KR20050084297A - 표시장치 및 표시장치의 제작 방법 - Google Patents
표시장치 및 표시장치의 제작 방법 Download PDFInfo
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- KR20050084297A KR20050084297A KR1020057010889A KR20057010889A KR20050084297A KR 20050084297 A KR20050084297 A KR 20050084297A KR 1020057010889 A KR1020057010889 A KR 1020057010889A KR 20057010889 A KR20057010889 A KR 20057010889A KR 20050084297 A KR20050084297 A KR 20050084297A
- Authority
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- South Korea
- Prior art keywords
- film
- insulating layer
- display device
- light emitting
- display unit
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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Abstract
Description
Claims (20)
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치로서,상기 표시부는 일방의 기판에 형성된 절연층 위에 형성되며,상기 한 쌍의 기판은 상기 표시부의 외측에 형성되어 외주를 둘러싸고, 상기 절연층 위에 형성된 씰재에 의하여 고착되며,상기 절연층의 적어도 한 층은 유기수지재료로 형성되고,상기 씰재의 외측에 위치하는 상기 절연층의 외단부는, 봉지막에 의하여 피복되어 있는 것을 특징으로 하는 표시장치.
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치로서,상기 표시부는, 일방의 기판에 형성된 절연층 위에 형성되며,상기 한 쌍의 기판은 상기 표시부의 외측에 형성되어 외주를 둘러싸고, 상기 절연층 위에 형성된 씰재에 의하여 고착되며,상기 절연층의 적어도 한 층은 유기수지재료로 형성되고,상기 절연층은 개구부를 가지고, 상기 개구부는 봉지막에 의하여 피복되며,상기 씰재는 상기 봉지막에 접하여 형성되어 있는 것을 특징으로 하는 표시장치.
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치로서,상기 표시부는, 일방의 기판에 형성된 절연층 위에 형성되며,상기 한 쌍의 기판은 상기 표시부의 외측에 형성되어 외주를 둘러싸고, 상기 절연층 위에 형성된 씰재에 의하여 고착되며,상기 절연층의 적어도 한 층은 유기수지재료로 형성되고,상기 절연층은 개구부를 가지고, 상기 개구부는 봉지막에 의하여 피복되며,상기 씰재의 외측에 위치하는 상기 절연막의 외단부는, 상기 봉지막에 의하여 피복되어 있는 것을 특징으로 하는 표시장치.
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치로서,상기 표시부는, 일방의 기판에 형성된 절연층 위에 형성되며,상기 한 쌍의 기판은 상기 표시부의 외측에 형성되어 외주를 둘러싸고, 상기 절연층 위에 형성된 씰재에 의하여 고착되며,상기 절연층의 적어도 한 층은 유기수지재료로 형성되고,상기 절연층은 복수의 개구부를 가지고, 상기 복수의 개구부는 봉지막에 의하여 피복되며,상기 씰재는 상기 봉지막에 접하여 형성되는 것을 특징으로 하는 표시장치.
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치로서,상기 표시부는, 일방의 기판에 형성된 절연층 위에 형성되며,상기 한 쌍의 기판은 상기 표시부의 외측에 형성되어 외주를 둘러싸고, 상기 절연층 위에 형성된 씰재에 의하여 고착되며,상기 절연층의 적어도 한 층은 유기수지재료로 형성되고,상기 절연층은 복수의 개구부를 가지고, 상기 복수의 개구부는 봉지막에 의하여 피복되며,상기 씰재의 외측에 위치하는 상기 절연층의 외단부는, 상기 봉지막에 의하여 피복되어 있는 것을 특징으로 하는 표시장치.
- 기판 위에 적어도 한 층이 유기수지재료인 절연층이 형성되며,상기 절연층 위에 복수의 발광소자로 이루어지는 표시부가 형성되고,적어도 상기 절연층의 외단부를 덮도록 봉지막이 형성되며,적어도 상기 표시부를 둘러싸도록 씰재가 형성되고,대향기판이 상기 씰재에 의하여 상기 기판에 고착되는 것을 특징으로 하는 표시장치.
- 기판 위에 적어도 한 층이 유기수지재료인 절연층이 형성되며,상기 절연층 위에 복수의 발광소자로 이루어지는 표시부가 형성되고,적어도 상기 절연층의 외단부를 덮도록 봉지막이 형성되며,적어도 상기 표시부의 외측을 둘러싸고, 또한 상기 봉지막에 접하도록 씰재가 형성되며,대향기판이 상기 씰재에 의하여 상기 기판에 고착되는 것을 특징으로 하는 표시장치.
- 제 1항 내지 제 7항 중 어느 한 항에 있어서,상기 봉지막은 도전성 박막 또는 절연성 박막으로부터 선택된 일종 또는 복수종으로 이루어지는 것을 특징으로 하는 표시장치.
- 제 1항 내지 제 7항 중 어느 한 항에 있어서,상기 봉지막은 Al, Ti, Mo , W 혹은 Si의 원소로부터 선택된 일종 또는 복수종으로 이루어지는 것을 특징으로 하는 표시장치.
- 제 1항 내지 제 7항 중 어느 한 항에 있어서,상기 봉지막은 질화 실리콘막, 질화 산화 실리콘막, 또는 질소함유 탄소막으로부터 선택된 일종 또는 복수종으로 이루어지는 것을 특징으로 하는 표시장치.
- 제 1항 내지 제 7항 중 어느 한 항에 있어서,상기 유기수지재료는 아크릴, 폴리아미드, 폴리이미드 또는 알킬기를 포함하는 산화 실리콘으로부터 선택된 일종 또는 복수종으로 이루어지는 것을 특징으로 하는 표시장치.
