KR20040102168A - 플렉시블 디스플레이용의 전기 콘택트 - Google Patents

플렉시블 디스플레이용의 전기 콘택트 Download PDF

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Publication number
KR20040102168A
KR20040102168A KR10-2004-7017115A KR20047017115A KR20040102168A KR 20040102168 A KR20040102168 A KR 20040102168A KR 20047017115 A KR20047017115 A KR 20047017115A KR 20040102168 A KR20040102168 A KR 20040102168A
Authority
KR
South Korea
Prior art keywords
flexible substrate
electrical
openings
flexible
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR10-2004-7017115A
Other languages
English (en)
Korean (ko)
Inventor
허만즈아노
아이슨하트랜돌프더블유
젠겔글렌더블유
Original Assignee
에이리언 테크놀로지 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이리언 테크놀로지 코포레이션 filed Critical 에이리언 테크놀로지 코포레이션
Publication of KR20040102168A publication Critical patent/KR20040102168A/ko
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/19—Segment displays

Landscapes

  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
KR10-2004-7017115A 2002-04-23 2003-04-22 플렉시블 디스플레이용의 전기 콘택트 Withdrawn KR20040102168A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/131,517 US6864435B2 (en) 2001-04-25 2002-04-23 Electrical contacts for flexible displays
US10/131,517 2002-04-23
PCT/US2003/012540 WO2003092073A2 (en) 2002-04-23 2003-04-22 Electrical contacts for flexible displays

Publications (1)

Publication Number Publication Date
KR20040102168A true KR20040102168A (ko) 2004-12-03

Family

ID=29268732

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7017115A Withdrawn KR20040102168A (ko) 2002-04-23 2003-04-22 플렉시블 디스플레이용의 전기 콘택트

Country Status (7)

Country Link
US (2) US6864435B2 (enExample)
EP (1) EP1497865A2 (enExample)
JP (1) JP2005524109A (enExample)
KR (1) KR20040102168A (enExample)
CN (1) CN1322587C (enExample)
AU (1) AU2003234184A1 (enExample)
WO (1) WO2003092073A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100974816B1 (ko) * 2008-02-27 2010-08-10 주식회사 비즈모델라인 전자부품에 알에프아이디 태그 내장 방법 및 시스템과 이를위한 기록매체

