KR100840885B1 - 세라믹 그린 시트의 적층 장치 및 적층 방법 - Google Patents
세라믹 그린 시트의 적층 장치 및 적층 방법 Download PDFInfo
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- KR100840885B1 KR100840885B1 KR1020060027964A KR20060027964A KR100840885B1 KR 100840885 B1 KR100840885 B1 KR 100840885B1 KR 1020060027964 A KR1020060027964 A KR 1020060027964A KR 20060027964 A KR20060027964 A KR 20060027964A KR 100840885 B1 KR100840885 B1 KR 100840885B1
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- lamination
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
- B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D11/00—Combinations of several similar cutting apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/14—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
- B26D7/0625—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form by endless conveyors, e.g. belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/02—Ceramics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/16—Capacitors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1304—Means making hole or aperture in part to be laminated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1322—Severing before bonding or assembling of parts
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
- Y10T156/1707—Discrete spaced laminae on adhered carrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/202—With product handling means
- Y10T83/2033—Including means to form or hold pile of product pieces
- Y10T83/2037—In stacked or packed relation
- Y10T83/2057—Including means to deliver individual pieces to a stack holder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/202—With product handling means
- Y10T83/2066—By fluid current
- Y10T83/207—By suction means
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
Claims (6)
- 세라믹 그린 시트를 보유하는 캐리어 필름을 반송하는 반송 수단과,상기 반송 수단에 의해 반송되는 상기 캐리어 필름의 반송 경로상에 위치하고, 상기 세라믹 그린 시트를 절단하여 상기 세라믹 그린 시트로부터 소정 형상의 시트편을 분할하는 절단 수단과,상기 반송 경로상에 위치하고, 상기 절단 수단에 의해 분할된 상기 시트편을 상기 캐리어 필름마다 피적층체상에 겹치는 적층 수단, 및상기 시트편을 상기 캐리어 필름으로부터 박리시키는 박리 수단을 포함하는 세라믹 그린 시트의 적층 장치.
- 제 1 항에 있어서, 상기 세라믹 그린 시트 및 상기 캐리어 필름의 적어도 어느 한쪽에는 위치 조정 마크가 설치되고,상기 절단 수단 및 상기 적층 수단의 적어도 어느 한쪽은,상기 위치 조정 마크를 사용하여 상기 세라믹 그린 시트의 규정 위치를 검출하는 마크 검출 수단과,상기 마크 검출 수단에 의해 검출된 규정 위치에 기초하여 위치 맞춤을 하는 위치 조정 수단을 추가로 포함하는 세라믹 그린 시트의 적층 장치.
- 제 1 항에 있어서, 상기 박리 수단은 상기 캐리어 필름과 상기 피적층체가 서로 이격하도록 상대적으로 이동시킴으로써, 상기 시트편을 상기 캐리어 필름으로부터 박리시키는 세라믹 그린 시트의 적층 장치.
- 반송 수단에 의해 반송되는 세라믹 그린 시트를 보유하는 캐리어 필름의 반송 경로상에 위치하는 절단 수단에 의해 상기 세라믹 그린 시트를 절단하고, 상기 세라믹 그린 시트로부터 소정 형상의 시트편을 분할하는 단계와,상기 반송 경로상에 위치하는 적층 수단에 의해, 상기 절단 수단에 의해 분할된 상기 시트편을 상기 캐리어 필름마다 피적층체상에 겹치는 단계, 및박리 수단에 의해, 상기 시트편을 상기 캐리어 필름으로부터 박리시키는 단계를 포함하는 세라믹 그린 시트의 적층 방법.
- 제 4 항에 있어서, 상기 세라믹 그린 시트 및 상기 캐리어 필름의 적어도 어느 한쪽에는 위치 조정 마크가 설치되고,상기 절단 수단에 의해 상기 시트편을 분할하기 전, 및 적층 수단에 의해 상기 시트편을 상기 피적층체상에 겹치기 전의 적어도 어느 한쪽에서,마크 검출 수단에 의해, 상기 위치 조정 마크를 사용하여 상기 세라믹 그린 시트의 규정 위치를 검출하는 단계와,위치 맞춤 수단에 의해, 상기 마크 검출 수단에 의해 검출된 규정 위치에 기초하여 위치 맞춤을 하는 단계를 추가로 포함하는 세라믹 그린 시트의 적층 방법.
