KR20060106722A - 세라믹 그린 시트의 적층 장치 및 적층 방법 - Google Patents
세라믹 그린 시트의 적층 장치 및 적층 방법 Download PDFInfo
- Publication number
- KR20060106722A KR20060106722A KR1020060027964A KR20060027964A KR20060106722A KR 20060106722 A KR20060106722 A KR 20060106722A KR 1020060027964 A KR1020060027964 A KR 1020060027964A KR 20060027964 A KR20060027964 A KR 20060027964A KR 20060106722 A KR20060106722 A KR 20060106722A
- Authority
- KR
- South Korea
- Prior art keywords
- green sheet
- carrier film
- ceramic green
- cutting
- lamination
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 49
- 238000010030 laminating Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 100
- 238000003475 lamination Methods 0.000 claims abstract description 65
- 238000001514 detection method Methods 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 description 18
- 239000004020 conductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
- B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D11/00—Combinations of several similar cutting apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/14—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
- B26D7/0625—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form by endless conveyors, e.g. belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/16—Capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1304—Means making hole or aperture in part to be laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1322—Severing before bonding or assembling of parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
- Y10T156/1707—Discrete spaced laminae on adhered carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/202—With product handling means
- Y10T83/2033—Including means to form or hold pile of product pieces
- Y10T83/2037—In stacked or packed relation
- Y10T83/2057—Including means to deliver individual pieces to a stack holder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/202—With product handling means
- Y10T83/2066—By fluid current
- Y10T83/207—By suction means
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Forests & Forestry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
Claims (6)
- 세라믹 그린 시트를 보유하는 캐리어 필름을 반송하는 반송 수단과,상기 반송 수단에 의해 반송되는 상기 캐리어 필름의 반송 경로상에 위치하고, 상기 세라믹 그린 시트를 절단하여 상기 세라믹 그린 시트로부터 소정 형상의 시트편을 분할하는 절단 수단과,상기 절단 수단보다도 하류측의 상기 반송 경로상에 위치하고, 상기 절단 수단에 의해 분할된 상기 시트편을 상기 캐리어 필름마다 피적층체상에 겹치는 적층 수단, 및상기 시트편을 상기 캐리어 필름으로부터 박리시키는 박리 수단을 포함하는 세라믹 그린 시트의 적층 장치.
- 제 1 항에 있어서, 상기 세라믹 그린 시트 및 상기 캐리어 필름의 적어도 어느 한쪽에는 위치 조정 마크가 설치되고,상기 절단 수단 및 상기 적층 수단의 적어도 어느 한쪽은,상기 위치 조정 마크를 사용하여 상기 세라믹 그린 시트의 규정 위치를 검출하는 마크 검출 수단과,상기 마크 검출 수단에 의해 검출된 규정 위치에 기초하여 위치 맞춤을 하는 위치 조정 수단을 추가로 포함하는 세라믹 그린 시트의 적층 장치.
- 제 1 항에 있어서, 상기 박리 수단은 상기 캐리어 필름과 상기 피적층체가 서로 이격하도록 상대적으로 이동시킴으로써, 상기 시트편을 상기 캐리어 필름으로부터 박리시키는 세라믹 그린 시트의 적층 장치.
- 반송 수단에 의해 반송되는 상기 세라믹 그린 시트를 보유하는 캐리어 필름의 반송 경로상에 위치하는 절단 수단에 의해 상기 세라믹 그린 시트를 절단하고, 상기 세라믹 그린 시트로부터 소정 형상의 시트편을 분할하는 단계와,상기 절단 수단보다도 하류측의 상기 반송 경로상에 위치하는 적층 수단에 의해, 상기 절단 수단에 의해 분할된 상기 시트편을 상기 캐리어 필름마다 피적층체상에 겹치는 단계, 및박리 수단에 의해, 상기 시트편을 상기 캐리어 필름으로부터 박리시키는 단계를 포함하는 세라믹 그린 시트의 적층 방법.