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10053334B4 (de) * 2000-10-27 2018-08-02 Robert Bosch Gmbh Verfahren und Vorrichtung zur Steuerung eines Stellelements in einem Fahrzeug
KR20050086839A (ko) * 2002-11-26 2005-08-30 이 잉크 코포레이션 가요성 전자 회로 및 디스플레이
US7236151B2 (en) * 2004-01-28 2007-06-26 Kent Displays Incorporated Liquid crystal display
WO2005072447A2 (en) * 2004-01-28 2005-08-11 Kent Displays Incorporated Liquid crystal display films
US7737928B2 (en) * 2003-07-02 2010-06-15 Kent Displays Incorporated Stacked display with shared electrode addressing
US8199086B2 (en) 2004-01-28 2012-06-12 Kent Displays Incorporated Stacked color photodisplay
CN1975521A (zh) * 2004-01-28 2007-06-06 肯特显示器公司 一种液晶显示器
WO2005073705A1 (de) * 2004-01-29 2005-08-11 Siemens Aktiengesellschaft Elektrochemisches transducer-array und dessen verwendung
US20080055581A1 (en) * 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
KR101185613B1 (ko) * 2004-04-27 2012-09-24 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 소프트 리소그래피용 복합 패터닝 장치
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US7557367B2 (en) 2004-06-04 2009-07-07 The Board Of Trustees Of The University Of Illinois Stretchable semiconductor elements and stretchable electrical circuits
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7251882B2 (en) 2004-09-03 2007-08-07 Eastman Kodak Company Method for assembling micro-components to binding sites
US7629026B2 (en) * 2004-09-03 2009-12-08 Eastman Kodak Company Thermally controlled fluidic self-assembly
US20060051517A1 (en) * 2004-09-03 2006-03-09 Eastman Kodak Company Thermally controlled fluidic self-assembly method and support
US20060202925A1 (en) * 2004-12-07 2006-09-14 William Manning Remote cholesteric display
US7687277B2 (en) * 2004-12-22 2010-03-30 Eastman Kodak Company Thermally controlled fluidic self-assembly
CA2592055A1 (en) 2004-12-27 2006-07-06 Quantum Paper, Inc. Addressable and printable emissive display
US7301458B2 (en) * 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
US7329942B2 (en) * 2005-05-18 2008-02-12 Ching-Fu Tsou Array-type modularized light-emitting diode structure and a method for packaging the structure
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US20070040501A1 (en) 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US7791700B2 (en) * 2005-09-16 2010-09-07 Kent Displays Incorporated Liquid crystal display on a printed circuit board
EP1991723A2 (en) 2006-03-03 2008-11-19 The Board Of Trustees Of The University Of Illinois Methods of making spatially aligned nanotubes and nanotube arrays
KR100829392B1 (ko) * 2006-08-24 2008-05-13 동부일렉트로닉스 주식회사 ＳｏＣ 및 그 제조 방법
US8017220B2 (en) * 2006-10-04 2011-09-13 Corning Incorporated Electronic device and method of making
US8115326B2 (en) 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier
JP5700750B2 (ja) 2007-01-17 2015-04-15 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 印刷ベースの組立により製作される光学システム
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8133768B2 (en) * 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US8456393B2 (en) 2007-05-31 2013-06-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
WO2009111641A1 (en) 2008-03-05 2009-09-11 The Board Of Trustees Of The University Of Illinois Stretchable and foldable electronic devices
DE102008013031B4 (de) 2008-03-07 2019-07-25 Osram Oled Gmbh Optoelektronisches Bauelement
US8470701B2 (en) * 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
US8946683B2 (en) * 2008-06-16 2015-02-03 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) * 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
WO2010042653A1 (en) * 2008-10-07 2010-04-15 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8372726B2 (en) * 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8049327B2 (en) * 2009-01-05 2011-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Through-silicon via with scalloped sidewalls
TWI671811B (zh) 2009-05-12 2019-09-11 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US20110218756A1 (en) * 2009-10-01 2011-09-08 Mc10, Inc. Methods and apparatus for conformal sensing of force and/or acceleration at a person's head
JP6046491B2 (ja) 2009-12-16 2016-12-21 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ コンフォーマル電子機器を使用した生体内での電気生理学
