having nanowire channel
US9899387B2 (en) * 2015-11-16 2018-02-20 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-gate device and method of fabrication thereof
KR102343470B1 (ko) 2016-01-28 2021-12-24 삼성전자주식회사 반도체 장치 및 이의 제조 방법
EP3608970B1 (en) * 2017-10-18 2025-12-10 IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) Layer, multi-level element, method for producing multi-level element, and method for driving same
KR102814839B1 (ko) * 2019-06-11 2025-05-30 삼성전자주식회사 반도체 소자
CN112151616B (zh) * 2020-08-20 2022-12-16 中国科学院微电子研究所 一种堆叠mos器件及其制备方法

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US5153688A (en) * 1990-04-21 1992-10-06 Canon Kabushiki Kaisha Method and device for controlling interference of electron waves by light in which a transverse magnetic wave is applied
JPH04179271A (ja) * 1990-11-14 1992-06-25 Fujitsu Ltd 半導体装置及びその製造方法
TW476451U (en) * 1991-08-23 2002-02-11 Semiconductor Energy Lab Semiconductor device
JPH0575125A (ja) * 1991-09-12 1993-03-26 Toshiba Corp 薄膜トランジスタ
FR2703855B1 (fr) * 1993-04-05 1995-05-24 Valeo Electronique Montage à réponse linéarisée et symétrisée, oscillateur utilisant un tel montage et émetteur de télécommande utilisant un tel oscillateur.
JPH06310719A (ja) * 1993-04-19 1994-11-04 Sharp Corp Ge−SiのSOI型MOSトランジスタ及びその製造方法
US5500545A (en) 1995-02-27 1996-03-19 United Microelectronics Corporation Double switching field effect transistor and method of manufacturing it
KR100279264B1 (ko) * 1998-12-26 2001-02-01 김영환 더블 게이트 구조를 갖는 에스·오·아이 트랜지스터 및 그의제조방법
US6373112B1 (en) * 1999-12-02 2002-04-16 Intel Corporation Polysilicon-germanium MOSFET gate electrodes
CN100345306C (zh) * 2000-05-31 2007-10-24 松下电器产业株式会社 金属-绝缘体-半导体场效应晶体管
US6432754B1 (en) * 2001-02-20 2002-08-13 International Business Machines Corporation Double SOI device with recess etch and epitaxy
JP2003092400A (ja) * 2001-07-13 2003-03-28 Seiko Epson Corp 半導体装置及びその製造方法
KR100481209B1 (ko) * 2002-10-01 2005-04-08 삼성전자주식회사 다중 채널을 갖는 모스 트랜지스터 및 그 제조방법
FR2853454B1 (fr) * 2003-04-03 2005-07-15 St Microelectronics Sa Transistor mos haute densite
US6919250B2 (en) * 2003-05-21 2005-07-19 Advanced Micro Devices, Inc. Multiple-gate MOS device and method for making the same
US6921700B2 (en) * 2003-07-31 2005-07-26 Freescale Semiconductor, Inc. Method of forming a transistor having multiple channels

Also Published As

Publication number Publication date
US7074657B2 (en) 2006-07-11
WO2005053035A1 (en) 2005-06-09
TW200522356A (en) 2005-07-01
DE602004027158D1 (de) 2010-06-24
US7253484B2 (en) 2007-08-07
US20060278938A1 (en) 2006-12-14
TWI360225B (en) 2012-03-11
EP1695389A1 (en) 2006-08-30
JP2007511907A (ja) 2007-05-10
EP1695389B1 (en) 2010-05-12
CN1879224A (zh) 2006-12-13
US20050104140A1 (en) 2005-05-19
CN100452437C (zh) 2009-01-14

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