KR20060096337A - 리소그래피 적용을 위한 전용 메트롤로지 스테이지 - Google Patents
리소그래피 적용을 위한 전용 메트롤로지 스테이지 Download PDFInfo
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- KR20060096337A KR20060096337A KR1020060020088A KR20060020088A KR20060096337A KR 20060096337 A KR20060096337 A KR 20060096337A KR 1020060020088 A KR1020060020088 A KR 1020060020088A KR 20060020088 A KR20060020088 A KR 20060020088A KR 20060096337 A KR20060096337 A KR 20060096337A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
- A45C13/00—Details; Accessories
- A45C13/30—Straps; Bands
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Signal Processing (AREA)
- Acoustics & Sound (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Description
Claims (16)
- 시스템에 있어서,리소그래피 시스템의 노광부로부터 노광 빔을 수용하기 위해 기판을 위치시키도록 구성되는 기판 스테이지; 및상기 노광 빔 또는 노광시스템의 파라미터들을 검출하도록 구성되며, 그 위에 센서 시스템이 구비되는 메트롤로지 스테이지를 포함하고,상기 센서 시스템은 스트레이 광 센서, 슬릿 균일성 센서, 상대 편광 센서, 어파디제이션 센서, 절대 편광 센서, 이미지 품질 센서 또는 웨이브프론트 수차 센서를 포함하는 것을 특징으로 하는 시스템.
- 제1항에 있어서,상기 편광 센서는:쿼터 파장 플레이트;콜리매이터 렌즈;편광자; 및CCD(charge coupled device) 어레이를 포함하는 것을 특징으로 하는 장치.
- 제1항에 있어서,상기 어파디제이션 센서는:노광 광학기 아래의 릴레이 렌즈; 및상기 노광 광학기의 퓨필과 광학적으로 짝을 이루는(conjugate) CCD 어레이를 포함하는 것을 특징으로 하는 장치.
- 제1항에 있어서,상기 스트레이 광 센서는:위에 흡수성 코팅을 구비하되, 상기 코팅이 환형 투과성 영역을 형성하는 플레이트; 및상기 환형 투과성 영역을 통과하는 광을 감지하는 포토디텍터를 포함하는 것을 특징으로 하는 장치.
- 제1항에 있어서,상기 리소그래피 시스템의 노광부로부터 노광 빔을 수용하기 위해 제2기판을 위치시키도록 구성되는 제2기판 스테이지를 더 포함하는 것을 특징으로 하는 장치.
- 제1항에 있어서,상기 메트롤로지 스테이지는 상기 기판의 직경보다 작은 것을 특징으로 하는 장치.
- 리소그래피 시스템에 있어서,방사선 빔을 생성시키는 조명시스템;상기 빔을 패터닝하는 패터닝장치;상기 패터닝된 빔을 기판상으로 투영하는 투영시스템;상기 패터닝된 빔을 수용하기 위해 상기 기판을 위치시키도록 구성되는 기판 스테이지; 및상부에, 상기 패터닝된 빔 또는 상기 투영시스템의 파라미터들을 검출하도록 구성되는 센서 시스템을 구비하는 메트롤로지 스테이지를 포함하고,상기 센서 시스템은 스트레이 광 센서, 슬릿 균일성 센서, 상대 편광 센서, 어파디제이션 센서, 절대 편광 센서, 이미지 품질 센서 또는 웨이브프론트 수차 센서를 포함하는 것을 특징으로 하는 시스템.
- 제7항에 있어서,상기 패터닝된 빔을 수용하기 위해 제2기판을 위치시키도록 구성되는 제2기판 스테이지를 더 포함하는 것을 특징으로 하는 시스템.
- 제7항에 있어서,상기 메트롤로지 스테이지는 상기 기판의 직경보다 작은 것을 특징으로 하는 시스템.
- 제7항에 있어서,상기 편광 센서는:쿼터 파장 플레이트;콜리매이터 렌즈;편광자; 및CCD 어레이를 포함하는 것을 특징으로 하는 시스템.
- 제7항에 있어서,상기 어파디제이션 센서는:노광 광학기 아래에 배치된 릴레이 렌즈; 및상기 노광 광학기의 퓨필과 광학적으로 짝을 이루는 CCD 어레이를 포함하는 것을 특징으로 하는 시스템.
- 제7항에 있어서,상기 스트레이 광 센서는:위에 흡수성 코팅을 구비하되, 상기 코팅이 환형 투과성 영역을 형성하는 플레이트; 및상기 환형 투과성 영역을 통과하는 광을 감지하는 포토디텍터를 포함하는 것을 특징으로 하는 시스템.
- 리소그래피 시스템 노광부의 광학 파라미터들을 측정하는 방법에 있어서,기판 스테이지를 상기 노광부의 광학 축선으로부터 멀리 이동시키는 단계;상기 광학 축선에서 센서를 배치시키도록 메트롤로지 스테이지를 이동시키는 단계;노광시스템으로부터의 광의 광학 파라미터를 측정하는 단계를 포함하되, 상기 광학 파라미터는 스트레이 광, 어파디제이션, 슬릿 균일성, 상대 편광, 절대 편광, 이미지 품질 또는 웨이브프론트 수차를 포함하는 것을 특징으로 하는 방법.