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
CN105496423A (zh) * 2010-03-17 2016-04-20 伊利诺伊大学评议会 基于生物可吸收基质的可植入生物医学装置
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
JP2014523633A (ja) 2011-05-27 2014-09-11 エムシー１０ インコーポレイテッド 電子的、光学的、且つ／又は機械的装置及びシステム並びにこれらの装置及びシステムを製造する方法
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
JP6231489B2 (ja) 2011-12-01 2017-11-15 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ プログラム可能な変化を被るように設計された遷移デバイス
KR20150004819A (ko) 2012-03-30 2015-01-13 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 표면에 상응하는 부속체 장착가능한 전자 장치
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9075199B2 (en) 2012-10-30 2015-07-07 Apple Inc. Displays with polarizer layers for electronic devices
BR112017025609A2 (pt) 2015-06-01 2018-08-07 The Board Of Trustees Of The University Of Illinois sistemas eletrônicos miniaturizados com potência sem fio e capacidades de comunicação de campo próximo
JP2018524566A (ja) 2015-06-01 2018-08-30 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 代替的ｕｖセンシング手法
US11532259B2 (en) * 2015-09-25 2022-12-20 Apple Inc. Row driver configuration
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
DE102016112104A1 (de) 2016-07-01 2018-01-04 Osram Opto Semiconductors Gmbh Modulares modul
CN108682305B (zh) * 2018-05-21 2021-04-27 京东方科技集团股份有限公司 柔性基板及其制备方法、和柔性显示装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065227A (en) * 1990-06-04 1991-11-12 International Business Machines Corporation Integrated circuit packaging using flexible substrate
US5111278A (en) * 1991-03-27 1992-05-05 Eichelberger Charles W Three-dimensional multichip module systems
JP3246927B2 (ja) * 1991-09-17 2002-01-15 電気化学工業株式会社 フレキシブルマトリックス回路基板及び表示板
FR2708170B1 (fr) * 1993-07-19 1995-09-08 Innovation Dev Cie Gle Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant.
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5783360A (en) * 1994-04-13 1998-07-21 Flex Products, Inc. Flexible optical medium with dielectric protective overcoat
JP2863094B2 (ja) * 1994-08-05 1999-03-03 矢崎総業株式会社 配線板の接続方法
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
ATE297573T1 (de) * 1995-08-01 2005-06-15 Austria Card Datenträger mit einem einen bauteil aufweisenden modul und mit einer spule und verfahren zum herstellen eines solchen datenträgers
JP3387714B2 (ja) * 1995-12-11 2003-03-17 キヤノン株式会社 電子源とその製造装置及び製造方法及び画像形成装置
JP3900630B2 (ja) * 1997-12-03 2007-04-04 株式会社デンソー リモートｉｄタグ
TW407364B (en) * 1998-03-26 2000-10-01 Toshiba Corp Memory apparatus, card type memory apparatus, and electronic apparatus
JP2000105548A (ja) * 1998-07-31 2000-04-11 Denso Corp 表示パネル用電極基板及びその製造方法
DE19840220A1 (de) * 1998-09-03 2000-04-20 Fraunhofer Ges Forschung Transpondermodul und Verfahren zur Herstellung desselben
DE19846237A1 (de) * 1998-10-07 2000-04-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Mikrotransponders
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
JP2000132657A (ja) * 1998-10-28 2000-05-12 Dainippon Printing Co Ltd Ｉｃカードおよびその製造方法
JP2000286549A (ja) 1999-03-24 2000-10-13 Fujitsu Ltd バイアコネクションを備えた基板の製造方法
WO2001026180A1 (en) 1999-10-04 2001-04-12 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
JP2001242476A (ja) * 2000-02-29 2001-09-07 Seiko Epson Corp 液晶装置及びその製造方法、並びに電子機器
JP4444435B2 (ja) * 2000-03-06 2010-03-31 ソニーケミカル＆インフォメーションデバイス株式会社 プリント配線基板及びプリント配線基板の製造方法
JP4489899B2 (ja) * 2000-03-08 2010-06-23 イビデン株式会社 多層プリント配線板用両面回路基板の製造方法
JP2001313181A (ja) * 2000-05-01 2001-11-09 Sony Corp 表示装置及びその製造方法
JP3597769B2 (ja) * 2000-09-18 2004-12-08 シャープ株式会社 電子部品の製造方法
JP2002108252A (ja) * 2000-09-29 2002-04-10 Sanyo Electric Co Ltd エレクトロルミネセンス表示パネル
ATE430377T1 (de) 2001-02-16 2009-05-15 Ignis Innovation Inc Flexible anzeigevorrichtung
US6693384B1 (en) * 2002-02-01 2004-02-17 Alien Technology Corporation Interconnect structure for electronic devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100974816B1 (ko) * 2008-02-27 2010-08-10 주식회사 비즈모델라인 전자부품에 알에프아이디 태그 내장 방법 및 시스템과 이를위한 기록매체

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US20050181641A1 (en) 2005-08-18
EP1497865A2 (en) 2005-01-19
WO2003092073A2 (en) 2003-11-06
WO2003092073A3 (en) 2004-05-27
CN1659702A (zh) 2005-08-24
JP2005524109A (ja) 2005-08-11
AU2003234184A1 (en) 2003-11-10

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