- 제 4 항에 있어서, 상기 세라믹 그린 시트 및 상기 캐리어 필름의 적어도 어느 한쪽에는 위치 조정 마크가 설치되고,상기 절단 수단에 의해 상기 시트편을 분할하기 전, 및 적층 수단에 의해 상기 시트편을 상기 피적층체상에 겹치기 전의 적어도 어느 한쪽에서,마크 검출 수단에 의해, 상기 위치 조정 마크를 사용하여 상기 세라믹 그린 시트의 규정 위치를 검출하는 단계와,위치 맞춤 수단에 의해, 상기 마크 검출 수단에 의해 검출된 규정 위치에 기 초하여 위치 맞춤을 하는 단계를 추가로 포함하는 세라믹 그린 시트의 적층 방법.
- 제 4 항에 있어서, 상기 박리 수단은, 상기 시트편을 상기 캐리어 필름으로부터 박리시킬 때, 상기 캐리어 필름과 상기 피적층체가 서로 이격하도록 상대적으로 이동시키는 세라믹 그린 시트의 적층 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005098074A JP4525421B2 (ja) | 2005-03-30 | 2005-03-30 | セラミックグリーンシートの積層装置及び積層方法 |
JPJP-P-2005-00098074 | 2005-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060106722A true KR20060106722A (ko) | 2006-10-12 |
KR100840885B1 KR100840885B1 (ko) | 2008-06-24 |
Family
ID=37030556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060027964A KR100840885B1 (ko) | 2005-03-30 | 2006-03-28 | 세라믹 그린 시트의 적층 장치 및 적층 방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7665499B2 (ko) |
JP (1) | JP4525421B2 (ko) |
KR (1) | KR100840885B1 (ko) |
CN (1) | CN100559524C (ko) |
TW (1) | TWI295064B (ko) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100796580B1 (ko) | 2007-07-11 | 2008-01-21 | 추대흥 | 콘덴서시트의 정렬 및 적층을 위한 시트편집틀장치 |
KR100796581B1 (ko) | 2007-07-11 | 2008-01-21 | 추대흥 | 열접착된 콘덴서시트의 패트필름박리장치 |
KR100796579B1 (ko) * | 2007-07-11 | 2008-01-21 | 추대흥 | 콘덴서시트의 열접착을 위한 핫프레싱 시트지그교체장치 |
KR100796578B1 (ko) | 2007-07-11 | 2008-01-21 | 추대흥 | 적층형 콘덴서 제조장치 및 그 제조방법 |
KR100940015B1 (ko) * | 2008-03-21 | 2010-02-03 | 하이텍 주식회사 | 시트적층장치 |
KR101250656B1 (ko) * | 2009-01-19 | 2013-04-03 | 야마하 파인 테크 가부시키가이샤 | 소편 부재의 이동 탑재 정착 장치 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2234175A2 (de) | 2009-03-27 | 2010-09-29 | Komax Holding AG | Vorrichtung und Verfahren zum Kaschieren von Solarmodulen |
US8663410B2 (en) * | 2009-09-14 | 2014-03-04 | Primera Technology, Inc. | System for finishing printed labels using multiple X-Y cutters |
CN102315019B (zh) * | 2010-05-13 | 2014-04-16 | 株式会社村田制作所 | 层叠型电子元器件制造装置及层叠型电子元器件的制造方法 |
CN102315024B (zh) * | 2010-05-13 | 2015-06-10 | 株式会社村田制作所 | 层叠型电子元器件制造装置及层叠型电子元器件的制造方法 |
KR101369899B1 (ko) * | 2012-01-16 | 2014-03-06 | (주)이노시엠 | 세라믹 박막 적층용 프레스 장치 |
JP6943231B2 (ja) * | 2018-10-02 | 2021-09-29 | 株式会社村田製作所 | 積層セラミック電子部品の製造装置および製造方法 |
CN112621889A (zh) * | 2020-11-30 | 2021-04-09 | 苏州龙方电子有限公司 | 一种电磁屏蔽膜模切工艺 |
JP7359191B2 (ja) * | 2021-04-23 | 2023-10-11 | 株式会社村田製作所 | 積層装置および積層方法 |
CN113183450B (zh) * | 2021-05-08 | 2023-07-11 | 史丹龙胶粘制品(常州)有限公司 | 覆膜流水线 |