- 제13항에 있어서,상기 편광 측정은,상기 노광시스템으로터, 쿼터 파장 플레이트, 콜리매이터 렌즈 및 편광자를 통해 그리고 CCD 어레이상으로 상기 광을 전달하는 단계를 포함하는 것을 특징으로 하는 방법.
- 제13항에 있어서,상기 어파디제이션 측정은:상기 노광시스템으로부터, 릴레이 렌즈를 통해 그리고 상기 투영광학기의 퓨필과 광학적으로 짝을 이루는 CCD상으로 상기 광을 전달하는 단계를 포함하는 것을 특징으로 하는 방법.
- 제13항에 있어서,상기 스트레이 광 측정은:상기 노광시스템으로부터, 위에 환형 투과성 영역을 형성하는 흡수성 코팅을 구비한 플레이트를 통해, 그리고 상기 환형 투과성 영역을 통과하는 광을 감지하는 포토디텍터상으로 상기 광을 전달하는 단계를 포함하는 것을 특징으로 하는 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65771005P | 2005-03-03 | 2005-03-03 | |
US60/657,710 | 2005-03-03 |
Publications (2)
Publication Number | Publication Date |
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KR20060096337A true KR20060096337A (ko) | 2006-09-11 |
KR100747778B1 KR100747778B1 (ko) | 2007-08-08 |
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KR1020060020088A KR100747778B1 (ko) | 2005-03-03 | 2006-03-02 | 리소그래피 적용을 위한 전용 메트롤로지 스테이지 |
Country Status (7)
Country | Link |
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US (1) | US20060219947A1 (ko) |
EP (1) | EP1701216B1 (ko) |
JP (6) | JP4477589B2 (ko) |
KR (1) | KR100747778B1 (ko) |
CN (1) | CN100578361C (ko) |
SG (1) | SG125245A1 (ko) |
TW (1) | TWI331704B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8547522B2 (en) * | 2005-03-03 | 2013-10-01 | Asml Netherlands B.V. | Dedicated metrology stage for lithography applications |
US8975599B2 (en) * | 2007-05-03 | 2015-03-10 | Asml Netherlands B.V. | Image sensor, lithographic apparatus comprising an image sensor and use of an image sensor in a lithographic apparatus |
US20090097006A1 (en) * | 2007-10-10 | 2009-04-16 | Asml Netherlands B.V. | Apparatus and Method for Obtaining Information Indicative of the Uniformity of a Projection System of a Lithographic Apparatus |
NL2010467A (en) | 2012-04-16 | 2013-10-17 | Asml Netherlands Bv | Lithographic method and apparatus. |
KR102240655B1 (ko) * | 2014-02-13 | 2021-04-16 | 삼성디스플레이 주식회사 | 노광 장치 및 이를 이용한 노광 방법 |
CN108139682B (zh) * | 2015-10-02 | 2020-12-25 | Asml荷兰有限公司 | 量测方法和设备、计算机程序及光刻系统 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57117238A (en) * | 1981-01-14 | 1982-07-21 | Nippon Kogaku Kk <Nikon> | Exposing and baking device for manufacturing integrated circuit with illuminometer |
JPS58162038A (ja) * | 1982-03-23 | 1983-09-26 | Canon Inc | 面状態検査装置 |
EP0104135B1 (de) * | 1982-09-21 | 1987-06-03 | RUD-Kettenfabrik Rieger & Dietz GmbH u. Co. | Anordnung zum Verbinden von Bauteilen sowie Spann- und/oder Kontrollvorrichtung von Hebe- und/oder Verzurranordnungen mit Gurten |
US4585342A (en) * | 1984-06-29 | 1986-04-29 | International Business Machines Corporation | System for real-time monitoring the characteristics, variations and alignment errors of lithography structures |
US4855792A (en) * | 1988-05-13 | 1989-08-08 | Mrs Technology, Inc. | Optical alignment system for use in photolithography and having reduced reflectance errors |
US5631731A (en) * | 1994-03-09 | 1997-05-20 | Nikon Precision, Inc. | Method and apparatus for aerial image analyzer |
US5841520A (en) * | 1995-08-09 | 1998-11-24 | Nikon Corporatioin | Exposure apparatus and method that use mark patterns to determine image formation characteristics of the apparatus prior to exposure |
JPH1092722A (ja) * | 1996-09-18 | 1998-04-10 | Nikon Corp | 露光装置 |
JP3352354B2 (ja) * | 1997-04-28 | 2002-12-03 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
US6897963B1 (en) * | 1997-12-18 | 2005-05-24 | Nikon Corporation | Stage device and exposure apparatus |
JP4264676B2 (ja) * | 1998-11-30 | 2009-05-20 | 株式会社ニコン | 露光装置及び露光方法 |
KR20010033118A (ko) * | 1997-12-18 | 2001-04-25 | 오노 시게오 | 스테이지 장치 및 노광장치 |
JP2000121498A (ja) * | 1998-10-15 | 2000-04-28 | Nikon Corp | 結像性能の評価方法及び装置 |