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치의 제작방법으로서,상기 표시부를, 일방의 기판에 형성된 절연층 위에 형성하며,상기 한 쌍의 기판은 상기 표시부의 외측에 외주를 둘러싸서 형성하고, 상기 절연층 위에 형성된 씰재에 의하여 고착하며,상기 절연층의 적어도 한 층은 유기수지재료로 형성하고,상기 씰재의 외측에 형성하는 상기 절연층의 외단부를 봉지막에 의하여 피복하는 것을 특징으로 하는 표시장치의 제작방법.
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치의 제조방법으로서,상기 표시부를, 일방의 기판에 형성된 절연층 위에 형성하며,상기 한 쌍의 기판은 상기 표시부의 외측에 외주를 둘러싸서 형성하고, 상기 절연층 위에 형성된 씰재에 의하여 고착하며,상기 절연층의 적어도 한 층은 유기수지재료로 형성하고,상기 절연층에 개구부를 형성하고, 상기 개구부를 봉지막에 의하여 피복하며,상기 씰재를 상기 봉지막에 접하여 형성하는 것을 특징으로 하는 표시장치의 제조방법.
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치의 제조방법으로서,상기 표시부를, 일방의 기판에 형성된 절연층 위에 형성하며,상기 한 쌍의 기판은 상기표시부의 외측에 외주를 둘러싸서 형성하고, 상기 절연층 위에 형성된 씰재에 의하여 고착하며,상기 절연층의 적어도 한 층은 유기수지재료로 형성하고,상기 절연층에 개구부를 형성하고, 상기 개구부를 봉지막에 의하여 피복하며,상기 씰재의 외측에 형성하는 상기 절연측의 외단부를 봉지막에 의하여 피복하는 것을 특징으로 하는 표시장치의 제조방법.
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치의 제조방법으로서,상기 표시부를, 일방의 기판에 형성된 절연층 위에 형성하며,상기 한 쌍의 기판은 상기 표시부의 외측에 외주를 둘러싸서 형성하고, 상기 절연층 위에 형성된 씰재에 의하여 고착하며,상기 절연층의 적어도 한 층은 유기수지재료로 형성하고,상기 절연층에 복수의 개구부를 형성하고, 상기 복수의 개구부를 각각 봉지막에 의하여 피복하며,상기 씰재를 상기 봉지막에 접하여 형성하는 것을 특징으로 하는 표시장치의 제조방법.
- 한 쌍의 기판 사이에 유기발광 재료를 이용한 발광소자를 배열하여 형성된 표시부를 가지는 표시장치의 제조방법으로서,상기 표시부를, 일방의 기판에 형성된 절연층 위에 형성하며,상기 한 쌍의 기판은 상기 표시부의 외측에 외주를 둘러싸서 형성하고, 상기 절연층 위에 형성된 씰재에 의하여 고착하며,상기 절연층의 적어도 한 층은 유기수지재료로 형성하고,상기 절연층에 복수의 개구부를 형성하고, 상기 복수의 개구부를 각각 봉지막에 의하여 피복하며,상기 씰재의 외측에 형성하는 상기 절연층의 외단부를, 봉지막에 의하여 피복하는 것을 특징으로 하는 표시장치의 제조방법.
- 제 12항 내지 제 16항 중 어느 한 항에 있어서,상기 봉지막은 도전성박막 또는 절연성박막으로부터 선택된 일종 또는 복수종으로 이루어지는 것을 특징이라고 하는 표시장치의 제작 방법.
- 제 12항 내지 제 16항 중 어느 한 항에 있어서,상기 봉지막은 Al, Ti , Mo, W 혹1은 Si의 원소로부터 선택된 일종 또는 복수종으로 형성하는 것을 특징으로 하는 표시장치의 제작 방법.
- 제 12항 내지 제 16항 중 어느 한 항에 있어서,상기 봉지막은 질화 실리콘막, 질화 산화 실리콘막, 또는 질소함유 탄소막으로부터 선택된 일종 또는 복수종으로 형성하는 것을 특징으로 하는 표시장치의 제작 방법.
- 제 12항 내지 제 16항 중 어느 한 항에 있어서,상기 유기수지재료는 아크릴, 폴리아미드, 폴리이미드 또는 알킬기를 포함하는 산화 실리콘으로부터 선택된 일종 또는 복수종으로 형성하는 것을 특징으로 하는 표시장치의 제작 방법.
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JP5969203B2 (ja) | 2016-08-17 |
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JP6691246B2 (ja) | 2020-04-28 |
JP2021185568A (ja) | 2021-12-09 |
CN1729719B (zh) | 2010-09-15 |
JP6553150B2 (ja) | 2019-07-31 |
JP4906051B2 (ja) | 2012-03-28 |
JP2021192366A (ja) | 2021-12-16 |
CN101882668A (zh) | 2010-11-10 |
JP6491276B2 (ja) | 2019-03-27 |
JP6085012B2 (ja) | 2017-02-22 |
US7190115B2 (en) | 2007-03-13 |
JP6391634B2 (ja) | 2018-09-19 |
KR100890957B1 (ko) | 2009-03-27 |
TW200415698A (en) | 2004-08-16 |
AU2003288999A1 (en) | 2004-07-14 |
JP2018036661A (ja) | 2018-03-08 |
CN1729719A (zh) | 2006-02-01 |
JP5921517B2 (ja) | 2016-05-24 |
JP2017224616A (ja) | 2017-12-21 |
JP2016001327A (ja) | 2016-01-07 |
JPWO2004057920A1 (ja) | 2006-04-27 |
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