CN113733713B (zh) * | 2021-09-09 | 2023-04-07 | 东莞市微格能自动化设备有限公司 | 一种陶瓷片叠片机 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2504277B2 (ja) * | 1990-04-19 | 1996-06-05 | 株式会社村田製作所 | 積層型セラミック電子部品用セラミックグリ―ンシ―トの製造方法および装置 |
JP2704562B2 (ja) * | 1990-07-19 | 1998-01-26 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
JP3086385B2 (ja) * | 1994-12-06 | 2000-09-11 | 太陽誘電株式会社 | 積層型電子部品の積層方法及びその装置 |
JP3321513B2 (ja) | 1995-11-01 | 2002-09-03 | 太陽誘電株式会社 | 積層型電子部品の製造方法及びその装置 |
JP3489445B2 (ja) | 1998-06-11 | 2004-01-19 | 株式会社村田製作所 | 積層体の製造方法及び積層体の製造装置 |
TW419683B (en) | 1999-03-23 | 2001-01-21 | Yageo Corp | Manufacturing equipment for multi-layer ceramic capacitor |
TWI223581B (en) | 1999-04-02 | 2004-11-01 | Murata Manufacturing Co | Method for machining ceramic green sheet and apparatus for machining the same |
JP3647675B2 (ja) | 1999-06-16 | 2005-05-18 | ローム株式会社 | 積層電子部品の製造方法 |
JP3630065B2 (ja) | 2000-03-03 | 2005-03-16 | 株式会社村田製作所 | セラミックグリーンシートの製造方法及びセラミックグリーンシート製造装置 |
CN1254352C (zh) | 2001-03-02 | 2006-05-03 | 詹姆士·哈代国际金融公司 | 一种通过涂洒来制造层状板材的方法和装置 |
JP3740991B2 (ja) * | 2001-03-19 | 2006-02-01 | 株式会社村田製作所 | グリーンシート積層装置、グリーンシートの積層方法及び積層セラミック電子部品の製造方法 |
JP2003017365A (ja) | 2001-04-26 | 2003-01-17 | Murata Mfg Co Ltd | 積層セラミック電子部品の製造方法及び積層セラミック電子部品の製造装置 |
JP2003145522A (ja) * | 2001-08-29 | 2003-05-20 | Murata Mfg Co Ltd | セラミック積層体製造装置およびセラミック積層体製造方法 |
US6758254B2 (en) * | 2001-10-16 | 2004-07-06 | Nautilus Systems, Inc. | Method and apparatus for removing and applying adhesive components |
JP2003205510A (ja) * | 2002-01-11 | 2003-07-22 | Murata Mfg Co Ltd | グリーンシートの積層方法および積層装置 |
JP4182158B2 (ja) * | 2003-05-13 | 2008-11-19 | 株式会社村田製作所 | セラミックグリーンシートの積層装置および積層方法 |
JP2005217178A (ja) | 2004-01-29 | 2005-08-11 | Kyocera Corp | セラミックグリーンシートの熱圧着方法 |
-
2005
- 2005-03-30 JP JP2005098074A patent/JP4525421B2/ja active Active
-
2006
- 2006-03-24 US US11/387,858 patent/US7665499B2/en not_active Expired - Fee Related
- 2006-03-28 KR KR1020060027964A patent/KR100840885B1/ko active IP Right Grant
- 2006-03-29 TW TW95110960A patent/TWI295064B/zh active
- 2006-03-29 CN CNB200610065957XA patent/CN100559524C/zh active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100796580B1 (ko) | 2007-07-11 | 2008-01-21 | 추대흥 | 콘덴서시트의 정렬 및 적층을 위한 시트편집틀장치 |
KR100796581B1 (ko) | 2007-07-11 | 2008-01-21 | 추대흥 | 열접착된 콘덴서시트의 패트필름박리장치 |
KR100796579B1 (ko) * | 2007-07-11 | 2008-01-21 | 추대흥 | 콘덴서시트의 열접착을 위한 핫프레싱 시트지그교체장치 |