JP2000205946A (ja) * | 1999-01-19 | 2000-07-28 | Nikon Corp | 光強度測定素子、撮像素子、空間像測定装置並びに露光装置 |
JP2001308003A (ja) * | 2000-02-15 | 2001-11-02 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
JP3554243B2 (ja) * | 2000-02-23 | 2004-08-18 | キヤノン株式会社 | 投影露光装置及びデバイス製造方法 |
JP4599797B2 (ja) * | 2000-07-26 | 2010-12-15 | 株式会社ニコン | フレア計測方法、露光方法、露光装置の調整方法 |
US6891610B2 (en) * | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining an implant characteristic and a presence of defects on a specimen |
US6490031B1 (en) * | 2000-09-29 | 2002-12-03 | Intel Corporation | Radiometric scatter monitor |
JP2002175963A (ja) * | 2000-12-05 | 2002-06-21 | Nikon Corp | ステージ装置とその位置制御方法および露光装置並びに露光方法 |
CN1423831A (zh) * | 2000-12-22 | 2003-06-11 | 株式会社尼康 | 波像差测定装置,波像差测定方法,曝光装置及微型器件的制造方法 |
JP2002246287A (ja) * | 2001-02-16 | 2002-08-30 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
JP2003218024A (ja) * | 2001-11-16 | 2003-07-31 | Nikon Corp | 計測方法、結像特性調整方法、露光方法及び露光装置の製造方法 |
JP2003338989A (ja) * | 2002-05-21 | 2003-11-28 | Canon Inc | フォトダイオードアレイセンサの駆動方法及びそれを用いた投影露光装置 |
JP2004061515A (ja) * | 2002-07-29 | 2004-02-26 | Cark Zeiss Smt Ag | 光学系による偏光状態への影響を決定する方法及び装置と、分析装置 |
JP4065518B2 (ja) * | 2002-11-29 | 2008-03-26 | キヤノン株式会社 | 露光装置 |
EP1426826A3 (en) * | 2002-12-02 | 2006-12-20 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7133119B1 (en) * | 2002-12-17 | 2006-11-07 | Kla-Tencor Technologies Corp. | Systems for simulating high NA and polarization effects in aerial images |
WO2005015313A1 (en) * | 2003-08-04 | 2005-02-17 | Carl Zeiss Smt Ag | Illumination mask for range-resolved detection of scattered light |
JP4018647B2 (ja) * | 2004-02-09 | 2007-12-05 | キヤノン株式会社 | 投影露光装置およびデバイス製造方法 |
US7528931B2 (en) * | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8027021B2 (en) * | 2006-02-21 | 2011-09-27 | Nikon Corporation | Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method |
WO2007097380A1 (ja) * | 2006-02-21 | 2007-08-30 | Nikon Corporation | パターン形成装置及びパターン形成方法、移動体駆動システム及び移動体駆動方法、露光装置及び露光方法、並びにデバイス製造方法 |
WO2007103829A1 (en) * | 2006-03-02 | 2007-09-13 | Altairnano, Inc. | Method for production of metal oxide coatings |
-
2006
- 2006-02-27 US US11/362,280 patent/US20060219947A1/en not_active Abandoned
- 2006-03-01 SG SG200601339A patent/SG125245A1/en unknown
- 2006-03-01 EP EP06251118A patent/EP1701216B1/en not_active Not-in-force
- 2006-03-02 JP JP2006055668A patent/JP4477589B2/ja not_active Expired - Fee Related
- 2006-03-02 CN CN200610071179A patent/CN100578361C/zh active Active
- 2006-03-02 KR KR1020060020088A patent/KR100747778B1/ko active IP Right Grant
- 2006-03-03 TW TW095107251A patent/TWI331704B/zh not_active IP Right Cessation
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2010
- 2010-01-15 JP JP2010006584A patent/JP5048087B2/ja not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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JP5048089B2 (ja) | 2012-10-17 |
EP1701216A2 (en) | 2006-09-13 |
CN100578361C (zh) | 2010-01-06 |
JP5048086B2 (ja) | 2012-10-17 |
CN1841207A (zh) | 2006-10-04 |
TWI331704B (en) | 2010-10-11 |
JP2010135816A (ja) | 2010-06-17 |
SG125245A1 (en) | 2006-09-29 |
EP1701216A3 (en) | 2006-09-20 |
JP2010135815A (ja) | 2010-06-17 |
JP2006245586A (ja) | 2006-09-14 |
JP5048088B2 (ja) | 2012-10-17 |
TW200639593A (en) | 2006-11-16 |
JP2010135814A (ja) | 2010-06-17 |
KR100747778B1 (ko) | 2007-08-08 |
JP5048085B2 (ja) | 2012-10-17 |
JP2010114463A (ja) | 2010-05-20 |
EP1701216B1 (en) | 2011-10-12 |
JP5048087B2 (ja) | 2012-10-17 |
JP2010135817A (ja) | 2010-06-17 |
JP4477589B2 (ja) | 2010-06-09 |
US20060219947A1 (en) | 2006-10-05 |
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