- 제 4 항에 있어서, 상기 박리 수단은, 상기 시트편을 상기 캐리어 필름으로부터 박리시킬 때, 상기 캐리어 필름과 상기 피적층체가 서로 이격하도록 상대적으로 이동시키는 세라믹 그린 시트의 적층 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2005098074A JP4525421B2 (ja) | 2005-03-30 | 2005-03-30 | セラミックグリーンシートの積層装置及び積層方法 |
JPJP-P-2005-00098074 | 2005-03-30 |
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KR20060106722A KR20060106722A (ko) | 2006-10-12 |
KR100840885B1 true KR100840885B1 (ko) | 2008-06-24 |
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KR1020060027964A KR100840885B1 (ko) | 2005-03-30 | 2006-03-28 | 세라믹 그린 시트의 적층 장치 및 적층 방법 |
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US (1) | US7665499B2 (ko) |
JP (1) | JP4525421B2 (ko) |
KR (1) | KR100840885B1 (ko) |
CN (1) | CN100559524C (ko) |
TW (1) | TWI295064B (ko) |
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KR100796579B1 (ko) * | 2007-07-11 | 2008-01-21 | 추대흥 | 콘덴서시트의 열접착을 위한 핫프레싱 시트지그교체장치 |
KR100796580B1 (ko) | 2007-07-11 | 2008-01-21 | 추대흥 | 콘덴서시트의 정렬 및 적층을 위한 시트편집틀장치 |
KR100796581B1 (ko) | 2007-07-11 | 2008-01-21 | 추대흥 | 열접착된 콘덴서시트의 패트필름박리장치 |
KR100796578B1 (ko) | 2007-07-11 | 2008-01-21 | 추대흥 | 적층형 콘덴서 제조장치 및 그 제조방법 |
KR100940015B1 (ko) * | 2008-03-21 | 2010-02-03 | 하이텍 주식회사 | 시트적층장치 |
KR101179409B1 (ko) * | 2009-01-19 | 2012-09-04 | 야마하 파인 테크 가부시키가이샤 | 헤드 장치 |
US20100243148A1 (en) * | 2009-03-27 | 2010-09-30 | Stefan Kaufmann | Apparatus and method for laminating solar modules |
US8663410B2 (en) * | 2009-09-14 | 2014-03-04 | Primera Technology, Inc. | System for finishing printed labels using multiple X-Y cutters |
KR101152765B1 (ko) * | 2010-05-13 | 2012-06-18 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층형 전자 부품 제조 장치 및 적층형 전자 부품의 제조 방법 |
CN102315019B (zh) * | 2010-05-13 | 2014-04-16 | 株式会社村田制作所 | 层叠型电子元器件制造装置及层叠型电子元器件的制造方法 |
KR101369899B1 (ko) * | 2012-01-16 | 2014-03-06 | (주)이노시엠 | 세라믹 박막 적층용 프레스 장치 |
JP6943231B2 (ja) * | 2018-10-02 | 2021-09-29 | 株式会社村田製作所 | 積層セラミック電子部品の製造装置および製造方法 |
CN112621889A (zh) * | 2020-11-30 | 2021-04-09 | 苏州龙方电子有限公司 | 一种电磁屏蔽膜模切工艺 |
JP7359191B2 (ja) * | 2021-04-23 | 2023-10-11 | 株式会社村田製作所 | 積層装置および積層方法 |
CN113183450B (zh) * | 2021-05-08 | 2023-07-11 | 史丹龙胶粘制品(常州)有限公司 | 覆膜流水线 |
CN113733713B (zh) * | 2021-09-09 | 2023-04-07 | 东莞市微格能自动化设备有限公司 | 一种陶瓷片叠片机 |
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KR20020074405A (ko) * | 2001-03-19 | 2002-09-30 | 가부시키가이샤 무라타 세이사쿠쇼 | 그린시트 적층장치, 그린시트의 적층방법 및 적층 세라믹전자부품의 제조방법 |
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TWI295064B (en) | 2008-03-21 |
KR20060106722A (ko) | 2006-10-12 |
US20060219364A1 (en) | 2006-10-05 |
CN1841590A (zh) | 2006-10-04 |
JP4525421B2 (ja) | 2010-08-18 |
JP2006272846A (ja) | 2006-10-12 |
TW200701278A (en) | 2007-01-01 |
US7665499B2 (en) | 2010-02-23 |
CN100559524C (zh) | 2009-11-11 |
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