KR100796578B1 (ko) | 2007-07-11 | 2008-01-21 | 추대흥 | 적층형 콘덴서 제조장치 및 그 제조방법 |
KR100940015B1 (ko) * | 2008-03-21 | 2010-02-03 | 하이텍 주식회사 | 시트적층장치 |
KR101250656B1 (ko) * | 2009-01-19 | 2013-04-03 | 야마하 파인 테크 가부시키가이샤 | 소편 부재의 이동 탑재 정착 장치 |
Also Published As
Publication number | Publication date |
---|---|
TWI295064B (en) | 2008-03-21 |
US20060219364A1 (en) | 2006-10-05 |
KR100840885B1 (ko) | 2008-06-24 |
CN1841590A (zh) | 2006-10-04 |
JP4525421B2 (ja) | 2010-08-18 |
US7665499B2 (en) | 2010-02-23 |
CN100559524C (zh) | 2009-11-11 |
JP2006272846A (ja) | 2006-10-12 |
TW200701278A (en) | 2007-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100840885B1 (ko) | 세라믹 그린 시트의 적층 장치 및 적층 방법 | |
KR100756209B1 (ko) | 세라믹 그린 시트의 절단 장치 및 절단 방법 | |
JP6416351B1 (ja) | 定形パネルへの樹脂フィルム貼付けシステム | |
KR20170033803A (ko) | 광학 표시 셀에 광학 필름을 첩부하는 방법 | |
KR101354065B1 (ko) | 커버레이 로딩장치 | |
KR20120032580A (ko) | 소편 부재의 이동 탑재 정착 장치 | |
JP6121384B2 (ja) | 製造装置及び製造方法 | |
EP2371475B1 (en) | Device for patterning laminated substrate with guiding bar and roller stage | |
US5772838A (en) | Apparatus and method for making laminated electrical or electronic devices from a continuous tape coated on one side with ceramic material | |
CN109524510A (zh) | 光伏电池覆膜方法、设备及拼接组装光伏电池组件的方法 | |
CN215499793U (zh) | 一种用于薄膜贴合的高精度设备 | |
CN214933982U (zh) | 面板自动搬运装置 | |
CN213936280U (zh) | 用于膜电极的贴合装置 | |
JP4182158B2 (ja) | セラミックグリーンシートの積層装置および積層方法 | |
US6797092B2 (en) | Method and apparatus for manufacturing monolithic ceramic electronic component | |
JP4655289B2 (ja) | 積層セラミック部品の積層方法とその装置 | |
CN221066586U (zh) | 一种兼容mlcc电容膜片内切和外切两种裁切模式的叠层机 | |
JP2007119311A (ja) | 合わせガラス用中間膜のトリミング装置及びその方法 | |
JP2007119311A5 (ko) | ||
JP2005123270A (ja) | 積層セラミック部品の製造装置及びその製造方法 | |
KR102431286B1 (ko) | 라미네이팅 시스템 및 라미네이팅 방법 | |
JP2005254823A (ja) | 薄板積層装置 | |
JP4692047B2 (ja) | セラミックグリーンブロックのカット方法およびカット装置 | |
JP3765193B2 (ja) | 薄板積層装置 | |
JP5937860B2 (ja) | ワークトレイ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision | ||
AMND | Amendment | ||
B701 | Decision to grant | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130524 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20140530 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20150515 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20160517 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20170522 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20190530 Year of fee payment: 12 |